Tengbo Ma^#, Yongsheng Zhao^#, Kunpeng Ruan, Xirui Liu, Junliang Zhang, Yongqiang Guo, Xutong Yang, Jie Kong and Junwei Gu*. Highly Thermal Conductivities, Excellent Mechanical Robustness and Flexibility, and Outstanding Thermal Stabilities of Aramid Nanofiber Composite Papers with Nacre-Mimetic Layered Structures. ACS Applied Materials & Interfaces, 2020, 12(1): 1677-1686. (SCI: 000507146100171).（1区材料科学Top期刊）ESI高被引论文（2020年第4~6期，2021年第1~6期，2022年第1~2期）

Abstract

Aramid nanofiber (ANF) paper has shown potential applications in flexible electronics. However, its inherent low thermal conductivity coefficient (λ) values might threaten the safety of devices under a high-power working condition. In this work, polydopamine-functionalized boron nitride nanosheet (BNNS@PDA)/ANF thermally conductive composite papers with nacre-mimetic layered structures were prepared via highly efficient vacuum-assisted filtration followed by hot pressing. For a given BNNS loading, the surface functionalization of BNNS could further enhance the thermal conductivities and mechanical properties of BNNS@PDA/ANF composite papers. BNNS@PDA/ANF composite papers presented anisotropic thermal conductivities, and the through-plane (λ_⊥) and in-plane (λ_∥) values of the 50 wt % BNNS@PDA/ANF composite papers reached 0.62 and 3.94 W/mK, 181.8 and 196.2% higher than those of original ANF paper, respectively, which were also higher than those of 50 wt % BNNS/ANF composite papers (λ_⊥ = 0.52 W/mK and λ_∥ = 3.33 W/mK). The tensile strength of the 50 wt % BNNS@PDA/ANF composite papers reached 36.8 MPa, 30.5% higher than that of 50 wt % BNNS/ANF composite papers (28.2 MPa). In addition, the heat resistance index (T_HRI) of the 50 wt % BNNS@PDA/ANF composite papers was further increased to 223.1 °C. Overall, our fabricated BNNS@PDA/ANF composite papers possess highly thermal conductivities, excellent mechanical robustness and flexibility, and outstanding thermal stabilities, showing great potential applications in the fields of intelligent wearable equipment, flexible supercapacitors, and flexible electronics.

以芳纶纳米纤维（ANF）为基体、聚多巴胺（PDA）改性的氮化硼纳米片（BNNS@PDA）为导热填料，通过真空抽滤法制备BNNS@PDA/ANF导热复合纸。结果表明，BNNS@PDA/ANF导热复合纸的面间导热系数（λ⊥）和面内导热系数（λ∥）均随BNNS用量增加而提高。相同BNNS用量下，表面功能化改性有助于进一步提高BNNS/ANF导热复合纸的导热性能和力学性能。当BNNS用量为50 wt%时，BNNS@PDA/ANF导热复合纸的面间导热系数（λ⊥）和面内导热系数（λ∥）分别达到0.62 W/mK和3.94 W/mK，均分别高于相同BNNS用量（50 wt%）的BNNS/ANF导热复合纸的λ⊥（0.52 W/mK）和λ∥（3.33 W/mK），并较纯ANF纸的λ⊥（0.22 W/mK）和λ∥（1.33 W/mK）分别提高了181.8%和196.2%；同时，BNNS@PDA/ANF导热复合纸的拉伸强度为36.8 MPa，比相同BNNS用量（50 wt%）BNNS/ANF导热复合纸（28.2 MPa）提高了30.3%。另外，BNNS@PDA/ANF复合纸具有优异的热稳定性（最大热分解温度 Tmax>500℃）。本文制备的BNNS@PDA/ANF导热复合纸具有良好的导热性能、理想的力学性能和优异热稳定性，在柔性可穿戴设备、电子产品等领域具有潜在的应用价值。

论文下载：Highly Thermal Conductivities, Excellent Mechanical Robustness and Flexibility, .pdf

论文链接：https://doi.org/10.1021/acsami.9b19844

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