jyx123321的个人博客分享 http://blog.sciencenet.cn/u/jyx123321 高分子材料/复合材料/物理凝胶 山东大学材料科学与工程学院教授

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芯片封装和PCB组合体的热循环可靠性的跨尺度有限元分析

已有 1054 次阅读 2024-8-1 10:40 |个人分类:未分类|系统分类:科研笔记

我们课题组刚毕业的Zheng Ruiqian同学主笔的论文正式发表了,很高兴!他在上个月初到了松山湖接受入职培训,将在终端业务部从事智能终端可靠性技术研发,正好全面发挥其硕士学位论文优势,促进信息通信产业技术进步。

我把Elsevier出版商给出的免费下载全文的信息和链接报送各位博友,但愿能对大家有一些启发和助益。欢迎大家批评指正,从而使得这个工作更上一层楼,助推集成电路产业技术发展!

Title: Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

Reference: MR_115473 (Microelectronics Reliability 160 (2024) 115473)

Dear Professor Jia,

We are pleased to let you know that the final version of your article Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints is now available online, containing full bibliographic details. Are you ready to share it with the world?

To help you access and share this work, we have created a Share Link – a personalized URL providing 50 days' free access to your article. Anyone clicking on this link before September 20, 2024 will be taken directly to the final version of your article on ScienceDirect, which they are welcome to read or download. No sign up, registration or fees are required.

Your personalized Share Link:

https://authors.elsevier.com/a/1jWmv5%7EJAvJO1

We encourage you to use this Share Link to download a copy of the article for your own archive. The URL is also a quick and easy way to share your work with colleagues, co-authors and friends. And you are welcome to add the Share Link to your homepage or social media profiles, such as Facebook and Twitter.

 



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