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在电子封装技术国际会议(ICEPT)发表了7篇论文

已有 237 次阅读 2024-8-10 10:41 |个人分类:未分类|系统分类:科研笔记

我们课题组一行9人参加了在天津市召开的第25届电子封装技术国际会议(ICEPT)，发表了7篇论文，基本信息如下：

会议论文317. New Homogenization Method for Equivalent Thermal Expansion Coefficient of Wiring Structures Using Embedded Unit Cells

Zhiyan Zhao, Guoshun Wan and Yuxi Jia

会议论文331. Efficient and Accurate Calculation of Equivalent Thermal Conductivity of Wiring Structures in Mesoscopic Scale and Intelligent Prediction

Hao Zheng, Zhiyan Zhao, Guoshun Wan, Mengxuan Cheng, Wen Qiao, Ruiqian Zheng and Yuxi Jia

会议论文251. Efficient Prediction of Equivalent Thermo-Mechanical Properties for Embedded Unit Cells in Reliability Simulations of Complex Circuit Wiring Structures Using a Transformer-CNN Model

Wen Qiao, Zhiyan Zhao, Guoshun Wan, Hao Zheng, Wenqian Li, Mengxuan Cheng, Xiaohui Zhao and Yuxi Jia

会议论文252. New Equivalent Approach and Optimized Strategy for Evaluating Warpage Characteristics in PCB Milling Process

Mengxuan Cheng, Guoshun Wan and Yuxi Jia

会议论文260. Cross-scale Finite Element Analysis of PCBA Reflow Soldering Processes

Ruiqian Zheng, Wenqian Li, Mengxuan Cheng, Nan Sheng, Hao Zheng, Chong Wang, Guoxiang Miao and Yuxi Jia

会议论文248. Multi-scale and Multi-process Simulation of Integrated Fan-out Packaging for Reliability Improvement

Xiaohui Zhao, Mengxuan Cheng, Nan Sheng, Zhiyan Zhao, Wenqian Li, Wen Qiao and Yuxi Jia

会议论文263. Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

Wenqian Li, Ruiqian Zheng, Nan Sheng, Xiaohui Zhao, Wen Qiao, Mengxuan Cheng, Zhiyan Zhao and Yuxi Jia

这7篇会议论文连同我们课题组近两年在Microelectronics Reliability期刊上发表的下述4篇论文，构成了适用于集成电路产品的化学反应-热-力多场耦合的可靠性分析的基本理论技术体系。

期刊论文1. Ruiqian Zheng, Wenqian Li, Mengxuan Cheng, Hao Zheng, Zhiyan Zhao, Guoshun Wan, Yuxi Jia. Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints. Microelectronics Reliability, 2024, 160: 115473.

期刊论文2. Guoshun Wan, Qi Dong, Xiaochen Sun, Hao Zheng, Mengxuan Cheng, Wen Qiao, Yuxi Jia. Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics. Microelectronics Reliability, 2024, 157: 115400.

期刊论文3. Guoshun Wan, Qi Dong, Xiaochen Sun, Hao Zheng, Mengxuan Cheng, Zhiyan Zhao, Yuxi Jia. Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect. Microelectronics Reliability, 2024, 154: 115325.

期刊论文4. Guoshun Wan, Qi Dong, Xiaochen Sun, Mengxuan Cheng, Hao Zheng, Zhiyan Zhao, Yuxi Jia. Highly efficient and accurate algorithm for multiscale equivalent modeling and mechanical performance simulation of printed circuit boards. Microelectronics Reliability, 2023, 147: 115134.

更加具体地说，对于具有任意复杂多变的布线和材料特点的任意形状尺寸的集成电路产品，需要高效率、高精度、全自动化地基于细观有限元方法计算任意大小分区的数十万甚至数百万个分区的等效材料性能，期刊论文4、会议论文317和331分别针对力学性能参数、化学收缩系数、热膨胀系数、热导率直接给出了具体的算法和算例。

数十万甚至数百万个分区的各种各样等效材料性能的细观有限元模拟显然是耗时的，因此基于CNN、Transformer-CNN技术的布线结构分区等效材料性能的人工智能预测技术就变得很有必要，期刊论文2、会议论文251直接给出了具体的算法和算例。

在此基础之上，具体研究了服务器主板和笔记本电脑主板的制造、回流组装芯片以及PCBA使役过程的可靠性问题，期刊论文3针对PCB压合成型、期刊论文1针对PCB压合成型/芯片封装/回流组装/PCBA使役疲劳全贯通的过程、会议论文252针对PCB压合成型及其后的铣削加工、会议论文260针对PCB制造及其后的回流组装芯片封装体直接给出了具体的算法和算例。

进一步地，开展了集成电路的晶圆级集成扇出封装WL-InFO、2.5D封装、3D封装的可靠性研究，会议论文248、会议论文263分别针对WL-InFO、2.5D封装（CoWoS - Silicon Interposer）直接给出了具体的算法和算例。因为种种原因，3D封装（HBM 3和HBM 3e）的可靠性研究内容未能参加这次的会议交流，尽管研究进展很大。