我们课题组刚毕业的Zheng Ruiqian同学主笔的论文正式发表了，很高兴！他在上个月初到了松山湖接受入职培训，将在终端业务部从事智能终端可靠性技术研发，正好全面发挥其硕士学位论文优势，促进信息通信产业技术进步。

我把Elsevier出版商给出的免费下载全文的信息和链接报送各位博友，但愿能对大家有一些启发和助益。欢迎大家批评指正，从而使得这个工作更上一层楼，助推集成电路产业技术发展！

Title: Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

Reference: MR_115473 (Microelectronics Reliability 160 (2024) 115473)

Dear Professor Jia,

We are pleased to let you know that the final version of your article Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints is now available online, containing full bibliographic details. Are you ready to share it with the world?

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