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Finite-Element Analysis of Current-Induced Thermal Stress
热度 1 刘明 2011-12-25 03:23
http://www.springerlink.com/content/a511055413620019/ Understanding the electrothermal-mechanical behavior of electronic interconnects is of practical importance in improving the structural reliability of electronic devices. In this work, we use the finite-element method to analyze ...
个人分类: Paper|2936 次阅读|3 个评论 热度 1

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