期刊简介

Chips (ISSN 2674-0729) 创刊于2022年，是一个国际性、经同行评审的开放获取期刊。期刊聚焦芯片领域，专注于芯片的设计，制造，以及相关的应用等方面。目前，Chips 期刊已被Scopus等数据库收录。

Time to First Decision：22.4 Days

Acceptance to Publication：5.7 Days

• 期刊Scope

芯片设计；

芯片制造；

芯片的应用。

• 期刊主编

Prof. Dr. Gaetano Palumbo

Università di Catania, Italy

• 精选文章

1. Review of Industrialization Development of Nanoimprint Lithography Technology

纳米压印光刻技术产业化发展综述

Yuanxun Cao et al.

https://doi.org/10.3390/chips4010010

2. Oxygen Vacancy Engineering and Its Impact on Resistive Switching of Oxide Thin Films for Memory and Neuromorphic Applications

氧空位工程及其对用于记忆和神经形态应用的氧化物薄膜电阻开关的影响

Biswajit Jana and Ayan Roy Chaudhuri

3. Radiation-Induced Effects on Semiconductor Devices: A Brief Review on Single-Event Effects, Their Dynamics, and Reliability Impacts

半导体器件的辐射诱导效应：单事件效应、动力学和可靠性影响综述

Vitor A. P. Aguiar, Saulo G. Alberton and Matheus S. Pereira

https://doi.org/10.3390/chips4010012

4. Slew-Rate Enhancement Techniques for Switched-Capacitors Fast-Settling Amplifiers: A Review

开关电容快速稳定放大器的转换速率增强技术综述

Michele Dei, Francesco Gagliardi and Paolo Bruschi

5. A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors

高动态范围CMOS图像传感器研究进展

Jingyang Chen et al.

https://doi.org/10.3390/chips4010008

• 特刊推荐

Design and Implementation of Reconfigurable Optoelectronic Integrated Chips

客座编辑： Dr. Jiyuan Zheng

投稿截止日期：31 October 2026

https://www.mdpi.com/journal/chips/special_issues/2BZJY3C2D9

Emerging Issues in Hardware and IC System Security

客座编辑： Dr. Zain Ul Abideen

投稿截止日期：30 Novermber 2026

https://www.mdpi.com/journal/chips/special_issues/O7D8VG4U0E

Advances in Power Management Integrated Circuits (PMICs)

客座编辑：Dr. Zhanghao Yu

投稿截止日期：30 Novermber 2026

https://www.mdpi.com/journal/chips/special_issues/Y1LV82GI8K

Neuromorphic Chips at the Intersection of Neuroscience, Electronics and AI

客座编辑： Dr. Liangshun Wu and Dr. Pak Kwong Chan

投稿截止日期：31 December 2026

https://www.mdpi.com/journal/chips/special_issues/W2SY1TIV5V

High-Performance Packaging Substrates for Chiplet Integration: Materials, Process and Reliability

客座编辑： Dr. Shanjun Ding

投稿截止日期：31 December 2026

https://www.mdpi.com/journal/chips/special_issues/X3TIHA2M68

• 作者指南

如您对投稿有任何疑问，欢迎阅读作者指南，或联系Chips 期刊编辑部 (chips@mdpi.com)。

https://www.mdpi.com/journal/chips/instructions