ISSCC是集成电路领域发展趋势的风向标。光电融合的发展趋势在今年的ISSCC会议得到了充分的体现。台积电的大会主旨报告多次提到了光互连的必然发展趋势及其对于整个产业的意义。今年大会所颁发的2023 Lewis Winner杰出论文奖均授予了光电融合相关研究。NVIDIA, Intel, AMD, UC Berkeley, Caltech, UCSB等头部企业和学校均投入了该领域的研究。今年ISSCC光电融合相关报告列表如下。

1) 2023 Lewis Winner Award for Outstanding Paper

两篇获奖论文均授予了来自加州理工学院的研究人员。

“Subtractive Photonic Waveguide-Coupled Photodetectors in 180nm Bulk CMOS” , Craig Ives, Ali Hajimiri, California Institute of Technology, Pasadena, CA

“A 65nm CMOS Living-Cell Dynamic Fluorescence Sensor with 1.05fA Sensitivity at 600/700nm Wavelengths” Fatemeh Aghlmand1, Chelsea Hu1,2, Saransh Sharma1, Krishna K. Pochana1, Richard M. Murray1, Azita Emami1, 1California Institute of Technology, Pasadena, CA; 2Texas A&M University, College Station, TX  

2) 1.1 Semiconductor Industry: Present & Future

三次提到This is the future。硅光/光电融合是我们的未来。 

3) 6.7 A 160×120 Flash LiDAR Sensor with Fully Analog-Assisted In-Pixel Histogramming TDC Based on Self-Referenced SAR ADC

来自韩国蔚山国立科技研究所的快闪式激光雷达传感器工作。

4) 6.9 A 0.35V 0.367TOPS/W Image Sensor with 3-Layer Optical-Electronic Hybrid Convolutional Neural Network

清华大学光电混合计算方面的工作。

5) 6.11 A 320x240 CMOS LiDAR Sensor with 6-Transistor nMOS-Only SPAD Analog Front-End and Area-Efficient Priority Histogram Memory

来自韩国成均馆大学的CMOS激光雷达传感器工作。

6) 12.1 Monolithically Integrated Sub-63 fJ/b 8-Channel 256Gb/s Optical Transmitter with Autonomous Wavelength Locking in 45nm CMOS SOI

宾夕法尼亚大学微环发射机方面的工作。

7) 17.3  A Fully Wireless, Miniaturized, Multicolor Fluorescence Image Sensor Implant for Real-Time Monitoring in Cancer Therapy

UC Berkeley多色荧光实时成像的工作。

8) 18.2 A 4×64Gb/s NRZ 1.3pJ/b Co-Packaged and Fiber-Terminated 4-Ch VCSEL-Based Optical Transmitter

来自Intel公司的光电合封VCSEL发射机工作。

9) 25.1 Short-Reach Silicon Photonic Interconnects with Quantum Dot Mode Locked Laser Comb Sources

UCSB基于量子点锁模激光器光梳的短距硅光互连工作。

10) 33.10 A 2.7ps-ToF-Resolution and 12.5mW Frequency-domain NIRS Readout IC with Dynamic Light Sensing Frontend and Cross-Coupling-Free Inter-Stabilized Data Converter

上海交通大学近红外光谱读出电路方面的工作。

Forum 1: Efficient Chiplets and Die-to-Die Communications:

11) Photonics for Die-to-Die Interconnects: Links and Optical I/O Chiplets

Ayar Labs芯片间光互连的工作。

Forum 6: Toward Next Generation of Highly Integrated Electrical and Optical Transceivers:

12) Silicon Photonics Based High Throughput Optical Transceivers, Mayank Raj, AMD, San Jose, CA

AMD硅光高吞吐率收发机。

13) Silicon Photonics and Foundry Requirements for AI Datacenters, Tom Gray, NVIDIA, Durham, NC

NVIDIA针对AI数据中心的硅光和工艺厂要求。

14) Electronic-Photonic Systems-on-Chip for Compute, Communications and Sensing, Vladimir Stojanovic, UC Berkeley, Berkeley, CA

UC Berkeley在光电融合计算、通信及传感方面的进展。

光电融合相关内容也被列入了2025年ISSCC的论文召集内容，光电融合正逐步成为集成电路的主流研究方向，有望照亮集成电路未来。