jyx123321的个人博客分享 http://blog.sciencenet.cn/u/jyx123321 高分子材料/复合材料/物理凝胶 山东大学材料科学与工程学院教授

博文

集成电路先进封装可靠性的研究论文

已有 407 次阅读 2024-10-27 09:17 |个人分类:未分类|系统分类:论文交流

我们课题组在集成电路2.5D先进封装可靠性方面的研究论文 Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components 在 Microelectronics Reliability 期刊上发表了。

Elsevier公司给出了50天内任何人都可以直接免费下载全文的权限。无需登记的链接和免费下载全文信息如下,希望能助推集成电路先进封装可靠性研究,也欢迎大家多提宝贵意见,集思广益,提升集成电路先进封装产业技术水平。

 

Dear Professor Jia,

We are pleased to let you know that the final version of your article Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components is now available online, containing full bibliographic details. Are you ready to share it with the world?

To help you access and share this work, we have created a Share Link – a personalized URL providing 50 days' free access to your article. Anyone clicking on this link before December 14, 2024 will be taken directly to the final version of your article on ScienceDirect, which they are welcome to read or download. No sign up, registration or fees are required.

Your personalized Share Link:

https://authors.elsevier.com/a/1j%7Eu35%7EJAvJWv

 



https://blog.sciencenet.cn/blog-99553-1457153.html

上一篇:机器学习在材料科学中的进展研讨会的报告
收藏 IP: 58.194.168.*| 热度|

3 宁利中 郑永军 杨正瓴

该博文允许注册用户评论 请点击登录 评论 (0 个评论)

数据加载中...

Archiver|手机版|科学网 ( 京ICP备07017567号-12 )

GMT+8, 2024-11-1 09:28

Powered by ScienceNet.cn

Copyright © 2007- 中国科学报社

返回顶部