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我们课题组在集成电路2.5D先进封装可靠性方面的研究论文 Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components 在 Microelectronics Reliability 期刊上发表了。
Elsevier公司给出了50天内任何人都可以直接免费下载全文的权限。无需登记的链接和免费下载全文信息如下,希望能助推集成电路先进封装可靠性研究,也欢迎大家多提宝贵意见,集思广益,提升集成电路先进封装产业技术水平。
Dear Professor Jia,
We are pleased to let you know that the final version of your article Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components is now available online, containing full bibliographic details. Are you ready to share it with the world?
To help you access and share this work, we have created a Share Link – a personalized URL providing 50 days' free access to your article. Anyone clicking on this link before December 14, 2024 will be taken directly to the final version of your article on ScienceDirect, which they are welcome to read or download. No sign up, registration or fees are required.
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