在刚结束的第 27 届电子封装技术国际会议 ---2026 27th International Conference on Electronic Packaging Technology (ICEPT) 上，我们团队的论文 Research on Warpage Evolution Mechanism and Key Influencing Factors of HDI PCBs in Multiple Lamination Processes 被选为 Outstanding Paper ...
Title: A novel partitioned homogenization approach for rapid and accurate vibration analysis of printed circuit boards Dear Professor Jia, We are pleased to let you know that the final version of your article A novel partitioned homogenization approach for rapid and accurate vibration analys ...
Title: Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model Reference: MR_115903 Dear Professor Jia, We are pleased to let you know that the final version of your article “Accurate and efficient simulation of PCB warpage durin ...
我们课题组在集成电路 2.5D 先进封装可靠性方面的研究论文 Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components 在 Microelectronics Reliability 期刊上发表了。 Elsevier 公司给出了 50 ...
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