博文
<<Relaxation of the Chemical Bond>> is due
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Springer Series of Chemical Physics (Volume 108, 805 pp, due 31/03/2014) has published a Monograph focusing on Coordination Bond and Electronic Engineering. This volume features the latest advancement and future trends in Surface Science, Nanoscience, Solid Mechanics, and Water Ice, which shares Author’s thoughts and learnings in past two decades with a combination of theoretical, experimentally analytical, and numerical approaches from basics to applications.
TOC:
Amazon: http://www.amazon.com/Relaxation-Chemical-Bond-Chemisorption-Mechanics/dp/9814585203
Springer: http://www.springer.com/physics/condensed+matter+physics/book/978-981-4585-20-0
https://blog.sciencenet.cn/blog-73032-759679.html
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