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陈立新专利报告分享 http://blog.sciencenet.cn/u/feixiangfeixian 中美欧日韩五局及PCT专利数据统计分析报告 陈立新 Tel13592308169 QQ86065045

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2021年应用材料公司的PCT国际专利申请状况——重点布局半导体制造、材料化学与纳米、电气元件和结构部件技术

已有 1388 次阅读 2022-12-7 18:03 |系统分类:博客资讯

陈立新 张琳 黄颖：中美欧日韩五局专利报告3200.doc

█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖

微信号：13592308169

附录2  2021年PCT国际专利申请统计分析报告

附录2.8 世界主要机构的PCT国际专利申请状况

附录2.8.36 应用材料公司的PCT国际专利申请状况

2021年，应用材料公司（APPLIED MATERIALS, INC）申请PCT国际专利571项，是申请数量第36多的机构。可见应用材料公司非常重视国际市场。

相对来讲，应用材料公司在PCT国际专利申请上的优势领域是：半导体制造、材料化学与纳米、半导体元件、电气元件和结构部件、光学和摄影。在这5个技术领域上，应用材料公司的申请份额相对较高，分别占同领域PCT国际专利申请数量的9.9%至0.6%。

从PCT国际专利申请的数量上来看，应用材料公司重点布局的技术领域是：半导体制造、材料化学与纳米、电气元件和结构部件、光学和摄影、半导体元件。在这5个领域上其申请了数量较多的专利，为185至40项。

可见，应用材料公司在PCT国际专利申请上的布局重点是半导体制造技术。

 

附表2.8.36-1  2021年应用材料公司主要技术领域的PCT专利申请分布


技术领域

专利数量

占比（%）

1

半导体制造

185

9.9%

2

材料化学与纳米

117

1.8%

3

半导体元件

40

1.4%

4

电气元件和结构部件

80

1.1%

5

光学和摄影

43

0.6%

6

半导体零配件

5

0.5%

7

半导体组件与集成电路

13

0.5%

8

电热与等离子体

4

0.3%

9

成型加工作业

34

0.3%

10

材料测试

13

0.2%

11

物理测量

8

0.2%

12

信息存储

1

0.1%

13

基本电子电路

1

0.1%

14

分离和混合加工作业

4

0.1%

15

图像处理

2

0.1%

16

发动机和泵

2

0.0%

17

光电辐射测量与核物理

2

0.0%

18

物理信号和控制

2

0.0%

19

计算机体系架构

1

0.0%

20

一般机械和武器

2

0.0%

注：占比（%）指其在某领域上的专利申请数量占该领域的比例，按IPC主分类号统计。

 

                                               

附图2.8.36-1  2021年应用材料公司在20个相对优势领域上的PCT专利申请占比

 

 

 

 

 

致谢

感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。

如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。

微信号：13592308169

image.png

 

附表  2021年该机构PCT国际专利申请

 

IDAppl.NoTitleApplicant
WO/2021/050052US2019/050456HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATIONAPPLIED MATERIALS, INC.
WO/2021/050168US2020/043833METHODS FOR FORMING A PROTECTIVE COATING ON PROCESSING CHAMBER SURFACES  OR COMPONENTSAPPLIED MATERIALS, INC.
WO/2021/050180US2020/045212APPARATUS AND TECHNIQUES FOR ION ENERGY MEASUREMENT IN PULSED ION BEAMSAPPLIED MATERIALS, INC.
WO/2021/050206US2020/046625THERMALLY ISOLATED REPELLER AND ELECTRODESAPPLIED MATERIALS, INC.
WO/2021/050258US2020/047750MEASUREMENT SYSTEM AND GRATING PATTERN ARRAYAPPLIED MATERIALS, INC.
WO/2021/050300US2020/048554HIGH QUALITY FACTOR EMBEDDED RESONATOR WAFERSAPPLIED MATERIALS, INC.
WO/2021/050308US2020/048697REPULSION MESH AND DEPOSITION METHODSAPPLIED MATERIALS, INC.
WO/2021/050386US2020/049464SEMICONDUCTOR PROCESSING CHAMBERAPPLIED MATERIALS, INC.
WO/2021/050395US2020/049561VAPOR DELIVERY METHODS AND APPARATUSAPPLIED MATERIALS, INC.
WO/2021/050489US2020/049853PROCESSING SYSTEM AND METHOD OF DELIVERING A REACTANT GASAPPLIED MATERIALS, INC.
WO/2021/050761US2020/050243ADDITIVE MANUFACTURING OF POLISHING PADSAPPLIED MATERIALS, INC.
WO/2021/050771US2020/050253COMPOSITIONS AND METHODS OF ADDITIVE MANUFACTURING OF POLISHING PADSAPPLIED MATERIALS, INC.
WO/2021/040707US2019/048619METHODS OF TUNING TO IMPROVE PLASMA STABILITYAPPLIED MATERIALS, INC.
WO/2021/040860US2020/038595NITROGEN-RICH SILICON NITRIDE FILMS FOR THIN FILM TRANSISTORSAPPLIED MATERIALS, INC.
WO/2021/040943US2020/043879APPARATUS FOR DIRECTIONAL PROCESSINGAPPLIED MATERIALS, INC.
WO/2021/041002US2020/045409SEMICONDUCTOR PROCESSING APPARATUS WITH IMPROVED UNIFORMITYAPPLIED MATERIALS, INC.
WO/2021/041076US2020/046659ELECTRON BEAM PVD ENDPOINT DETECTION AND CLOSED-LOOP PROCESS CONTROL  SYSTEMSAPPLIED MATERIALS, INC.
WO/2021/041100US2020/046934MULTI-TONE SCHEME FOR MASKLESS LITHOGRAPHYAPPLIED MATERIALS, INC.
WO/2021/041240US2020/047478CARRIER HEAD WITH SEGMENTED SUBSTRATE CHUCKAPPLIED MATERIALS, INC.
WO/2021/041369US2020/047728LOW-K FILMSAPPLIED MATERIALS, INC.
WO/2021/041413US2020/047801CHEMICAL MECHANICAL POLISHING CORRECTION TOOLAPPLIED MATERIALS, INC.
WO/2021/041417US2020/047806ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADINGAPPLIED MATERIALS, INC.
WO/2021/041593US2020/048081SELECTIVE COBALT DEPOSITION ON COPPER SURFACESAPPLIED MATERIALS, INC.
WO/2021/041673US2020/048196VAPOR PHASE COATING TECHNOLOGY FOR PHARMACEUTICAL ABUSE DETERRENT  FORMULATIONSAPPLIED MATERIALS, INC.
WO/2021/041675US2020/048198VAPOR PHASE COATINGS FOR PHARMACEUTICAL SOLUBILITY CONTROLAPPLIED MATERIALS, INC.
WO/2021/041750US2020/048302HIGH CONDUCTANCE INNER SHIELD FOR PROCESS CHAMBERAPPLIED MATERIALS, INC.
WO/2021/041751US2020/048303HIGH CONDUCTANCE LOWER SHIELD FOR PROCESS CHAMBERAPPLIED MATERIALS, INC.
WO/2021/041832US2020/048438METHODS AND APPARATUS FOR CLEANING METAL CONTACTSAPPLIED MATERIALS, INC.
WO/2021/013326EP2019/069587EVAPORATION SOURCE, VACUUM DEPOSITION SYSTEM, VALVE ASSEMBLY, AND METHOD  THEREFORAPPLIED MATERIALS, INC.
WO/2021/013327EP2019/069590EVAPORATION SOURCE, DEPOSITION SYSTEM, AND EVAPORATION METHODAPPLIED MATERIALS, INC.
WO/2021/013328EP2019/069591EVAPORATION SOURCE FOR DEPOSITING AN EVAPORATED MATERIAL ON A SUBSTRATE,  VACUUM DEPOSITION SYSTEM, AND METHOD THEREFORAPPLIED MATERIALS, INC.
WO/2021/013358EP2019/070109SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A VERTICAL  ORIENTATIONAPPLIED MATERIALS, INC.
WO/2021/013359EP2019/070110SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A VERTICAL  ORIENTATIONAPPLIED MATERIALS, INC.
WO/2021/013361EP2019/070113SUBSTRATE PROCESSING SYSTEM FOR PROCESSING OF A PLURALITY OF SUBSTRATES  AND METHOD OF PROCESSING A SUBSTRATE IN AN IN-LINE SUBSTRATE PROCESSING  SYSTEMAPPLIED MATERIALS, INC.
WO/2021/015833US2020/029099METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTSAPPLIED MATERIALS, INC.
WO/2021/015895US2020/038168VERTICAL TRANSISTOR FABRICATION FOR MEMORY APPLICATIONSAPPLIED MATERIALS, INC.
WO/2021/016063US2020/042473SURFACE ROUGHNESS FOR FLOWABLE CVD FILMAPPLIED MATERIALS, INC.
WO/2021/016115US2020/042632MULTI-OBJECT CAPABLE LOADLOCK SYSTEMAPPLIED MATERIALS, INC.
WO/2021/016538US2020/043447PRESSURE REGULATED FLOW CONTROLLERAPPLIED MATERIALS, INC.
WO/2021/010952US2019/041759LARGE-AREA HIGH DENSITY PLASMA PROCESSING CHAMBER FOR FLAT PANEL DISPLAYSAPPLIED MATERIALS, INC.
WO/2021/010966US2019/041828MEASUREMENT ASSEMBLY FOR MEASURING A DEPOSITION RATE, METHOD OF MEASURING  A DEPOSITION RATE, DEPOSITION SOURCE, AND DEPOSITION APPARATUSAPPLIED MATERIALS, INC.
WO/2021/011109US2020/036278HEAT SHIELD ASSEMBLY FOR AN EPITAXY CHAMBERAPPLIED MATERIALS, INC.
WO/2021/011144US2020/038347MAGNETIC TUNNEL JUNCTION STACK WITH DATA RETENTIONAPPLIED MATERIALS, INC.
WO/2021/011156US2020/039159HIGH-CURRENT ION IMPLANTER AND METHOD FOR CONTROLLING ION BEAM USING  HIGH-CURRENT ION IMPLANTERAPPLIED MATERIALS, INC.
WO/2021/011166US2020/039508METHODS AND APPARATUS FOR POST EXPOSURE PROCESSINGAPPLIED MATERIALS, INC.
WO/2021/011229US2020/040994ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFERAPPLIED MATERIALS, INC.
WO/2021/011233US2020/041015ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFERAPPLIED MATERIALS, INC.
WO/2021/011246US2020/041103ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFERAPPLIED MATERIALS, INC.
WO/2021/011253US2020/041156ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFERAPPLIED MATERIALS, INC.
WO/2021/011254US2020/041157HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODSAPPLIED MATERIALS, INC.
WO/2021/011261US2020/041202MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/011756US2020/042297EM SOURCE FOR ENHANCED PLASMA CONTROLAPPLIED MATERIALS, INC.
WO/2021/011910US2020/042640MULTI-ZONE HEATER MODEL-BASED CONTROL IN SEMICONDUCTOR MANUFACTURINGAPPLIED MATERIALS, INC.
WO/2021/043411EP2019/073758MAGNETIC GUIDE FOR GUIDING A CARRIER, TRANSPORT SYSTEM FOR TRANSPORTING A  CARRIER, AND METHOD OF GUIDING A CARRIERAPPLIED MATERIALS, INC.
WO/2021/045841US2020/041382METHODS FOR FORMING PROTECTIVE COATINGS CONTAINING CRYSTALLIZED ALUMINUM  OXIDEAPPLIED MATERIALS, INC.
WO/2021/045873US2020/045748SYSTEM AND METHOD FOR IMPROVED BEAM CURRENT FROM AN ION SOURCEAPPLIED MATERIALS, INC.
WO/2021/045874US2020/045749SYSTEM AND METHOD FOR IMPROVED BEAM CURRENT FROM AN ION SOURCEAPPLIED MATERIALS, INC.
WO/2021/045991US2020/048752METHODS AND APPARATUS FOR DYNAMICAL CONTROL OF RADIAL UNIFORMITY WITH  TWO-STORY MICROWAVE CAVITIESAPPLIED MATERIALS, INC.
WO/2021/046208US2020/049184SHUTTER DISKAPPLIED MATERIALS, INC.
WO/2021/046212US2020/049191INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESSAPPLIED MATERIALS, INC.
WO/2021/046301US2020/049332COMMON ELECTROSTATIC CHUCK FOR DIFFERING SUBSTRATESAPPLIED MATERIALS, INC.
WO/2021/034354US2020/030741METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE USING NON-CONTACT  TEMPERATURE MEASUREMENTAPPLIED MATERIALS, INC.
WO/2021/034355US2020/031265METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE USING MICROWAVE ENERGYAPPLIED MATERIALS, INC.
WO/2021/034595US2020/046136HEATED SUBSTRATE SUPPORT WITH THERMAL BAFFLESAPPLIED MATERIALS, INC.
WO/2021/034614US2020/046203SYMMETRIC FLOW VALVE FOR HIGHER FLOW CONDUCTANCEAPPLIED MATERIALS, INC.
WO/2021/034698US2020/046470TUNEABLE UNIFORMITY CONTROL UTILIZING ROTATIONAL MAGNETIC HOUSINGAPPLIED MATERIALS, INC.
WO/2021/034736US2020/046591METHODS AND APPARATUS FOR PHYSICAL VAPOR DEPOSITION (PVD) DIELECTRIC  DEPOSITIONAPPLIED MATERIALS, INC.
WO/2021/034738US2020/046593METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHANICAL  PLANARIZATION IN WAFER-LEVEL PACKAGING APPLICATIONSAPPLIED MATERIALS, INC.
WO/2021/034818US2020/046783METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTIONAPPLIED MATERIALS, INC.
WO/2021/034849US2020/046840ADDITIVE MANUFACTURING OF POLISHING PADSAPPLIED MATERIALS, INC.
WO/2021/034854US2020/046852CALIBRATION OF AN ALIGNER STATION OF A PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/034857US2020/046855MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINERAPPLIED MATERIALS, INC.
WO/2021/034885US2020/046913METHODS AND APPARATUS FOR CONTROLLING RF PARAMETERS AT MULTIPLE  FREQUENCIESAPPLIED MATERIALS, INC.
WO/2021/035077US2020/047252POLISHING HEAD WITH MEMBRANE POSITION CONTROLAPPLIED MATERIALS, INC.
WO/2021/035080US2020/047256DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHINGAPPLIED MATERIALS, INC.
WO/2021/025809US2020/040220PEDESTAL WITH MULTI-ZONE HEATINGAPPLIED MATERIALS, INC.
WO/2021/025819US2020/041172METHODS FOR DETECTION USING OPTICAL EMISSION SPECTROSCOPYAPPLIED MATERIALS, INC.
WO/2021/025849US2020/042582COATING FOR CHAMBER PARTICLE REDUCTIONAPPLIED MATERIALS, INC.
WO/2021/025891US2020/043796RECONFIGURABLE FINFET-BASED ARTIFICIAL NEURON AND SYNAPSE DEVICESAPPLIED MATERIALS, INC.
WO/2021/025907US2020/043932METHOD OF PROCESSING DRAMAPPLIED MATERIALS, INC.
WO/2021/025913US2020/043982RADIO FREQUENCY POWER RETURN PATHAPPLIED MATERIALS, INC.
WO/2021/025920US2020/044028HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM  LASER SCRIBING PROCESS AND PLASMA ETCH PROCESSAPPLIED MATERIALS, INC.
WO/2021/025971US2020/044385PHYSICAL VAPOR DEPOSITION CHAMBER CLEANING PROCESSESAPPLIED MATERIALS, INC.
WO/2021/026056US2020/044712EUV MASK BLANKS AND METHODS OF MANUFACTUREAPPLIED MATERIALS, INC.
WO/2021/026283US2020/045087MODIFIED STACKS FOR 3D NANDAPPLIED MATERIALS, INC.
WO/2021/052591EP2019/075243EVAPORATION SOURCE, EVAPORATION SYSTEM, AND EVAPORATION METHODAPPLIED MATERIALS, INC.
WO/2021/052592EP2019/075245METHOD OF OPERATING AN EVAPORATION SOURCE, EVAPORATION SYSTEM, AND SHIELD  HANDLING APPARATUSAPPLIED MATERIALS, INC.
WO/2021/052593EP2019/075247EVAPORATION SOURCE, SHUTTER DEVICE, AND EVAPORATION METHODAPPLIED MATERIALS, INC.
WO/2021/052595EP2019/075250METHOD OF OPERATING AN EVAPORATION SOURCE, EVAPORATION SYSTEM, AND SHIELD  HANDLING APPARATUSAPPLIED MATERIALS, INC.
WO/2021/055115US2020/045232ELECTROSTATIC FILTER WITH SHAPED ELECTRODESAPPLIED MATERIALS, INC.
WO/2021/055134US2020/047244CRYOGENIC ELECTROSTATIC CHUCKAPPLIED MATERIALS, INC.
WO/2021/055166US2020/048987ATOMIC LAYER ETCHING OF METALSAPPLIED MATERIALS, INC.
WO/2021/055755US2020/051502SEAMLESS GAPFILL WITH DIELECTRIC ALD FILMSAPPLIED MATERIALS, INC.
WO/2021/055761US2020/051509METHODS FOR ATOMIC LAYER DEPOSITION OF SICO(N) USING HALOGENATED  SILYLAMIDESAPPLIED MATERIALS, INC.
WO/2021/055762US2020/051510DITHERING OR DYNAMIC OFFSETS FOR IMPROVED UNIFORMITYAPPLIED MATERIALS, INC.
WO/2021/055763US2020/051511IN-SITU DC PLASMA FOR CLEANING PEDESTAL HEATERAPPLIED MATERIALS, INC.
WO/2021/055766US2020/051514CLEAN ISOLATION VALVE FOR REDUCED DEAD VOLUMEAPPLIED MATERIALS, INC.
WO/2021/055768US2020/051517APPARATUS AND METHODS FOR MOTOR SHAFT AND HEATER LEVELINGAPPLIED MATERIALS, INC.
WO/2021/055771US2020/051521METHODS FOR CONTROLLING PULSE SHAPE IN ALD PROCESSESAPPLIED MATERIALS, INC.
WO/2021/055780US2020/051537PEALD NITRIDE FILMSAPPLIED MATERIALS, INC.
WO/2021/055918US2020/051719METHODS AND APPARATUS FOR DEPOSITING DIELECTRIC MATERIALAPPLIED MATERIALS, INC.
WO/2021/055990US2020/051967ALD CYCLE TIME REDUCTION USING PROCESS CHAMBER LID WITH TUNABLE PUMPINGAPPLIED MATERIALS, INC.
WO/2021/055991US2020/051969MULTI-WAFER VOLUME SINGLE TRANSFER CHAMBER FACETAPPLIED MATERIALS, INC.
WO/2021/055993US2020/052001LOW TEMPERATURE THERMAL FLOW RATIO CONTROLLERAPPLIED MATERIALS, INC.
WO/2021/021265US2020/031809ANISOTROPIC EPITAXIAL GROWTHAPPLIED MATERIALS, INC.
WO/2021/021279US2020/035751DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTSAPPLIED MATERIALS, INC.
WO/2021/021340US2020/038499CARRIER FOUP AND A METHOD OF PLACING A CARRIERAPPLIED MATERIALS, INC.
WO/2021/021342US2020/038955METHOD OF PRE ALIGNING CARRIER, WAFER AND CARRIER-WAFER COMBINATION FOR  THROUGHPUT EFFICIENCYAPPLIED MATERIALS, INC.
WO/2021/021343US2020/039093ADDITIVE PATTERNING OF SEMICONDUCTOR FILM STACKSAPPLIED MATERIALS, INC.
WO/2021/021344US2020/039168LOW EMISSION IMPLANTATION MASK AND SUBSTRATE ASSEMBLYAPPLIED MATERIALS, INC.
WO/2021/021345US2020/039179APPARATUS AND SYSTEM HAVING EXTRACTION ASSEMBLY FOR WIDE ANGLE ION BEAMAPPLIED MATERIALS, INC.
WO/2021/021351US2020/039782SUBSTRATE PROCESSING MONITORINGAPPLIED MATERIALS, INC.
WO/2021/021356US2020/040135METHODS FOR REPAIRING A RECESS OF A CHAMBER COMPONENTAPPLIED MATERIALS, INC.
WO/2021/021357US2020/040160TEMPERATURE PROFILE MEASUREMENT AND SYNCHRONIZED CONTROL ON SUBSTRATE AND  SUSCEPTOR IN AN EPITAXY CHAMBERAPPLIED MATERIALS, INC.
WO/2021/021377US2020/040431SYSTEM AND METHOD FOR ELECTROSTATICALLY CHUCKING A SUBSTRATE TO A CARRIERAPPLIED MATERIALS, INC.
WO/2021/021381US2020/040535ARSENIC DIFFUSION PROFILE ENGINEERING FOR TRANSISTORSAPPLIED MATERIALS, INC.
WO/2021/021403US2020/041155EVAPORATOR CHAMBER FOR FORMING FILMS ON SUBSTRATESAPPLIED MATERIALS, INC.
WO/2021/021405US2020/041193SYSTEM FOR DETERMINING CLEANING PROCESS ENDPOINTAPPLIED MATERIALS, INC.
WO/2021/021415US2020/041515MICRO-LED AND MICRO-LED MANUFACTURING METHODAPPLIED MATERIALS, INC.
WO/2021/021496US2020/042920LOW CONTACT AREA SUBSTRATE SUPPORT FOR ETCHING CHAMBERAPPLIED MATERIALS, INC.
WO/2021/021504US2020/042968ISOLATION VALVEAPPLIED MATERIALS, INC.
WO/2021/021513US2020/043048SEMICONDUCTOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKINGAPPLIED MATERIALS, INC.
WO/2021/021518US2020/043082SEMICONDUCTOR PROCESSING CHAMBER AND METHODS FOR CLEANING THE SAMEAPPLIED MATERIALS, INC.
WO/2021/021537US2020/043174METHODS AND APPARATUS FOR DUAL CHANNEL SHOWERHEADSAPPLIED MATERIALS, INC.
WO/2021/021542US2020/043197SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAMEAPPLIED MATERIALS, INC.
WO/2021/021565US2020/043281METHODS AND APPARATUS FOR CALIBRATING CONCENTRATION SENSORS FOR PRECURSOR  DELIVERYAPPLIED MATERIALS, INC.
WO/2021/021822US2020/043897A CORROSION RESISTANT FILM ON A CHAMBER COMPONENT AND METHODS OF  DEPOSITING THEREOFAPPLIED MATERIALS, INC.
WO/2021/021827US2020/043902DETECTION OF SURFACE PARTICLES OF CHAMBER COMPONENTS WITH CARBON DIOXIDEAPPLIED MATERIALS, INC.
WO/2021/021831US2020/043910SHEATH AND TEMPERATURE CONTROL OF PROCESS KITAPPLIED MATERIALS, INC.
WO/2021/021863US2020/043965MULTILAYER ENCAPSULATION STACKS BY ATOMIC LAYER DEPOSITIONAPPLIED MATERIALS, INC.
WO/2021/022016US2020/044214METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTIONAPPLIED MATERIALS, INC.
WO/2021/028010EP2019/071493METHOD OF COATING A SUBSTRATE AND COATING APPARATUS FOR COATING A  SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/028043EP2019/071839PATH SWITCH ASSEMBLY, CHAMBER AND SUBSTRATE PROCESSING SYSTEM HAVING THE  SAME, AND METHODS THEREFORAPPLIED MATERIALS, INC.
WO/2021/029970US2020/038873PROTECTIVE MULTILAYER COATING FOR PROCESSING CHAMBER COMPONENTSAPPLIED MATERIALS, INC.
WO/2021/030070US2020/044330HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM LASER  SCRIBING PROCESS AND PLASMA ETCH PROCESSAPPLIED MATERIALS, INC.
WO/2021/030074US2020/044422METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATIONAPPLIED MATERIALS, INC.
WO/2021/030081US2020/044623HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SCRIBING  PROCESS AND PLASMA ETCH PROCESSAPPLIED MATERIALS, INC.
WO/2021/030295US2020/045667APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROLAPPLIED MATERIALS, INC.
WO/2021/030309US2020/045698LOW-K DIELECTRIC FILMSAPPLIED MATERIALS, INC.
WO/2021/030310US2020/045699NON-CONFORMAL HIGH SELECTIVITY FILM FOR ETCH CRITICAL DIMENSION CONTROLAPPLIED MATERIALS, INC.
WO/2021/030327US2020/045730MOLYBDENUM THIN FILMS BY OXIDATION-REDUCTIONAPPLIED MATERIALS, INC.
WO/2021/030332US2020/045741PEALD TITANIUM NITRIDE WITH DIRECT MICROWAVE PLASMAAPPLIED MATERIALS, INC.
WO/2021/030351US2020/045771LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND  IMPROVING PAD ASPERITYAPPLIED MATERIALS, INC.
WO/2021/030356US2020/045780SLURRY TEMPERATURE CONTROL BY MIXING AT DISPENSINGAPPLIED MATERIALS, INC.
WO/2021/030445US2020/045947CHAMBER CONFIGURATIONS FOR CONTROLLED DEPOSITIONAPPLIED MATERIALS, INC.
WO/2021/096530US2019/061731PRESERVING HIERARCHICAL STRUCTURE INFORMATION WITHIN A DESIGN FILEAPPLIED MATERIALS, INC.
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