博文
2021年半导体制造领域的PCT专利申请状况——中国占17%，美国占30%，日本占35%，欧洲占6%
|
█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
附录2 2021年PCT国际专利申请统计分析报告
附录2.7 各技术领域的PCT专利申请状况
附录2.7.38 半导体制造领域的PCT专利申请状况
第38个技术领域是半导体制造，包括半导体及其部件的制造方法和设备。2021年，该领域的PCT专利申请总计1878项（增长率为-20.1%），占总申请量的0.7%，是申请量第45多的领域。
2021年，中国局在半导体制造领域上申请PCT专利319项，占该领域申请量的17%。美国局在该领域上申请专利565项，份额为30.1%。日本局申请专利650项，份额为34.6%。欧洲局申请专利113项，份额为6%。
附表2.7.38-1 2021年半导体制造领域各专利局的PCT专利申请数量
专利局 | 申请数量 | 占本局比例 | 占领域比例 | |
1 | 中国 | 319 | 0.5% | 17.0% |
2 | 美国 | 565 | 1.0% | 30.1% |
3 | 日本 | 650 | 1.4% | 34.6% |
4 | 欧洲 | 113 | 0.3% | 6.0% |
5 | 韩国 | 123 | 0.7% | 6.5% |
6 | 国际 | 55 | 0.4% | 2.9% |
7 | 英国 | 4 | 0.1% | 0.2% |
8 | 法国 | 23 | 0.9% | 1.2% |
9 | 加拿大 | 5 | 0.3% | 0.3% |
10 | 澳大利亚 | 1 | 0.1% | 0.1% |
11 | 土耳其 | 1 | 0.1% | 0.1% |
12 | 德国 | 4 | 0.3% | 0.2% |
13 | 以色列 | 2 | 0.1% | 0.1% |
14 | 瑞典 | 2 | 0.2% | 0.1% |
15 | 其他 | 11 | -- | 0.6% |
小计 | 1878 | -- | 100% |
附图2.7.38-1 2021年半导体制造领域各专利局的PCT专利申请数量对比
2021年，在半导体制造领域上PCT专利申请最多的机构是应用材料公司、东京电子株式会社、拉姆研究公司。
附表2.7.38-2 2021年半导体制造领域的PCT国际专利申请前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | 应用材料公司 | 美国 | APPLIED MATERIALS, INC | 185 |
2 | 东京电子株式会社 | 日本 | TOKYO ELECTRON LTD. | 168 |
3 | 拉姆研究公司 | 美国 | LAM RESEARCH CORPORATION | 95 |
4 | 长鑫存储技术有限公司 | 中国 | CHANGXIN MEMORY TECHNOLOGIES, INC | 84 |
5 | 国际电气株式会社 | 日本 | KOKUSAI ELECTRIC CORPORATION | 41 |
6 | 日立高新技术公司 | 日本 | HITACHI HIGH-TECH CORPORATION | 38 |
7 | 索尼半导体解决方案公司 | 日本 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | 33 |
8 | 三菱电机公司 | 日本 | MITSUBISHI ELECTRIC CORPORATION | 30 |
9 | 科磊公司 | 美国 | KLA CORPORATION | 29 |
10 | 株式会社斯库林集团 | 日本 | SCREEN HOLDINGS CO., LTD. | 27 |
注：本表数据按照第一申请人进行统计。
附图2.7.38-2 2021年半导体制造领域的PCT国际专利申请前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。
附表 2021年该领域PCT国际专利申请
| ID | Title | Applicant |
| WO/2021/151159 | A METHOD OF BONDING CARBON CONTAINING MATERIAL PORTIONS USING A SILICON-CONTAINING MATERIAL | THE UNIVERSITY OF MELBOURNE |
| WO/2021/035322 | ASSEMBLY METHOD FOR CHIP WITH EXPOSED TEST PADS AND CHIP WITH EXPOSED TEST PADS | CEITEC - CENTRO NACIONAL DE TECNOLOGIA ELETRÔNICA AVANÇADA S.A. |
| WO/2021/016712 | HIGH EFFICIENCY MICRODEVICE | VUEREAL INC. |
| WO/2021/113981 | BURIED HETEROSTRUCTURE SEMICONDUCTOR OPTICAL AMPLIFIER AND METHOD FOR FABRICATING THE SAME | NATIONAL RESEARCH COUNCIL OF CANADA |
| WO/2021/119836 | CARTRIDGE INSPECTION ANCHORS | VUEREAL INC. |
| WO/2021/195755 | OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER | VUEREAL INC. |
| WO/2021/207836 | FLIP CHIP MICROLED AND CARTRIDGE ARRANGEMENT | VUEREAL INC. |
| WO/2021/003705 | WAFER CARRIER AND WAFER EPITAXIAL DEVICE | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/003706 | WAFER CARRYING DISK AND WAFER EPITAXIAL DEVICE | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/007737 | DETECTION CIRCUIT AND SENSOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/007769 | DISPLAY SUBSTRATE, FABRICATION METHOD THEREFOR AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/007897 | MONOCRYSTALLINE SILICON LOCAL SOI SUBSTRATE, PHOTOELECTRIC DEVICE, AND PREPARATION METHOD | SHANGHAI INDUSTRIAL ΜTECHNOLOGY RESEARCH INSTITUTE |
| WO/2021/017038 | TRANSFER METHOD FOR TRANSFERRING COMPOUND SEMICONDUCTOR MONOCRYSTAL THIN FILM LAYER AND METHOD FOR PREPARING MONOCRYSTAL GAAS-OI COMPOSITE WAFER | BEIJING UNIVERSITY OF TECHNOLOGY |
| WO/2021/026872 | TRANSFER METHOD FOR SEMICONDUCTOR THIN FILM LAYER AND MANUFACTURING METHOD FOR COMPOSITE WAFER | BEIJING UNIVERSITY OF TECHNOLOGY |
| WO/2021/000384 | MICRO-LED CHIP TRANSFER METHOD AND DISPLAY DEVICE | SHENZHEN SITAN TECHNOLOGY CO., LTD. |
| WO/2021/017044 | BATTERY CELL IV AND EL DOUBLE-SIDED TEST EQUIPMENT | ROBOTECHNIK INTELLIGENT TECHNOLOGY CO., LTD. |
| WO/2021/031106 | MANUFACTURING METHOD FOR SURFACE RELIEF GRATING STRUCTURE | AAC OPTICS (CHANGZHOU) CO., LTD. |
| WO/2021/026957 | HIGH-PRECISION LARGE PANEL-LEVEL MICRO-ASSEMBLY DEVICE | SUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD. |
| WO/2021/026990 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/012359 | TFT DRIVING BACKBOARD AND MICRO-LED DISPLAY | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/046684 | MASS TRANSFER APPARATUS AND METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/035853 | FLEXIBLE DISPLAY DEVICE FABRICATION METHOD AND FLEXIBLE DISPLAY DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/062674 | PACKAGING STRUCTURE AND FORMING METHOD THEREFOR, AND PACKAGING METHOD | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/062773 | LIGHT EMITTING DIODE DETECTION SYSTEM | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/062786 | LED MASS TRANSFER METHOD AND APPARATUS | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/062881 | COATING AND DEVELOPMENT EQUIPMENT | KINGSEMI CO., LTD. |
| WO/2021/068219 | METHOD FOR DETECTING DEFECTS IN DEEP FEATURES WITH LASER ENHANCED ELECTRON TUNNELING EFFECT | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/068222 | METHODS FOR WAFER WARPAGE CONTROL | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/068225 | METHODS AND STRUCTURES FOR DIE-TO-DIE BONDING | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/072603 | LED TESTING DEVICE AND METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/072743 | SYSTEMS AND METHODS FOR EVALUATING CRITICAL DIMENSIONS BASED ON DIFFRACTION-BASED OVERLAY METROLOGY | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/027059 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND TOUCH CONTROL DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/003884 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/017206 | ELECTROMAGNETIC SHIELDING PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR | JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/035931 | ARRAY SUBSTRATE, MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/068307 | SOLAR CELL AND MANUFACTURING METHOD THEREFOR | ZHEJIANG JINKO SOLAR CO., LTD. |
| WO/2021/081975 | SUBSTRATE CLEANING METHOD AND APPARATUS | ACM RESEARCH (SHANGHAI) INC. |
| WO/2021/031358 | ARRAY SUBSTRATE AND FABRICATING METHOD THEREFOR, AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031374 | PREPARATION METHOD FOR ARRAY SUBSTRATE AND ARRAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/042502 | QUANTUM DOT LIGHT-EMITTING DEVICE PATTERNING METHOD AND QUANTUM DOT LIGHT-EMITTING DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/031380 | ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/088027 | AUTOMATIC ASSESSMENT METHOD AND ASSESSMENT SYSTEM THEREOF FOR YIELD IMPROVEMENT | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/031392 | MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND ARRAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/082066 | DISPLAY PANEL AND METHOD FOR MANUFACTURE THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/092764 | SEMICONDUCTOR DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/042551 | ADJUSTABLE WAFER OVERTURNING DEVICE | ROBOTECHNIK INTELLIGENT TECHNOLOGY CO., LTD. |
| WO/2021/008040 | DRY ETCHING METHOD FOR FILM LAYER STRUCTURE, AND FILM LAYER STRUCTURE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/092862 | SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/082089 | MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND ARRAY SUBSTRATE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000501 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/056777 | PI SUBSTRATE AND PREPARATION METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/056778 | WELDING PROCESS FOR CLADDING COPPER ON BACK SURFACE OF WAFER | YANTAI TAIXIN ELECTRONIC TECHNOLOGY CO., LTD. |
| WO/2021/097756 | PACKAGED ELECTRONIC DEVICE WITH LOW RESISTANCE BACKSIDE CONTACT | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/056785 | <u>INVERTER MANUFACTURING METHOD AND INVERTER</u> | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/102659 | MICRO DEVICE TRANSFER APPARATUS AND METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/102712 | SEMICONDUCTOR VACUUM TREATMENT DEVICE AND SEMICONDUCTOR TREATMENT METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/102877 | MASS TRANSFER CARRIER PLATE, MASS TRANSFER DEVICE, AND METHOD FOR SAME | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/108942 | METHOD FOR AUTOMATICALLY EXPANDING FILM, AND STORAGE MEDIUM AND DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/109007 | MASS TRANSFER METHOD AND SYSTEM FOR SEMICONDUCTOR ELEMENT | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/109010 | MASS TRANSFER METHOD AND SYSTEM FOR SEMICONDUCTOR DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/097933 | OLED AUTOMATIC PRODUCTION DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/109073 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/109075 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/103125 | MANUFACTURING METHOD FOR SEMICONDUCTOR POWER DEVICE, AND SEMICONDUCTOR POWER DEVICE | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| WO/2021/109160 | METHOD FOR MANUFACTURING SEMICONDUCTOR POWER DEVICE | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| WO/2021/109230 | MICRO LIGHT EMITTING DIODE TRANSFER DEVICE AND MICRO LIGHT EMITTING DIODE TRANSFER METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/119965 | MASS TRANSFER APPARATUS AND MASS TRANSFER METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/109238 | TRANSFER METHOD AND TRANSFER DEVICE FOR MICRO LED | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/120048 | CHIP STRUCTURE AND WIRELESS COMMUNICATION DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/114347 | METHOD FOR PREPARING METAL ELECTRODE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/120143 | FLEXIBLE MICROWAVE POWER TRANSISTOR AND METHOD FOR PREPARATION THEREOF | UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA |
| WO/2021/127862 | METHODS FOR ETCHING A MATERIAL LAYER FOR SEMICONDUCTOR APPLICATIONS | APPLIED MATERIALS, INC. |
| WO/2021/077601 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/093104 | PREPARATION METHOD FOR FLEXIBLE DISPLAY PANEL, MATERIAL OF SACRIFICIAL LAYER, AND PREPARATION METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/114430 | BACKPLANE MANUFACTURING METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134255 | MASS TRANSFER APPARATUS AND METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/093127 | ALGAN/GAN OHMIC CONTACT ELECTRODE AND PREPARATION METHOD THEREFOR, AND METHOD FOR REDUCING OHMIC CONTACT | SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY. |
| WO/2021/134423 | METHOD FOR PREPARING THIN FILM TRANSISTOR | GUANGZHOU NEW VISION OPTO-ELECTRONIC TECHNOLOGY CO., LTD. |
| WO/2021/114437 | TRENCH FIELD EFFECT TRANSISTOR STRUCTURE, AND MANUFACTURING METHOD FOR SAME | CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD |
| WO/2021/134489 | MASS TRANSFER APPARATUS, FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/134490 | MASS TRANSFER SYSTEM AND METHOD FOR LIGHT-EMITTING DIODE | CHONGQING KONKA PHOTOELECTRIC TRCHNOLOGY RESEARCH INSTITUTE CO., LTD |
| WO/2021/134579 | DETECTION PROCESSING METHOD AND SYSTEM, AND STORAGE MEDIUM | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/134751 | THIN FILM TRANSISTOR AND FABRICATION METHOD THEREOF, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/128454 | ARRAY SUBSTRATE MANUFACTURING METHOD, ARRAY SUBSTRATE AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/000560 | SEMICONDUCTOR MEMORY PREPARATION METHOD AND SEMICONDUCTOR MEMORY | CHENGDU PBM TECHNOLOGY LTD. |
| WO/2021/138771 | HEATING DEVICE AND PREPARATION METHOD FOR MASS PREPARATION OF HIGH-QUALITY ALUMINIUM NITRIDE TEMPLATES | ULTRATREND TECHNOLOGIES INC |
| WO/2021/138792 | METAL-DIELECTRIC BONDING METHOD AND STRUCTURE | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/138794 | METHODS FOR MULTI-WAFER STACKING AND DICING | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/142622 | METHOD FOR DETERMINING CAUSE OF DEFECT, AND ELECTRONIC DEVICE, STORAGE MEDIUM, AND SYSTEM | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/128518 | METHOD FOR MANUFACTURING PATTERN OF THIN FILM TRANSISTOR, THIN FILM TRANSISTOR AND PHOTOMASK | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/098038 | METHOD AND DEVICE FOR WET PROCESSING INTEGRATED CIRCUIT SUBSTRATES USING A MIXTURE OF CHEMICAL STEAM VAPORS AND CHEMICAL GASES | SHANGHAI SNA ELECTRONIC INFORMATION TECHNOLOGIES CO. LTD. |
| WO/2021/142766 | SYSTEMS FOR APPLYING MATERIALS TO COMPONENTS | TIANJIN LAIRD TECHNOLOGIES LIMITED |
| WO/2021/142816 | WAFER TO WAFER STRUCTURE AND TEST METHOD THEREFOR, AND HIGH BANDWIDTH MEMORY AND MANUFACTURING METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/146860 | STACKED CHIP, MANUFACTURING METHOD, IMAGE SENSOR, AND ELECTRONIC DEVICE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
| WO/2021/146897 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/159225 | METAL CONTAMINATION TEST APPARATUS AND METHOD | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/142870 | PIXEL DRIVING CIRCUIT AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/159501 | SYSTEM IN PACKAGE (SIP) CHIP AND ELECTRONIC SHELF LABEL | HANSHOW TECHNOLOGY CO., LTD. |
| WO/2021/163823 | HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/114476 | FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/138974 | GLASS WAFER SUCTION DEVICE | AAC OPTICS (CHANGZHOU) CO., LTD. |
| WO/2021/134889 | TRENCH GATE MOSFET POWER SEMICONDUCTOR DEVICE, POLYCRYSTALLINE SILICON-FILLING METHOD THEREFOR, AND MANURFACTURING METHOD THEREFOR | HANGZHOU SILAN MICROELECTRONICS CO., LTD. |
| WO/2021/174395 | ENCAPSULATION STRUCTURE AND METHOD FOR MANUFACTURING ENCAPSULATION STRUCTURE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/051751 | FERROELECTRIC MEMORY DEVICES WITH REDUCED EDGE DEFECTS AND METHODS FOR FORMING THE SAME | WUXI PETABYTE TECHNOLOGIES CO., LTD. |
| WO/2021/179185 | CHIP STACKING STRUCTURE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/179270 | THREE-DIMENSIONAL INTEGRATED CIRCUIT, AND PROCESS AND DEVICE FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT ALIGNMENT | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/179273 | CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORY | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/168915 | BAKING DEVICE USED IN MANUFACTURING PROCESS OF DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/068456 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD |
| WO/2021/155625 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREFOR | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/184175 | METHODS AND SYSTEMS FOR SEMICONDUCTOR STRUCTURE THICKNESS MEASUREMENT | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| WO/2021/082337 | METHOD FOR IMPROVING TIP DISCHARGE DEFECT AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/093238 | METAL LEAD, SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/155626 | ARRAY SUBSTRATE, DISPLAY PANEL, AND METHOD FOR FABRICATING ARRAY SUBSTRATE | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/184256 | QUANTUM DOT LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD FOR QUANTUM DOT DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/077673 | ARRAY SUBSTRATE MANUFACTURING METHOD, AND ARRAY SUBSTRATE | CHENGDU CEC PANDA DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/134940 | BONDING STRUCTURE AND FABRICATION METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| WO/2021/195858 | DOWNWARD ETCHING METHOD FOR MANUFACTURING PEROVSKITE MICRO-NANO STRUCTURE | HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN (INSTITUTE OF SCIENCE AND TECHNOLOGY INNOVATION, HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN) |
| WO/2021/195893 | BARE CHIP, PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/189541 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/164113 | WEIGHT MODULE FOR CHIP COATING PROCESS | HIMIT (SHENZHEN) TECHNOLOGY CO LTD |
| WO/2021/212330 | METHOD AND APPARATUS FOR REMOVING PARTICLES OR PHOTORESIST ON SUBSTRATES | ACM RESEARCH (SHANGHAI) , INC. |
| WO/2021/196310 | REPAIRING APPARATUS FOR DISPLAY PANEL | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/196311 | MICRO LIGHT EMITTING DIODE TRANSFER DEVICE AND TRANSFER METHOD, AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/196313 | MICRO LIGHT-EMITTING DIODE TRANSFER DEVICE AND TRANSFER METHOD AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/139043 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| WO/2021/217301 | SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/217302 | MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/217458 | INTEGRATED CIRCUIT, FABRICATION METHOD, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/217546 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/217600 | MIRRORED FACE DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/203501 | METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/212559 | GOA ARRAY SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/226839 | GROUP III NITRIDE STRUCTURE AND MANUFACTURING METHOD THEREFOR | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/226945 | TRANSFER METHOD AND DISPLAY DEVICE | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/212579 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/208177 | METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIP | MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD. |
| WO/2021/135044 | DEFECT INSPECTION APPARATUS AND METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/232315 | TRANSFER DEVICE AND TRANSFER METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/227123 | METHOD FOR DETERMINING BLOCKING ABILITY OF COPPER DIFFUSION BARRIER LAYER AND STRUCTURE THEREOF | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/179437 | SILICON WAFER TRANSPORT DEVICE | LINGANG KINGSTONE SEMICONDUCTOR COMPANY LTD. |
| WO/2021/051853 | LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/232452 | MASS TRANSFER DEVICE AND SYSTEM, AND CONTROL METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/237511 | TRANSFER SUBSTRATE OF MICRO-LEDS AND PREPARATION METHOD THEREFOR | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/237528 | GROUP III NITRIDE STRUCTURE AND PREPARATION METHOD THEREFOR | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/237529 | MASS TRANSFER DEVICE AND TRANSFER METHOD THEREOF | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/017601 | LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/237568 | MASS TRANSFER APPARATUS AND MASS TRANSFER METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/109504 | SEMICONDUCTOR MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/036381 | LASER LIFT-OFF INTEGRATED DEVICE | SINO NITRIDE SEMICONDUCTOR CO., LTD. |
| WO/2021/243542 | BUFFERING-TYPE ELECTRONIC PRODUCT PACKAGING STRUCTURE | NANJING LISHUI HIGH-TECH VENTURE CAPITAL MANAGEMENT CO., LTD |
| WO/2021/227154 | PREPARATION METHOD FOR DISPLAY PANEL, AND DISPLAY PANEL AND DISPLAY APPARATUS | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/243615 | MASS TRANSFER DEVICE AND METHOD FOR MICRO LIGHT-EMITTING DIODES | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/077758 | METHOD FOR USING MBE TO REGROW P-GAN SINGLE-GATE STRUCTURE GAN-JFET DEVICE | GX OPTOELECTRONIC TECHNOLOGY INSTITUE CO., LTD |
| WO/2021/012826 | METHOD FOR STRIPPING SEMICONDUCTOR THIN FILM AND TRANSFERRING SAME TO SUBSTRATE | YIGUAN INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD |
| WO/2021/068539 | INSPECTION DEVICE AND METHOD FOR MICRO LIGHT-EMITTING DIODE | CHENGDU VISTAR OPTOELECTRONICS CO., LTD. |
| WO/2021/248378 | METHOD FOR BEOL METAL TO DIELECTRIC ADHESION | APPLIED MATERIALS, INC. |
| WO/2021/135081 | MATERIAL RACK FOR DIODE PACKAGING | TAICANG JIA RUI PRECISION MOULD CO., LTD. |
| WO/2021/135082 | RACK EJECTOR ROD FOR DIODE PACKAGING | TAICANG JIA RUI PRECISION MOULD CO., LTD. |
| WO/2021/073133 | SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE STRUCTURE, AND PACKAGE BODY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/073134 | SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGING BODY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/073135 | SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGING STRUCTURE, AND PACKAGES | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/253234 | APPARATUS AND METHOD FOR REMOVING METAL GALLIUM, AND LASER LIFT OFF SYSTEM | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/253284 | EPITAXIAL WAFER, LED CHIP, AND DISPLAY SCREEN | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/208224 | METHOD FOR PREPARING ITO THIN FILM BASED ON SOLUTION METHOD | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/088378 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/088379 | SEMICONDUCTOR STRUCTURE, FABRICATION METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/103505 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/008317 | THREE-PHASE INVERSION POWER CHIP AND PREPARATION METHOD THEREFOR | GREE ELECTRIC APPLIANCES, INC.OF ZHUHAI |
| WO/2021/017744 | PACKAGING PROCESS FOR MULTI-CHIP MODULE | INNOGRATION (SUZHOU) CO., LTD. |
| WO/2021/248593 | MICROARRAY ADSORPTION SUBSTRATE, DRIVING CIRCUIT, AND DISPLAY DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/253513 | SILICON THROUGH-HOLE STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGING AND FABRICATION METHOD THEREFOR | FUDAN UNIVERSITY |
| WO/2021/243791 | LASER PACKAGING DEVICE | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/103537 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/004438 | CHIP FAILURE LOCATING METHOD | BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED |
| WO/2021/253542 | SUBSTRATE PROCESSING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | FUJIAN JING'AN OPTOELECTRONICS CO., LTD. |
| WO/2021/013030 | PACKAGING METHOD FOR SEMICONDUCTOR DEVICE, PACKAGING ASSEMBLY, AND ELECTRONIC DEVICE | INTELLIMICRO MEDICAL CO., LTD. |
| WO/2021/017895 | PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF | NANTONG TONGFU MICROELECTRONICS CO., LTD |
| WO/2021/017897 | PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF | NANTONG TONGFU MICROELECTRONICS CO., LTD |
| WO/2021/013097 | PACKAGING STRUCTURE AND FORMATION METHOD THEREOF | NANTONG TONGFU MICROELECTRONICS CO., LTD. |
| WO/2021/103602 | CRITICAL DIMENSION ERROR ANALYSIS METHOD | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/135179 | METHOD FOR PREPARING HEAD-TO-HEAD PATTERN | SHANGHAI IC R & D CENTER CO., LTD. |
| WO/2021/018037 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, BIOLOGICAL RECOGNITION DEVICE, AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/147284 | FLEXIBLE SUBSTRATE METAL OXIDE THIN FILM TRANSISTOR AND PASSIVATION LAYER PREPARATION METHOD THEREOF | SOUTH CHINA UNIVERSITY OF TECHNOLOGY |
| WO/2021/088430 | MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/088431 | MEMORY AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/223343 | METHOD FOR PREPARING GALLIUM NITRIDE-MOLYBDENUM DISULFIDE HYBRID SCALE PN JUNCTION | NJU OPTOELECTRONICS ENGINEERING RESEARCH INSTITUTE CO., LTD |
| WO/2021/232604 | MANUFACTURING METHOD FOR ADVANCED NODE REAR-SECTION METAL THROUGH HOLE | NANJING CHENGXIN INSTITUTE OF IC TECHNOLOGY |
| WO/2021/184683 | DEVICE FOR HOLDING SEMICONDUCTOR WAFER | WAFER WORKS EPITAXIAL CORP. |
| WO/2021/184684 | EPITAXIAL METHOD FOR SUPER HEAVILY DOPED RED PHOSPHOROUS SUBSTRATE | WAFER WORKS EPITAXIAL CORP. |
| WO/2021/098324 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/068672 | IGZO THIN-FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME | SOUTHEAST UNIVERSITY |
| WO/2021/043167 | FINAL CLEANING METHOD FOR SILICON CARBIDE SINGLE-CRYSTAL POLISHED WAFER SUBSTRATE | SHANXI SEMICORE CRYSTAL CO., LTD. |
| WO/2021/212722 | SEMICONDUCTOR TRANSFER APPARATUS, DEVICE AND TRANSFER METHOD | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| WO/2021/258561 | MEMORY FORMING METHOD AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/143180 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARATION METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/223353 | MANUFACTURING METHOD FOR SEMICONDUCTOR SUPER-JUNCTION DEVICE | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| WO/2021/223354 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUPER-JUNCTION DEVICE | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| WO/2021/098376 | INSULATED GATE BIPOLAR TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREFOR | SOUTHEAST UNIVERSITY |
| WO/2021/088568 | LEAD FRAME FEEDING FRAME HAVING AUTOMATIC FIXING FUNCTION | FOSHAN BLUE ROCKET ELECTRONICS CO., LTD. |
| WO/2021/189802 | WAFER CLEANING AND DRYING DEVICE | HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC |
| WO/2021/068805 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/058031 | SEMICONDUCTOR ENCAPSULATION METHOD AND SEMICONDUCTOR ENCAPSULATION STRUCTURE | SIPLP MICROELECTRONICS (CHONGQING) CO., LTD. |
| WO/2021/037282 | SEMICONDUCTOR TESTING APPARATUS AND TESTING METHOD | ZICHUANG (NANJING) TECHNOLOGY CO., LTD |
| WO/2021/223365 | WAFER CONVEYING DEVICE, CONVEYING METHOD AND CMP APPARATUS CLEANING MODULE | HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC. |
| WO/2021/082898 | COF ENCAPSULATION METHOD | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
| WO/2021/129052 | COVER OPENING APPARATUS FOR WAFER CASSETTE AND COVER OPENING METHOD THEREFOR | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
| WO/2021/129053 | EJECTOR PIN DEVICE FOR CHIP PACKAGING | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
| WO/2021/143242 | PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/088670 | ETCHING METHOD, AIR GAP TYPE DIELECTRIC LAYER, AND DYNAMIC RANDOM ACCESS MEMORY | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/248781 | SELECTOR MATERIAL, SELECTOR UNIT, AND PREPARATION METHOD AND MEMORY STRUCTURE | SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES |
| WO/2021/258595 | CRIMPING-TYPE MODULE ELECTRODE CRIMPING DEVICE | YANGZHOU SILING ELECTRONICS CO., LTD. |
| WO/2021/238059 | MECHANICAL STRIPPING METHOD AND APPARATUS FOR FLEXIBLE SUBSTRATE | TRULY SEMICONDUCTORS LIMITED |
| WO/2021/083304 | SUBSTRATE STRIPPING METHOD AND EPITAXIAL WAFER | HC SEMITEK (ZHEJIANG) CO., LTD. |
| WO/2021/139366 | METHOD FOR MANUFACTURING VERTICAL DEVICE | ENKRIS SEMICONDUCTOR, INC. |
| WO/2021/103953 | GALLIUM OXIDE SEMICONDUCTOR STRUCTURE, VERTICAL GALLIUM OXIDE-BASED POWER DEVICE, AND PREPARATION METHOD | SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES |
| WO/2021/088912 | THIN FILM TRANSISTOR AND PREPARATION METHOD THEREFOR, ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/129199 | LIGHT-EMITTING DEVICE, SUBSTRATE THEREOF AND FABRICATION METHOD | GUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/164342 | DIE-TAKING AND DIE-BONDING MECHANISM AND DIE BONDER | SUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD |
| WO/2021/164343 | CHIP REMOVING AND MOUNTING DEVICE AND CHIP MOUNTING MACHINE | SUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD |
| WO/2021/218125 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/179672 | PACKAGING STRUCTURE AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/104375 | MOLD FOR MAKING ALKALI METAL WAX PACKET, METHOD FOR PREPARING SAME, AND METHOD FOR USING SAME | BEIJING VACUUM ELECTONICS RESEARCH INSTITUTE |
| WO/2021/121024 | TRAY USED FOR THIN-FILM DEPOSITION DEVICE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/135804 | CLEANING SOLUTION FOR PLASMA ETCHING RESIDUE | ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD |
| WO/2021/121050 | METHOD FOR DETERMINING POLISHED EDGE SHAPE OF SEMICONDUCTOR WAFER, AND METHOD FOR PREDICTING EDGE SHAPE OF SEMICONDUCTOR WAFER | XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD. |
| WO/2021/189942 | SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE | SIPLP MICROELECTRONICS (CHONGQING) CO., LTD. |
| WO/2021/212864 | SILICON CARBIDE DEVICE AND PREPARATION METHOD THEREFOR | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/115377 | PACKAGING METHOD, PACKAGING STRUCTURE AND PACKAGING MODULE | ZTE CORPORATION |
| WO/2021/238197 | TRENCH SIDEWALL GATE WITH LEAD-OUT STRUCTURE, AND METHOD FOR MANUFACTURING SAME | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/218219 | MANUFACTURING METHOD FOR TRENCH OF BCD DEVICE, AND BCD DEVICE | CSMC TECHNOLOGIES FAB2 CO., LTD. |
| WO/2021/232815 | SEPARATION DEVICE AND SEPARATION METHOD | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| WO/2021/258706 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE | SIPLP MICROELECTRONICS (CHONGQING) CO., LTD. |
| WO/2021/143578 | CLEANING DEVICE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/218268 | BURIED GATE PREPARATION METHOD AND SEMICONDUCTOR DEVICE PREPARATION METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/185002 | PREPARATION METHOD FOR STRAIN SENSITIVE FILM, STRAIN SENSITIVE FILM, AND PRESSURE SENSOR | SHENZHEN NEW DEGREE TECHNOLOGY CO.,LTD. |
| WO/2021/169787 | DOUBLE-SIDED CAPACITOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218281 | METHOD FOR PREPARING SI SUBSTRATE-ALN TEMPLATE AND METHOD FOR PREPARING SI SUBSTRATE-GAN EPITAXIAL STRUCTURE | XIDIAN UNIVERSITY |
| WO/2021/179874 | FLOATING DIRECTIONAL MOVEMENT AND SELF-ASSEMBLY MASS TRANSFER METHOD FOR SINGLE-CLASS AND MULTI-CLASS TINY OBJECTS | GUANGDONG UNIVERSITY OF TECHNOLOGY |
| WO/2021/179875 | SUSPENSION DIRECTIONAL MIGRATION AND SELF-LOADING MASS TRANSFER METHOD FOR SINGLE AND MULTIPLE TYPES OF TINY OBJECTS | GUANGDONG UNIVERSITY OF TECHNOLOGY |
| WO/2021/164622 | FABRICATION METHOD FOR SEMICONDUCTOR MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169794 | SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169796 | CONDUCTOR LAYER MANUFACTURING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169797 | SEMICONDUCTOR STRUCTURE PREPARATION METHOD AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169798 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169805 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/164664 | LOADING/UNLOADING DEVICE OF WAFER CARRYING DISC AND LOADING/UNLOADING METHOD THEREFOR | SUNG, Mao-Yen |
| WO/2021/164667 | WAFER, AND CALIBRATION APPARATUS AND CALIBRATION METHOD FOR TRANSFER MECHANISM OF WAFER | SUNG, Mao-Yen |
| WO/2021/169808 | MACHINE FILE PROCESSING METHOD AND SYSTEM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169813 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169816 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169860 | WAFER SUPPORTING MEMBER, WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/169862 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/164771 | WAFER PROCESSING SYSTEM, AUTOMATIC LEVELING DEVICE FOR SEMICONDUCTOR MACHINE TABLE, AND LEVELING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/179896 | CHUCK STRUCTURE OF SEMICONDUCTOR CLEANING DEVICE AND SEMICONDUCTOR CLEANING DEVICE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/185040 | SEMICONDUCTOR STRUCTURE FORMING METHOD AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/175154 | CAPACITOR AND FORMING METHOD THEREFOR, AND DRAM AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/175157 | METHOD FOR FORMING ACTIVE REGION ARRAY, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/170081 | MICRO-ELECTRONIC NON-LANDING MIRROR SYSTEM | SHENZHEN LIGHTING INSTITUTE |
| WO/2021/179925 | METHOD FOR FORMING MEMBRANE WITH UNIFORM THICKNESS DISTRIBUTION, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/179926 | CAPACITOR ARRAY STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/175193 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/190248 | TABLE MATCHING DETECTION METHOD AND SYSTEM, AND EARLY WARNING METHOD AND SYSTEM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/196945 | MONITORING WAFER AND MONITORING SYSTEM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/179934 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/170145 | CHIP SEPARATION METHOD AND WAFER | FATRI UNITED TESTING & CONTROL (QUANZHOU) TECHNOLOGIES CO., LTD. |
| WO/2021/258765 | SEMICONDUCTOR DEVICE, FABRICATION METHOD, AND ELECTRONIC DEVICE | GUANGDONG ZHINENG TECHNOLOGY CO., LTD. |
| WO/2021/196974 | SEMICONDUCTOR EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/185103 | SUPPORT DEVICE, SEMICONDUCTOR APPARATUS, AND METHOD OF DETECTING RESIDUAL CHARGE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/203885 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203887 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/208635 | MACHINE GAS PATH FLOW ADJUSTMENT SYSTEM AND METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/180102 | METHOD FOR EVALUATING DEVICE HOT-CARRIER EFFECT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203897 | METHOD FOR MANUFACTURING HIGH-DENSITY THREE-DIMENSIONAL PROGRAMMABLE MEMORY | CHENGDU PBM TECHNOLOGY LTD. |
| WO/2021/185133 | TEMPERATURE CALIBRATION METHOD FOR SEMICONDUCTOR MACHINE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/185134 | TEMPERATURE CALIBRATION PIECE AND APPLICATION METHOD THEREOF | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/180121 | METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203900 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/248951 | SUBSTRATE THINNING METHOD, SUBSTRATE THINNING DEVICE, AND OPERATING METHOD THEREOF | TSINGHUA UNIVERSITY |
| WO/2021/208649 | METHOD FOR FORMING ACTIVE AREA ARRAY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/197025 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/185162 | METHOD FOR MEASURING AND CALIBRATING TEMPERATURE OF WAFER CHUCK, AND TEMPERATURE MEASUREMENT SYSTEM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/190406 | SEMICONDUCTOR ETCHING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203945 | METHOD FOR MANUFACTURING TRENCH ISOLATION STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/197108 | CAVITY APPLIED TO SEMICONDUCTOR PROCESS | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/203951 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/197206 | MARK DETECTION METHOD AND APPARATUS, AND COMPUTER READABLE STORAGE MEDIUM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/197209 | SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/232936 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/232937 | METHOD FOR PREPARING SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/197322 | METHOD FOR DEPOSITING NANOSTRUCTURES ON SUBSTRATE AND NANOSTRUCTURE ARRAYS | PEKING UNIVERSITY |
| WO/2021/204050 | SEMICONDUCTOR PROCESSING DEVICE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/204064 | MEMORY FORMATION METHOD AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/227722 | STAGE APPARATUS | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/227731 | MANUFACTURING METHOD FOR BURIED WORD LINE STRUCTURE, AND SEMICONDUCTOR MEMORY COMPRISING BURIED WORD LINE STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/208832 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/204288 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/204291 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/208855 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/227751 | OXIDATION GAS HOMOGENIZING COVER WITH GAS FEEDING UNIFORMIZING FUNCTION | GX OPTOELECTRONIC TECHNOLOGY INSTITUE CO., LTD |
| WO/2021/208997 | ELECTRODE MANUFACTURING METHOD, ELECTRODE, AND SEMICONDUCTOR DEVICE | DYNAX SEMICONDUCTOR, INC. |
| WO/2021/223586 | WET TREATMENT DEVICE AND CONTROL METHOD THEREFOR, STORAGE MEDIUM, AND ELECTRONIC DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/213425 | FAULT MONITORING SYSTEM AND METHOD USED DURING SEMICONDUCTOR MANUFACTURING PROCESS | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218941 | SEMICONDUCTOR DEVICE MEASUREMENT METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/218942 | WAFER PROCESSING DEVICE AND WAFER TRANSFERRING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233111 | MEMORY FORMING METHOD AND MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/227943 | SEMICONDUCTOR REACTION CHAMBER AND ATOMIC LAYER PLASMA ETCHING EQUIPMENT | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
| WO/2021/238618 | METHOD FOR FORMING CAPACITOR HOLE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233138 | SEMICONDUCTOR DEVICE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233139 | WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/244231 | DESIGN METHOD FOR WAFER LAYOUT AND LITHOGRAPHY MACHINE EXPOSURE SYSTEM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233156 | MANUFACTURING METHODS OF SEMICONDUCTOR STRUCTURE AND MEMORY, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233269 | SEMICONDUCTOR DEVICE HOLES, SEMICONDUCTOR DEVICE PREPARATION METHOD, AND SEMICONDUCTOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/233333 | SEMICONDUCTOR ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD THEREOF | DONGGUAN IC CARRIER TECHNOLOGY CO., LTD. |
| WO/2021/244305 | METHOD FOR FORMING AIR SPACER LAYER, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/249175 | AUXILIARY WAFER, PREPARATION METHOD THEREFOR AND SEMICONDUCTOR MANUFACTURING PROCESS | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/249179 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/254108 | SILICON DIOXIDE THIN FILM FORMING METHOD AND METAL GATE FORMING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/249188 | DEVELOPING DEVICE AND DEVELOPING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/249194 | SEMICONDUCTOR ETCHING DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/249224 | METHOD FOR REMOVING BARRIER LAYER | ACM RESEARCH (SHANGHAI) , INC. |
| WO/2021/254136 | SEMICONDUCTOR DEVICE ADJUSTMENT METHOD AND SEMICONDUCTOR DEVICE PREPARATION METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/254150 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
| WO/2021/249262 | NANOSHEET GATED DIODE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/254204 | CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/259120 | AUTOMATIC OPERATION METHOD AND SYSTEM FOR LASER PLATFORM | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| WO/2021/110220 | METHOD FOR TREATING A SEMICONDUCTOR WAFER | HANWHA Q CELLS GMBH |
| WO/2021/228298 | COMPOSITE STRUCTURE WITH AT LEAST ONE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SUCH A COMPOSITE STRUCTURE | LPKF LASER & ELECTRONICS AKTIENGESELLSCHAFT |
| WO/2021/185413 | HOLDING DEVICE FOR WAFERS, PECVD DEPOSITION DEVICE AND USE OF THE HOLDING DEVICE | HANWHA Q CELLS GMBH |
| WO/2021/228323 | HOLDING DEVICE, AND USE OF THE HOLDING DEVICE | HANWHA Q CELLS GMBH |
| WO/2021/013332 | ADHESIVE TRANSFER STAMP AND METHOD FOR TRANSFERRING A SEMICONDUCTOR CHIP USING AN ADHESIVE TRANSFER STAMP | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/013358 | SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A VERTICAL ORIENTATION | APPLIED MATERIALS, INC. |
| WO/2021/013359 | SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A VERTICAL ORIENTATION | APPLIED MATERIALS, INC. |
| WO/2021/028043 | PATH SWITCH ASSEMBLY, CHAMBER AND SUBSTRATE PROCESSING SYSTEM HAVING THE SAME, AND METHODS THEREFOR | APPLIED MATERIALS, INC. |
| WO/2021/037328 | METHOD AND DEVICE FOR ALIGNING SUBSTRATES | EV GROUP E. THALLNER GMBH |
| WO/2021/052559 | METHOD OF FABRICATING A LATTICE STRUCTURE | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/089173 | DEVICE AND METHOD FOR CONNECTING SUBSTRATES | EV GROUP E. THALLNER GMBH |
| WO/2021/104622 | MAGNETIC LEVITATION SYSTEM, PROCESSING SYSTEM, AND METHOD OF TRANSPORTING A CARRIER | APPLIED MATERIALS, INC. |
| WO/2021/110238 | DEVICE AND METHOD FOR HEATING A SUBSTRATE | EV GROUP E. THALLNER GMBH |
| WO/2021/115574 | METHOD AND DEVICE FOR ALIGNING SUBSTRATES | EV GROUP E. THALLNER GMBH |
| WO/2021/164855 | METHOD AND DEVICE FOR TRANSFERRING COMPONENTS | EV GROUP E. THALLNER GMBH |
| WO/2021/170240 | SUPPORT DEVICE FOR SUPPORTING A SUBSTRATE, METHOD OF PROCESSING A SUBSTRATE AND SEMICONDUCTOR SUBSTRATE | APPLIED MATERIALS ITALIA S.R.L |
| WO/2021/170251 | SHADOW WALLS FOR USE IN FABRICATING DEVICES | MICROSOFT TECHNOLOGY LICENSING LLC |
| WO/2021/001066 | SEMICONDUCTOR STRUCTURE COMPRISING AN UNDERGROUND POROUS LAYER, FOR RF APPLICATIONS | SOITEC |
| WO/2021/008742 | METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A THIN LAYER TRANSFERRED ONTO A SUPPORT PROVIDED WITH A CHARGE-TRAPPING LAYER | SOITEC |
| WO/2021/197586 | CARRIER TRANSPORTATION APPARATUS, CARRIER TRANSPORT SYSTEM, PROCESSING SYSTEM AND METHOD OF TRANSPORTING A CARRIER | APPLIED MATERIALS, INC. |
| WO/2021/223843 | APPARATUSES AND METHODS FOR TRANSPORTING A DEVICE IN A VACUUM PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/013401 | METHOD AND COOLING BODY ARRANGEMENT FOR COOLING SEMIDCONDUCTOR CHIPS HAVING INTEGRATED ELECTRONIC CIRCUITS FOR POWER ELECTRONIC APPLICATIONS | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/239253 | METHOD FOR BONDING AND DEBONDING SUBSTRATES | THALLNER, Erich |
| WO/2021/018461 | INSTALLING AN ELECTRONIC ASSEMBLY | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/018466 | SYSTEM AND METHOD FOR FORMING SOLDER BUMPS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/254618 | METHOD OF FORMING ASYMMETRIC THICKNESS OXIDE TRENCHES | DYNEX SEMICONDUCTOR LIMITED |
| WO/2021/259479 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DIE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
| WO/2021/037418 | DETECTING PROCESS PARAMETERS OF AN ASSEMBLY LINE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/004832 | SYSTEM AND METHOD FOR SPATIALLY CONTROLLING AN AMOUNT OF ENERGY DELIVERED TO A PROCESSED SURFACE OF A SUBSTRATE | LASER SYSTEMS & SOLUTIONS OF EUROPE |
| WO/2021/001363 | LITHOGRAPHY PRODUCTION METHOD | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
| WO/2021/001537 | OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE | HYPERTAC S.P.A. |
| WO/2021/005024 | METHOD FOR PRODUCING A COOLING ELEMENT, AND COOLING ELEMENT PRODUCED USING SUCH A METHOD | ROGERS GERMANY GMBH |
| WO/2021/005093 | SUBSTRATE CONVEYING DEVICE AND METHOD FOR CONVEYING A SUBSTRATE | NICE SOLAR ENERGY GMBH |
| WO/2021/018568 | METHOD FOR PRODUCING SEALED FUNCTIONAL ELEMENTS | HORST SIEDLE GMBH & CO. KG |
| WO/2021/013702 | METHOD AND DEVICE FOR THERMOCOMPRESSION WIRE BONDING BY MEANS OF A THERMODE | MüHLBAUER GMBH & CO. KG |
| WO/2021/009325 | NANOWIRE DEVICE | CRAYONANO AS |
| WO/2021/013819 | METHOD FOR OPEN-LOOP OR CLOSED-LOOP CONTROL OF THE TEMPERATURE OF A CHUCK FOR A WAFER, TEMPERATURE ADJUSTMENT DEVICE, AND WAFER TESTING SYSTEM | ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH |
| WO/2021/018713 | METHOD FOR THERMALLY SPRAYING CONDUCTOR PATHS, AND ELECTRONIC MODULE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/018714 | METHOD FOR PRODUCING A CONDUCTOR TRACK BY THERMAL SPRAYING, METHOD FOR PRODUCING AN ELECTRONIC MODULE, AND ELECTRONIC MODULE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/028214 | SYSTEM AND METHOD FOR FABRICATING PHOTONIC DEVICE ELEMENTS | PAUL SCHERRER INSTITUT |
| WO/2021/023591 | BONDING TOOL, BONDING DEVICE AND BONDING METHOD | ASM AMICRA MICROTECHNOLOGIES GMBH |
| WO/2021/019018 | SUBSTRATE HANDLING DEVICE FOR A WAFER | SEMSYSCO GMBH |
| WO/2021/073794 | METHOD FOR PRODUCING A PROTECTIVE COVERING FOR ELECTRONIC COMPONENTS ARRANGED ON A SUPPORTING SUBSTRATE, AND APPARATUS FOR CARRYING OUT THE METHOD | ROBERT BOSCH GMBH |
| WO/2021/037670 | SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS, AND MICROELECTRONIC DEVICE PACKAGE | ROBERT BOSCH GMBH |
| WO/2021/052745 | COMPONENT HANDLING DEVICE WITH COMPONENT INSPECTING DEVICE | MUEHLBAUER GMBH & CO. KG |
| WO/2021/052756 | COMPONENT HANDLING COMPRISING COMPONENT INSPECTION | MUEHLBAUER GMBH & CO. KG |
| WO/2021/052758 | METHOD OF FORMING A COHESIVE CONNECTION BETWEEN A SEMICONDUCTOR WITH AN ALUMINIUM COATED CONTACT SURFACE AND A SHAPED METAL BODY, AS WELL AS A SEMICONDUCTOR MODULE COMPRISING AND A SHAPED METAL BODY COHESIVELY ATTACHED TO A SEMICONDUCTOR | DANFOSS SILICON POWER GMBH |
| WO/2021/043855 | SEMIFINISHED PRODUCT FOR POPULATING WITH COMPONENTS, METHOD FOR POPULATING SAME WITH COMPONENTS, AND USE OF THE SEMIFINISHED PRODUCT | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/244769 | TUNABLE STRESS COMPENSATION IN LAYERED STRUCTURES | IQE PLC |
| WO/2021/052917 | HOMOGENISATION DEVICE | SEMCO SMARTECH FRANCE |
| WO/2021/058605 | COMPOSITION OF MATTER | CRAYONANO AS |
| WO/2021/069328 | SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES | PINK GMBH THERMOSYSTEME |
| WO/2021/069388 | INTERBONDED COMPONENTS, METHOD FOR DETACHING COMPONENTS FROM INTERBONDED COMPONENTS, AND METHOD FOR PRODUCING INTERBONDED COMPONENTS | OSRAM OPTO SEMICONDUCTORS GMBH |
| WO/2021/069459 | CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT | VITESCO TECHNOLOGIES GMBH |
| WO/2021/074270 | ADJUSTMENT DEVICE FOR A VACUUM AREA WITH PRESSURE MEASURING FUNCTIONALITY | VAT HOLDING AG |
| WO/2021/094052 | METHOD AND CARRIER ELEMENT FOR PRODUCING A WAFER LAYER | NEXWAFE GMBH |
| WO/2021/078940 | METHOD OF PRODUCING A SEMICONDUCTOR BODY WITH A TRENCH, SEMICONDUCTOR BODY WITH AT LEAST ONE TRENCH AND SEMICONDUCTOR DEVICE | AMS AG |
| WO/2021/083971 | MAGAZINE SYSTEM | ASYS AUTOMATISIERUNGSSYSTEME GMBH |
| WO/2021/094176 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | PAUL SCHERRER INSTITUT |
| WO/2021/110348 | METHOD FOR FORMING AN ELECTRICAL CONTACT AND METHOD FOR FORMING A SEMICONDUCTOR DEVICE | ROBERT BOSCH GMBH |
| WO/2021/089735 | LOADING AND UNLOADING DEVICE FOR A SUBSTRATE HOPPER, SUBSTRATE HOPPER SYSTEM | ASYS AUTOMATISIERUNGSSYSTEME GMBH |
| WO/2021/121769 | RELEASE ELEMENT AND METHOD FOR RELEASING A SEMICONDUCTOR LAYER FROM A SUBSTRATE | FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V. |
| WO/2021/099403 | METHOD FOR MONITORING, DETERMINING THE POSITION OF, AND POSITIONING A PIN-LIFTING SYSTEM | VAT HOLDING AG |
| WO/2021/105119 | PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR THERMALIZATION AND QUBIT MODIFICATION | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/110513 | METHOD FOR FORMING A HIGH RESISTIVITY HANDLE SUPPORT FOR A COMPOSITE SUBSTRATE | SOITEC |
| WO/2021/105343 | VAN DER WAALS HETEROSTRUCTURES | UNIVERSITY OF EXETER |
| WO/2021/121901 | IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATES | SILTRONIC AG |
| WO/2021/121902 | IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATES | SILTRONIC AG |
| WO/2021/121903 | IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATES | SILTRONIC AG |
| WO/2021/110631 | APPARATUS AND METHOD FOR PROCESSING AT LEAST ONE SEMICONDUCTOR SUBSTRATE | ROBERT BOSCH GMBH |
| WO/2021/121949 | MODULE FOR CHEMICALLY PROCESSING A SUBSTRATE | SEMSYSCO GMBH |
| WO/2021/130045 | PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER | ROCKLEY PHOTONICS LIMITED |
| WO/2021/122654 | CORE MODULE FOR SEMICONDUCTOR PRODUCTION FACILITY MACHINERY | BROOKS AUTOMATION (GERMANY) GMBH |
| WO/2021/122682 | MASSIVE PARALLEL ASSEMBLY METHOD | HUAWEI TECHNOLOGIES DUESSELDORF GMBH |
| WO/2021/139977 | SUBSTRATE RECEIVING AREA FOR PROCESS CHAMBERS | CEMECON AG |
| WO/2021/122909 | METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING | COMMISSARIAT à L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/122987 | INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE | ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY |
| WO/2021/130136 | LASER TREATMENT DEVICE AND LASER TREATMENT METHOD | ALEDIA |
| WO/2021/148281 | MOUNTING METHOD FOR AN INTEGRATED SEMICONDUCTOR WAFER DEVICE, AND MOUNTING DEVICE | LPKF LASER & ELECTRONICS AG |
| WO/2021/170308 | METHOD FOR PRODUCING A POWER MODULE UNIT | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/151684 | METHOD OF MANUFACTURING AND PASSIVATING A DIE | TDK ELECTRONICS AG |
| WO/2021/148438 | SENSOR CASING AND METHOD FOR POTTING AN OPEN RECEIVING SPACE OF A SENSOR CASING | ROBERT BOSCH GMBH |
| WO/2021/160391 | MOULD DEVICE | ROBERT BOSCH GMBH |
| WO/2021/164987 | METHOD FOR PRODUCING A COOLING ELEMENT, AND COOLING ELEMENT PRODUCED USING SUCH A METHOD | ROGERS GERMANY GMBH |
| WO/2021/152020 | PROCESSING A WAFER OF A SEMICONDUCTOR MATERIAL | SMART PHOTONICS HOLDING B.V. |
| WO/2021/156422 | SEMICONDUCTOR STRUCTURE FOR A SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SUCH A SEMICONDUCTOR STRUCTURE | FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V. |
| WO/2021/170373 | APPARATUS FOR PROCESSING A WAFER | LAM RESEARCH AG |
| WO/2021/160664 | METHOD FOR PRODUCING ALUMINUM GALLIUM NITRIDE (ALGAN) NANOSTRUCTURES | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
| WO/2021/160728 | A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT FRONT-END MODULE | EPINOVATECH AB |
| WO/2021/180435 | PROCESS FOR MANUFACTURING AN ELECTRONIC DEVICE WITH A SENSITIVE AREA AND ELECTRONIC DEVICE WITH A SENSITIVE AREA | SENSIRION AG |
| WO/2021/165308 | METHOD FOR TREATING SUBSTRATES WITH CHEMICALS | 4TEX GMBH |
| WO/2021/165450 | APPARATUS AND METHOD FOR TRANSFERRING ELECTRONIC COMPONENTS FROM A FIRST TO A SECOND CARRIER | MUEHLBAUER GMBH & CO. KG |
| WO/2021/204452 | CLAMPING DEVICE AND METHOD FOR SMOOTHING A CURVED SAMPLE | FRT GMBH |
| WO/2021/197713 | WORKPIECE CARRIER AND MOLD FOR JOINING AN ELECTRIC CIRCUIT CARRIER | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/170739 | METHOD FOR PRODUCING A LAYER OF ALUMINIUM NITRIDE (ALN) ON A STRUCTURE OF SILICON OR III-V MATERIALS | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/185554 | INSULATED GATE STRUCTURE, WIDE BANDGAP MATERIAL POWER DEVICE WITH THE SAME AND MANUFACTURING METHOD THEREOF | ABB POWER GRIDS SWITZERLAND AG |
| WO/2021/213725 | METHOD FOR PRODUCING A MICROELECTRONIC DEVICE | ROBERT BOSCH GMBH |
| WO/2021/185850 | COUPON WAFER AND METHOD OF PREPARATION THEREOF | ROCKLEY PHOTONICS LIMITED |
| WO/2021/186031 | METHOD FOR PRODUCING AN OHMIC CONTACT ON A CYRSTALLOGRAPHIC C-SIDE OF A SILICON CARBIDE SUBSTRATE, AND OHMIC CONTACT | ROBERT BOSCH GMBH |
| WO/2021/198009 | MONOLITHIC ELECTRONIC DEVICE | PLESSEY SEMICONDUCTORS LIMITED |
| WO/2021/219381 | METHOD AND DEVICE FOR DEPOSITING AN EPITAXIAL LAYER ON A SUBSTRATE WAFER MADE OF SEMICONDUCTOR MATERIAL | SILTRONIC AG |
| WO/2021/239321 | METHOD FOR WELDING AN ATTACHMENT PIECE TO A SEMICONDUCTOR METALLISATION BY LASER WELDING, AND ELECTRONICS MODULE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/214028 | P+ OR N+ TYPE DOPING PROCESS FOR SEMICONDUCTORS | ISTITUTO NAZIONALE DI FISICA NUCLEARE (INFN) |
| WO/2021/233627 | TEMPERATURE-CONTROL DEVICE, SYSTEM, AND METHOD FOR CONTROLLING THE TEMPERATURE OF A PROBER TABLE FOR SEMICONDUCTOR WAFERS AND/OR HYBRIDS | ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH |
| WO/2021/259536 | METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE, AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATE | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/224265 | POWER MODULE | DANFOSS SILICON POWER GMBH |
| WO/2021/239467 | USE OF A COMPOSITION CONSISTING OF AMMONIA AND AN ALKANOL FOR AVOIDING PATTERN COLLAPSE WHEN TREATING PATTERNED MATERIALS WITH LINE-SPACE DIMENSIONS OF 50 NM OR BELOW | BASF SE |
| WO/2021/239472 | MICRO-COMPONENT WITH ANTI-STICTION STRUCTURES, AS WELL AS A DISPENSING METHOD USING THE SAME | X-CELEPRINT LIMITED |
| WO/2021/239538 | METHOD FOR SIMULTANEOUSLY BONDING TO AND INSULATING A POWER ELECTRONIC SEMICONDUCTOR COMPONENT ON AN ORGANIC AND/OR CERAMIC SUBSTRATE, AND CORRESPONDING COMPOSITE UNIT | SIEMENS AKTIENGESELLSCHAFT |
| WO/2021/254714 | VACUUM TREATMENT APPARATUS | EVATEC AG |
| WO/2021/244946 | FACILITY AND METHOD FOR DISTRIBUTING A GAS MIXTURE FOR DOPING SILICON WAFERS | AIR LIQUIDE ELECTRONICS SYSTEMS |
| WO/2021/239984 | METHOD OF ASSEMBLING A SEMICONDUCTOR COMPONENT | DANFOSS SILICON POWER GMBH |
| WO/2021/245000 | INSTALLATION AND METHOD FOR DISTRIBUTING A GAS MIXTURE | AIR LIQUIDE ELECTRONICS SYSTEMS |
| WO/2021/255039 | MICRO-ELECTRONIC DEVICE WITH INSULATED SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/255286 | METHOD FOR PRODUCING A LAYER ON ONLY CERTAIN SURFACES OF A STRUCTURE | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/260165 | MATERIAL DEPOSITION METHOD | LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST) |
| WO/2021/260189 | WAFER BOATS FOR SUPPORTING SEMICONDUCTOR WAFERS IN A FURNACE | GLOBALWAFERS CO., LTD. |
| WO/2021/198559 | METHOD, SEMICONDUCTOR STRUCTURE, AND VACUUM PROCESSING SYSTEM | TURUN YLIOPISTO |
| WO/2021/019137 | METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE OF POLYCRYSTALLINE SIC | SOITEC |
| WO/2021/009459 | PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATES | SOITEC |
| WO/2021/048507 | TREATMENT OF A THIN FILM BY HYDROGEN PLASMA AND POLARISATION IN ORDER TO IMPROVE THE CRYSTALLINE QUALITY THEREOF | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/074540 | METHOD FOR DIRECTED SELF-ASSEMBLY LITHOGRAPHY | ARKEMA FRANCE |
| WO/2021/105575 | METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE OF POLYCRYSTALLINE SIC | SOITEC |
| WO/2021/105576 | METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER OF MONOCRYSTALLINE SIC ON AN SIC CARRIER SUBSTRATE | SOITEC |
| WO/2021/094665 | TILTABLE AND ROTATABLE SUBSTRATE CARRIER AND MULTI-LAYER VACUUM DEPOSITION SYSTEM COMPRISING SAME | SAFRAN ELECTRONICS & DEFENSE |
| WO/2021/099713 | METHOD FOR MANUFACTURING A FUNCTIONAL CHIP SUITABLE FOR BEING ASSEMBLED TO WIRE ELEMENTS | PRIMO1D |
| WO/2021/105605 | METHOD FOR BONDING TWO SUBSTRATES | SOITEC |
| WO/2021/111062 | METHOD FOR FORMING A HANDLING SUBSTRATE FOR A COMPOSITE STRUCTURE INTENDED FOR RF APPLICATIONS AND HANDLING SUBSTRATE | SOITEC |
| WO/2021/123529 | METHOD FOR ETCHING SUBSTRATES COMPRISING A THIN SURFACE LAYER, FOR IMPROVING THE UNIFORMITY OF THICKNESS OF SAID LAYER | SOITEC |
| WO/2021/140285 | METHOD OF JOINING TWO SEMI-CONDUCTOR SUBSTRATES | SOITEC |
| WO/2021/136894 | METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN MONOCRISTALLINE LAYER ON A CARRIER SUBSTRATE | SOITEC |
| WO/2021/140300 | METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR STRUCTURE FOR RADIOFREQUENCY APPLICATIONS | SOITEC |
| WO/2021/191511 | METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER MADE OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE MADE OF SIC | SOITEC |
| WO/2021/191512 | METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER MADE OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE MADE OF SIC | SOITEC |
| WO/2021/191513 | METHOD FOR PREPARING A THIN LAYER | SOITEC |
| WO/2021/191527 | METHOD FOR PRODUCING A STACKED STRUCTURE | SOITEC |
| WO/2021/198576 | REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS, AND METHOD FOR TRANSFER OF A LAYER USING SAID REMOVABLE STRUCTURE | SOITEC |
| WO/2021/250333 | DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATURES AND PROCESS FOR TRANSFERRING A WORKING LAYER FROM SAID SUBSTRATE | SOITEC |
| WO/2021/234277 | METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RADIOFREQUENCY APPLICATIONS | SOITEC |
| WO/2021/234280 | METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RADIOFREQUENCY APPLICATIONS | SOITEC |
| WO/2021/255381 | METHOD FOR ETCHING A LAYER OF III-N MATERIAL | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| WO/2021/001645 | A SEMICONDUCTOR DEVICE AND METHODS FOR PRODUCTION THEREOF | COVENTRY UNIVERSITY |
| WO/2021/152325 | A METHOD OF CONNECTING CIRCUIT ELEMENTS | PRAGMATIC PRINTING LIMITED |
| WO/2021/156620 | A SEMICONDUCTOR STRUCTURE AND METHOD FOR GUARDING A LOW VOLTAGE SURFACE REGION FROM A HIGH VOLTAGE SURFACE REGION | SEARCH FOR THE NEXT LTD |
| WO/2021/255426 | SEMICONDUCTOR STRUCTURES | UNIVERSITY OF LANCASTER |
| WO/2021/024042 | LIMITED DOSE AND ANGLE DIRECTED BEAM ASSISTED ALE AND ALD PROCESSES FOR LOCALIZED COATINGS ON NON-PLANAR SURFACES | SEIDEL, Thomas, E. |
| WO/2021/116768 | METHOD FOR SPLITTING SEMICONDUCTOR WAFERS | INFINEON TECHNOLOGIES AG |
| WO/2021/005432 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/001719 | IMAGING DEVICE AND ELECTRONIC EQUIPMENT | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/005435 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/009590 | METHOD OF ESTIMATING CHARACTERISTIC VALUE OF SEMICONDUCTOR ELEMENT, AND SYSTEM FOR ESTIMATING CHARACTERISTIC VALUE OF SEMICONDUCTOR ELEMENT | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/009606 | DIRECT PRINT AND SELF-ALIGNED DOUBLE PATTERNING OF NANOSHEETS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/014334 | BACK-END-OF-LINE COMPATIBLE METAL-INSULATOR-METAL ON-CHIP DECOUPLING CAPACITOR | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/024071 | MEMORY DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/048650 | COMPLIANT ORGANIC SUBSTRATE ASSEMBLY FOR RIGID PROBES | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/028770 | MEMORY DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/033063 | INTERCONNECT STRUCTURE HAVING FULLY ALIGNED VIAS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/033075 | MEMORY CELL AND STORAGE DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/053419 | TRAPEZOIDAL INTERCONNECT AT TIGHT BEOL PITCH | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/053421 | PLACING TOP VIAS AT LINE ENDS BY SELECTIVE GROWTH OF VIA MASK FROM LINE CUT DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/038361 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/038363 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/059046 | SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/059047 | PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/038393 | SEMICONDUCTOR DEVICE AND CONTROL SYSTEM | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/048672 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/048676 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/069984 | TOOL CONTROL USING MULTISTAGE LSTM FOR PREDICTING ON-WAFER MEASUREMENTS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/059074 | MEMORY DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/053619 | ENHANCEMENT-MODE HIGH ELECTRON MOBILITY TRANSISTORS WITH SMALL FIN ISOLATION FEATURES | NATIONAL RESEARCH COUNCIL OF CANADA |
| WO/2021/079211 | SELF-ALIGNED TOP VIA FORMATION AT LINE ENDS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/074800 | MODEL MANAGEMENT FOR NON-STATIONARY SYSTEMS | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/079309 | METHOD AND APPARATUS FOR INTRODUCING A SUBSTRATE INTO A NIP | LANDA LABS (2012) LTD |
| WO/2021/090104 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/094878 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/094881 | PROPERTY PREDICTION SYSTEM FOR SEMICONDUCTOR ELEMENTS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/099878 | IMAGING DEVICE AND METHOD FOR FABRICATING SAME | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/099885 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/111243 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/111250 | INFORMATION PROCESSING DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/111279 | CIRCUITS INCLUDING MICROPATTERNS AND USING PARTIAL CURING TO ADHERE DIES | 3M INNOVATIVE PROPERTIES COMPANY |
| WO/2021/111362 | INFILLING SHEET FOR PLASMA DEVICE, PART FOR PLASMA DEVICE COMPRISING SAID INFILLING SHEET, AND PLASMA DEVICE COMPRISING SAID INFILLING SHEET | 3M INNOVATIVE PROPERTIES COMPANY |
| WO/2021/130598 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/130716 | COOLING OF HIGH POWER DEVICES USING SELECTIVE PATTERNED DIAMOND SURFACE | SOREQ NUCLEAR RESEARCH CENTER |
| WO/2021/144648 | STORAGE DEVICE AND METHOD FOR PRODUCING SAME | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/148886 | SEMICONDUCTOR APPARATUS HAVING THROUGH SILICON VIA STRUCTURE AND MANUFACTURING METHOD THEREOF | LEE, Tae Young |
| WO/2021/144666 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/144681 | HETEROEPITAXIAL GROWTH METHOD OF COMPOUND SEMICONDUCTOR MATERIALS ON MULTI-ORIENTED SEMICONDUCTOR SUBSTRATES AND DEVICES | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/165779 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/161181 | A PRESSURE REGULATED SEMICONDUCTOR WAFER COOLING APPARATUS AND METHOD AND A PRESSURE REGULATING APPARATUS | EDWARDS VACUUM LLC |
| WO/2021/171136 | METAL OXIDE, METHOD FOR FORMING METAL OXIDE FILM, AND DEVICE FOR FORMING METAL OXIDE FILM | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/181181 | HIGH BANDWIDTH MODULE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/171265 | SURFACE MODIFICATION OF SOLDER PASTE STENCILS | NEWTECH LLC |
| WO/2021/198805 | EPITAXIAL PROCESSING OF SINGLE-CRYSTALLINE FILMS ON AMORPHOUS SUBSTRATES | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| WO/2021/209858 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/209865 | SUPPRESSION OF HYDROGEN DEGRADATION | RASIRC, INC. |
| WO/2021/214702 | ELECTRICAL DEVICE FOR CHARACTERIZING A DEPOSITION STEP SUCH AS ALD, AND CORRESPONDING METHODS OF FABRICATING AND CHARACTERIZING | MURATA MANUFACTURING CO., LTD. |
| WO/2021/234500 | SEMICONDUCTOR DEVICE | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| WO/2021/240418 | TOOL FOR HANDLING SUBSTRATES WITH OVERHEAD SCREEN AND RELEVANT HANDLING METHODS AND EPITAXIAL REACTOR | LPE S.P.A. |
| WO/2021/255559 | PRECISE BOTTOM JUNCTION FORMATION FOR VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR WITH HIGHLY DOPED EPITAXIAL SOURCE/DRAIN, SHARP JUNCTION GRADIENT, AND/OR REDUCED PARASITIC CAPACITANCE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| WO/2021/205445 | MACHINE AND DEEP LEARNING METHODS FOR SPECTRA-BASED METROLOGY AND PROCESS CONTROL | NOVA LTD |
| WO/2021/210001 | METHOD FOR INDUCING CONDUCTIVITY AT AND NEAR OXIDE INTERFACES | TECHNION RESEARCH & DEVELOPMENT FOUNDATION LIMITED |
| WO/2021/044443 | IN-SITU ETCHING PROCESS | INDIAN INSTITUTE OF SCIENCE |
| WO/2021/084561 | MICROWAVE-ASSISTED APPARATUS, SYSTEM AND METHOD FOR DEPOSITION OF FILMS ON SUBSTRATES | INDIAN INSTITUTE OF SCIENCE |
| WO/2021/005661 | INTEGRATED DICING/DIE BONDING FILM, DIE BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/005789 | COLUMNAR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | UNISANTIS ELECTRONICS SINGAPORE PTE. LTD. |
| WO/2021/005796 | FLEXIBLE LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND SUPPORT SUBSTRATE | SAKAI DISPLAY PRODUCTS CORPORATION |
| WO/2021/005798 | METHOD FOR MANUFACTURING FLEXIBLE LIGHT EMITTING DEVICE AND SUPPORT SUBSTRATE | SAKAI DISPLAY PRODUCTS CORPORATION |
| WO/2021/009838 | PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/014653 | SUBSTRATE STORAGE CONTAINER | MIRAIAL CO., LTD. |
| WO/2021/014657 | PROCESS CHAMBER OF EPITAXIAL GROWTH APPARATUS | EPICREW CORPORATION |
| WO/2021/019699 | SUBSTRATE STORAGE CONTAINER AND FILTER PART | MIRAIAL CO., LTD. |
| WO/2021/019700 | SUBSTRATE STORAGE CONTAINER | MIRAIAL CO., LTD. |
| WO/2021/024385 | SUBSTRATE TREATMENT DEVICE, SUBSTRATE SUPPORT, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/033320 | ACTIVATED GAS GENERATION DEVICE | TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
| WO/2021/038633 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/038699 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF | DENSO CORPORATION |
| WO/2021/038712 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/038785 | SUPPORT PIECE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUPPORT PIECE-FORMING LAYERED FILM | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/038815 | MEASUREMENT SYSTEM, METHOD FOR GENERATING LEARNING MODEL TO BE USED WHEN PERFORMING IMAGE MEASUREMENT OF SEMICONDUCTOR INCLUDING PREDETERMINED STRUCTURE, AND RECORDING MEDIUM FOR STORING PROGRAM FOR CAUSING COMPUTER TO EXECUTE PROCESSING FOR GENERATING LEARNING MODEL TO BE USED WHEN PERFORMING IMAGE MEASUREMENT OF SEMICONDUCTOR INCLUDING PREDETERMINED STRUCTURE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/038824 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/044504 | SUBSTRATE PROCESSING DEVICE, PLASMA GENERATION DEVICE, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/044581 | SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/044589 | MOLD-RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/044611 | RECIPE INFORMATION PRESENTATION SYSTEM AND RECIPE ERROR INFERENCE SYSTEM | HITACHI HIGH-TECH CORPORATION |
| WO/2021/044622 | LOAD LOCK DEVICE | CANON ANELVA CORPORATION |
| WO/2021/044623 | LOAD LOCK DEVICE | CANON ANELVA CORPORATION |
| WO/2021/048937 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/048983 | SUBSTRATE PROCESSING DEVICE | KIOXIA CORPORATION |
| WO/2021/048986 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SELECTING ADHESIVE LAYER, AND DICING DIE BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING SAME | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/048995 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PLASMA PROCESSING DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/053724 | SUBSTRATE PROCESSING APPARATUS, SUSCEPTOR COVER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/053726 | TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/053756 | PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE-PROCESSING DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/053761 | SEMICONDUCTOR DEVICE PRODUCTION METHOD, RECORDING MEDIUM, AND SUBSTRATE PROCESSING DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/053778 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/059332 | SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/059333 | SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SIGN DETECTION PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/059486 | SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/059492 | SUBSTRATE TREATMENT DEVICE, RAISING/LOWERING MECHANISM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/053836 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/064935 | MAGNETIC RECORDING LAYER, MAGNETIC DOMAIN WALL MOVING DEVICE, MAGNETIC RECORDING ARRAY | TDK CORPORATION |
| WO/2021/070252 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/070265 | SAMPLE STAGE AND OPTICAL INSPECTION DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/070366 | SEMICONDUCTOR DEVICE | SOCIONEXT INC. |
| WO/2021/070367 | SEMICONDUCTOR DEVICE | SOCIONEXT INC. |
| WO/2021/070381 | COMPONENT SUPPLY DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/075016 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/075036 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/079434 | SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING SAME | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/079511 | SEMICONDUCTOR DEVICE | SOCIONEXT INC. |
| WO/2021/084708 | RESIN COMPOSITION FOR PROVISIONAL FIXATION, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE AND METHOD FOR PRODUCING ELECTRONIC DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/084716 | RESIN COMPOSITION FOR TEMPORARY FIXATION, SUBSTRATE-CONVEYING SUPPORT TAPE, AND ELECTRONIC EQUIPMENT DEVICE MANUFACTURING METHOD | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/090442 | FUEL CELL ARRAY AND FUEL CELL INSPECTION METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/090471 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/024502 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/095232 | STORAGE SYSTEM AND WAFER | KIOXIA CORPORATION |
| WO/2021/095251 | STORAGE DEVICE AND CONTROL METHOD | KIOXIA CORPORATION |
| WO/2021/095252 | STORAGE DEVICE AND STORAGE SYSTEM | KIOXIA CORPORATION |
| WO/2021/100107 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/100185 | COMPONENT MOUNTING SYSTEM, COMPONENT FEEDER, AND COMPONENT MOUNTING METHOD | BONDTECH CO., LTD. |
| WO/2021/106090 | MEMORY DEVICE, AND METHOD FOR MANUFACTURING MEMORY DEVICE | KIOXIA CORPORATION |
| WO/2021/106190 | FIELD EFFECT TRANSISTOR AND METHOD FOR PRODUCING SAME | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/111521 | METHOD FOR FORMING SEMICONDUCTOR LAYER | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/111572 | SEMICONDUCTOR DEVICE | SANKEN ELECTRIC CO.,LTD. |
| WO/2021/124427 | PLASMA PROCESSING APPARATUS AND METHOD FOR OPERATING PLASMA PROCESSING APPARATUS | HITACHI HIGH-TECH CORPORATION |
| WO/2021/124428 | VACUUM TREATMENT DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/124539 | PLASMA PROCESSING DEVICE AND WAFER PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/130797 | MANUFACTURING METHOD FOR COMPONENT OF PLASMA TREATMENT DEVICE AND INSPECTION METHOD FOR COMPONENT | HITACHI HIGH-TECH CORPORATION |
| WO/2021/130798 | PLASMA TREATMENT METHOD AND WAVELENGTH SELECTING METHOD USED FOR PLASMA TREATMENT | HITACHI HIGH-TECH CORPORATION |
| WO/2021/130823 | DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANAGING QUALITY OF SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/130870 | SUBSTRATE INSPECTION DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/130975 | COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD | FUJI CORPORATION |
| WO/2021/140563 | HIGH-FREQUENCY SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/140632 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/140662 | PATTERN INSPECTING DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/144940 | POLISHING AGENT, STOCK SOLUTION FOR POLISHING AGENT, AND POLISHING METHOD | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/144982 | LIQUID CHEMICAL PROCESSING DEVICE | TOHO KASEI CO., LTD. |
| WO/2021/149151 | SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/149212 | PLASMA PROCESSING APPARATUS AND METHOD OF OPERATING PLASMA PROCESSING APPARATUS | HITACHI HIGH-TECH CORPORATION |
| WO/2021/152651 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/152655 | PLASMA TREATMENT DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/152705 | SUBSTRATE TREATMENT DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/131080 | JOINING METHOD, ITEM TO BE JOINED, AND JOINING DEVICE | BONDTECH CO., LTD. |
| WO/2021/156906 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/038909 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/156970 | STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER | ISHIHARA CHEMICAL CO., LTD. |
| WO/2021/156985 | TRANSPORT SYSTEM, TRANSPORT METHOD, AND TRANSPORT DEVICE | KABUSHIKI KAISHA YASKAWA DENKI |
| WO/2021/156987 | SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/157027 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/131081 | BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE | BONDTECH CO., LTD. |
| WO/2021/161364 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/161368 | PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/161384 | PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/161448 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/161509 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| WO/2021/090516 | ETCHING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/166024 | EPITAXIAL WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING EPITAXIAL WAFER | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/166081 | CU ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. |
| WO/2021/166161 | DEFECT INSPECTION SYSTEM, DEFECT INSPECTION METHOD, AND METHOD FOR CREATING TEACHER DATA | HITACHI HIGH-TECH CORPORATION |
| WO/2021/106234 | MEMORY DEVICE, AND METHOD FOR MANUFACTURING MEMORY DEVICE | KIOXIA CORPORATION |
| WO/2021/171458 | PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/171466 | PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/176505 | SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/033353 | VAPORIZER | LINTEC CO., LTD. |
| WO/2021/176739 | BONDING DEVICE, FRAME FEEDER, AND HEATER UNIT | SHINKAWA LTD. |
| WO/2021/181447 | METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT CHIP, AND COMPOSITION FOR PROTECTION | GOO CHEMICAL CO., LTD. |
| WO/2021/181450 | SUBSTRATE TREATMENT DEVICE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/181498 | SUBSTRATE TREATMENT DEVICE, EXHAUST FLOW RATE CONTROL DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/181545 | PLASMA PROCESSING DEVICE OR PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/181561 | MANUFACTURING METHOD FOR MOUNTING SUBSTRATE BY THREE-DIMENSIONAL LAMINATE MOLDING | FUJI CORPORATION |
| WO/2021/181613 | PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/181644 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/181685 | SUBSTRATE PROCESSING DEVICE, HEATING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/181697 | AL BONDING WIRE | NIPPON MICROMETAL CORPORATION |
| WO/2021/181700 | LASER ANNEAL DEVICE AND LASER ANNEAL METHOD | SAKAI DISPLAY PRODUCTS CORPORATION |
| WO/2021/186503 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/186546 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/186562 | SUBSTRATE TREATMENT DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/038938 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/186651 | CURRENT-VOLTAGE CONVERSION DEVICE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/186652 | CURRENT-VOLTAGE CONVERSION DEVICE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/186653 | CURRENT-VOLTAGE CONVERSION DEVICE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/186666 | SUBSTRATE WORKING MACHINE | FUJI CORPORATION |
| WO/2021/186677 | SUBSTRATE PROCESSING APPARATUS, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/186694 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/005842 | COLUMNAR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | UNISANTIS ELECTRONICS SINGAPORE PTE. LTD. |
| WO/2021/191956 | NITRIDE SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/192001 | VACUUM PROCESSING DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/192005 | SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE PRODUCTION METHOD, RECORDING MEDIUM AND INNER TUBE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/192075 | METHOD FOR FORMING SEMICONDUCTOR LAYER | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/192090 | SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIA, AND INNER TUBE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/192121 | Al BONDING WIRE | NIPPON MICROMETAL CORPORATION |
| WO/2021/084778 | FILM-LIKE ADHESIVE, METHOD FOR EVALUATING EASE OF CUTTING OF SAME, DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/024548 | SUBSTRATE PROCESSING APPARATUS | EBARA CORPORATION |
| WO/2021/192207 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/192210 | METHOD FOR PRODUCING SEMICONDUCTOR | HITACHI HIGH-TECH CORPORATION |
| WO/2021/192265 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/199126 | METHOD FOR MEASURING CARBON CONCENTRATION OF SILICON SUBSTRATE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/199298 | CRYSTAL GROWTH CONDITION ANALYSIS METHOD, CRYSTAL GROWTH CONDITION ANALYSIS SYSTEM, CRYSTAL GROWTH CONDITION ANALYSIS PROGRAM, AND DATA STRUCTURE FOR CRYSTAL GROWTH DATA | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/199420 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/199426 | POLISHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/005852 | JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYER | WORLD METAL CO., LTD. |
| WO/2021/205517 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/205532 | BONDING WIRE AND METHOD FOR MANUFACTURING SAME | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/205632 | ETCHING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/205643 | METHOD FOR MANUFACTURING NOZZLE SUBSTRATE | KONICA MINOLTA, INC. |
| WO/2021/210047 | METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/214854 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/214866 | HETEROJUNCTION BIPOLAR TRANSISTOR AND METHOD FOR PRODUCING SAME | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/214868 | PLASMA PROCESSING DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/214932 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/019855 | SEMICONDUCTOR ELEMENT MANUFACTURING METHOD AND SEMICONDUCTOR ELEMENT MANUFACTURING SYSTEM | FILNEX INC. |
| WO/2021/220329 | PLASMA TREATMENT DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/131097 | MICROWAVE PLASMA TREATMENT DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/229629 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/010004 | METHOD FOR FORMING INSULATION FILM | TOKYO ELECTRON LIMITED |
| WO/2021/229734 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/229787 | PLASMA PROCESSING APPARATUS INSPECTION METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/234813 | METHOD FOR FABRICATING FIELD-EFFECT TRANSISTOR | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/205674 | GOLD-COATED BONDING WIRE, MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR WIRE BONDING STRUCTURE, AND SEMICONDUCTOR DEVICE | TANAKA DENSHI KOGYO K.K. |
| WO/2021/234928 | TRANSPORT DEVICE, TRANSPORT METHOD, AND TRANSPORT SYSTEM | KABUSHIKI KAISHA YASKAWA DENKI |
| WO/2021/240572 | SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM AND SEMICONDUCTOR APPARATUS MANUFACTURING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/033386 | TEMPERATURE MEASUREMENT DEVICE, TEMPERATURE MEASUREMENT METHOD, AND PROGRAM FOR TEMPERATURE MEASUREMENT DEVICE | HORIBA STEC, CO., LTD. |
| WO/2021/019882 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/240598 | SUBSTRATE HOLDING DEVICE AND SUBSTRATE PROCESSING DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/053885 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/240603 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/019886 | INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM PHOSPHIDE SUBSTRATE | JX NIPPON MINING & METALS CORPORATION |
| WO/2021/019887 | INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR MANUFACTURING INDIUM PHOSPHIDE SUBSTRATE | JX NIPPON MINING & METALS CORPORATION |
| WO/2021/019888 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/240748 | SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, AND ELECTRIC POWER CONVERTER | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/245724 | COMPOSITE SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/245741 | METHOD FOR EVALUATING OUTER PERIPHERAL DISTORTION OF WAFER | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/014772 | SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/044682 | SEMICONDUCTOR SUBSTRATE EVALUATING METHOD | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/002141 | SUCTION DEVICE AND VACUUM PROCESS DEVICE | ULVAC, INC. |
| WO/2021/245893 | SEMICONDUCTOR DEVICE | TOHOKU UNIVERSITY |
| WO/2021/250782 | DISPLAY DEVICE AND METHOD FOR PRODUCING DISPLAY DEVICE | SHARP KABUSHIKI KAISHA |
| WO/2021/065086 | MAINTENANCE APPARATUS, MAINTENANCE METHOD, AND MAINTENANCE PROGRAM | ADVANTEST CORPORATION |
| WO/2021/152879 | SEMICONDUCTOR DEVICE AND ETCHING METHOD | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/255812 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/255842 | SEMICONDUCTOR WAFER | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/044705 | SOURCE/DRAIN ELECTRODE FOR ORGANIC SEMICONDUCTOR DEVICE, ORGANIC SEMICONDUCTOR DEVICE USING SAME, AND PRODUCTION METHOD FOR SOURCE/DRAIN ELECTRODE AND SEMICONDUCTOR DEVICE | THE UNIVERSITY OF TOKYO |
| WO/2021/053906 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | HITACHI, LTD. |
| WO/2021/049127 | LASER PROCESSING DEVICE AND LASER LIGHT MONITORING METHOD | THE JAPAN STEEL WORKS, LTD. |
| WO/2021/039073 | FLUID SUPPLY SYSTEM | FUJIKIN INCORPORATED |
| WO/2021/260833 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/260869 | VACUUM PROCESS METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/024638 | CLAMPING TOOL AND CLEANING DEVICE | KYOCERA CORPORATION |
| WO/2021/033427 | CLEANING METHOD OF HEATING MEMBER AND SUBSTRATE PROCESSING APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/039089 | SEMICONDUCTOR ELEMENT FORMING METHOD AND SUBSTRATE PROCESSING DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/006091 | SEPARATOR AND SEPARATION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/006092 | SEPARATING DEVICE AND SEPARATING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/024648 | ELECTRON BEAM INSPECTION DEVICE AND ELECTRON BEAM INSPECTION METHOD | NUFLARE TECHNOLOGY, INC. |
| WO/2021/002367 | SUBSTRATE TREATMENT SYSTEM AND TREATMENT SOLUTION PREPARATION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/020008 | SUBSTRATE TREATMENT DEVICE, METHOD OF PRODUCING SEMICONDUCTOR DEVICE, PROGRAM, AND GAS SUPPLY SYSTEM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/024654 | SUBSTRATE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/024659 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/024671 | EPITAXIAL SUBSTRATE AND PRODUCTION METHOD THEREFOR | SUMITOMO CHEMICAL COMPANY, LIMITED |
| WO/2021/049142 | SOLID-STATE IMAGE-CAPTURING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/020040 | METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE | SCIOCS COMPANY LIMITED |
| WO/2021/020041 | METHOD FOR PRODUCING STRUCTURAL BODY | SCIOCS COMPANY LIMITED |
| WO/2021/044724 | METHOD AND DEVICE FOR MANUFACTURING STRUCTURE | SCIOCS COMPANY LIMITED |
| WO/2021/010237 | OXIDE SEMICONDUCTOR FILM AND SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/039148 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/039153 | BOARD ACCOMMODATION CONTAINER | SHIN-ETSU POLYMER CO.,LTD. |
| WO/2021/015028 | JOINING DEVICE AND JOINING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/015030 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/020084 | SEMICONDUCTOR DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/033460 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICE | EBARA CORPORATION |
| WO/2021/010380 | SEMICONDUCTOR CHIP AND METHODS FOR MANUFACTURING SEMICONDUCTOR CHIP | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/010382 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SILICON CARBIDE SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/015045 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/029174 | WIRE BONDING DEVICE | SHINKAWA LTD. |
| WO/2021/033461 | SUBSTRATE TREATMENT DEVICE, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, PROGRAM, AND RECORDING MEDIUM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/010405 | METHOD FOR PRODUCING SILICON CARBIDE SEMICONDUCTOR DEVICE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/020124 | MOUNTING DEVICE | SHINKAWA LTD. |
| WO/2021/020136 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/029183 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND ELECTRONIC MACHINE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/015142 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND WIRING PATTERN FORMING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/020213 | SOLDER-ATTACHED PRODUCT MANUFACTURING DEVICE, AND SOLDER-ATTACHED PRODUCT MANUFACTURING METHOD | ORIGIN COMPANY, LIMITED |
| WO/2021/039218 | METHOD AND DEVICE FOR SUBSTRATE PROCESSING | TOKYO ELECTRON LIMITED |
| WO/2021/024810 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/015286 | MANUFACTURING METHOD FOR ELECTRONIC DEVICE, MANUFACTURING METHOD FOR MICRONEEDLE, AND MICRONEEDLE | THINK-LANDS CO., LTD. |
| WO/2021/020322 | TRENCH CAPACITOR | TAIYO YUDEN CO., LTD. |
| WO/2021/090542 | TRANSPORT VEHICLE SYSTEM | MURATA MACHINERY, LTD. |
| WO/2021/024844 | STAGE AND METHOD FOR CONTROLLING TEMPERATURE OF SUBSTRATE | NHK SPRING CO., LTD. |
| WO/2021/020460 | SUBSTRATE STORAGE CONTAINER AND FILTER UNIT | MIRAIAL CO., LTD. |
| WO/2021/020502 | GAS NOZZLE AND PLASMA PROCESSING DEVICE USING SAME | KYOCERA CORPORATION |
| WO/2021/039270 | DEVICE FOR PRODUCING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/039271 | SEMICONDUCTOR DEVICE FABRICATION METHOD AND FABRICATION APPARATUS | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/024972 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/029285 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/044791 | WAFER DELIVERY DEVICE, WAFER STORAGE CONTAINER, AND WAFER STORAGE SYSTEM | MURATA MACHINERY, LTD. |
| WO/2021/025044 | EPITAXIAL SUBSTRATE | SUMITOMO CHEMICAL COMPANY, LIMITED |
| WO/2021/053987 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/065203 | HEATING/COOLING DEVICE AND HEATING/COOLING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/033568 | CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/033572 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PRODUCTION SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/039357 | SUBSTRATE PROCESSING METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/044805 | SUBSTRATE STORAGE CONTAINER | SHIN-ETSU POLYMER CO.,LTD. |
| WO/2021/039365 | LASER ANNEALING DEVICE AND METHOD FOR FORMING CRYSTALLIZED FILM | V TECHNOLOGY CO., LTD. |
| WO/2021/033588 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/070469 | NITRIDE SEMICONDUCTOR DEVICE | PANASONIC CORPORATION |
| WO/2021/039389 | INFORMATION PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/039405 | BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/065216 | SEMICONDUCTOR ELEMENT, NON-VOLATILE STORAGE DEVICE, PRODUCT-SUM OPERATION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149286 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/039449 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/140697 | APPARATUS FOR CLEANING SEMICONDUCTOR WAFER AND METHOD FOR CLEANING SEMICONDUCTOR WAFER | SUMCO CORPORATION |
| WO/2021/054021 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING LIQUID | SCREEN HOLDINGS CO., LTD. |
| WO/2021/039631 | SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/044882 | FILM FORMATION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/049283 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/049306 | FILM FORMING METHOD, FILM FORMING DEVICE, AND FILM FORMING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/039898 | INSPECTION JIG AND INSPECTION DEVICE | NIDEC-READ CORPORATION |
| WO/2021/049313 | SEMICONDUCTOR SAMPLE INSPECTION DEVICE AND INSPECTION METHOD | HAMAMATSU PHOTONICS K.K. |
| WO/2021/075162 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME | FUJI ELECTRIC CO.,LTD. |
| WO/2021/049330 | PROCESSING LIQUID, PROCESSING METHOD | FUJIFILM CORPORATION |
| WO/2021/049336 | TEST SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/192352 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/049368 | SUBSTRATE PROCESSING DEVICE AND METHOD FOR CONCTROLLING SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/079624 | DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND ETCHING DEVICE | CENTRAL GLASS COMPANY, LIMITED |
| WO/2021/059900 | DICING SYSTEM AND DICING METHOD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/045069 | LOAD LOCK DEVICE | CANON ANELVA CORPORATION |
| WO/2021/045070 | LOAD LOCK DEVICE | CANON ANELVA CORPORATION |
| WO/2021/054135 | VAPORIZED FEED DEVICE | FUJIKIN INCORPORATED |
| WO/2021/045157 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/049442 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/054158 | SEMICONDUCTOR DEVICE PRODUCTION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/106304 | JIG | YOKOWO CO., LTD. |
| WO/2021/054185 | INSPECTION SYSTEM AND INSPECTION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/049499 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | FUJI ELECTRIC CO., LTD. |
| WO/2021/065393 | IMPRINTING MOLD, IMPRINTING METHOD, AND METHOD FOR MANUFACTURING ARTICLE | CANON KABUSHIKI KAISHA |
| WO/2021/054227 | METHOD FOR FORMING METAL OXIDE FILM AND FILM-FORMING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/054230 | METHOD FOR FORMING METAL OXIDE FILM AND FILM FORMATION APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/084933 | INSPECTION DEVICE, METHOD, AND PROGRAM | ALITECS CORPORATION |
| WO/2021/054260 | VACUUM TRANSFER DEVICE AND METHOD FOR CONTROLLING VACUUM TRANSFER DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/054265 | JOINING DEVICE AND JOINING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/065428 | HYDROFLUOROETHER-CONTAINING SOLVENT AND METHOD FOR TREATING SUBSTRATE USING HYDROFLUOROETHER-CONTAINING SOLVENT | CENTRAL GLASS COMPANY, LIMITED |
| WO/2021/084939 | SEMICONDUCTOR WAFER EVALUATION METHOD, SEMICONDUCTOR WAFER SORTING METHOD, AND DEVICE MANUFACTURING METHOD | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/060036 | PROCESSING LIQUID NOZZLE AND CLEANING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/060037 | SUBSTRATE LIQUID TREATMENT METHOD AND SUBSTRATE LIQUID TREATMENT DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/181730 | DILUTE CHEMICAL SUPPLY DEVICE | KURITA WATER INDUSTRIES LTD. |
| WO/2021/060084 | RAW MATERIAL SUPPLY APPARATUS AND RAW MATERIAL SUPPLY METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/060092 | FILM FORMING METHOD AND FILM FORMING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/070584 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/060109 | FILM FORMATION METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/060110 | FILM-FORMING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/060111 | FILM-FORMING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/079659 | ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE PILLAR | DIC CORPORATION |
| WO/2021/060140 | SUBSTRATE PROCESSING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/084959 | IMAGING DEVICE AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/070599 | METHOD AND DEVICE FOR MANUFACTURING GLASS PLATE PACKAGE | NIPPON ELECTRIC GLASS CO., LTD. |
| WO/2021/065590 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/131186 | CONVEYANCE SYSTEM | SINFONIA TECHNOLOGY CO., LTD. |
| WO/2021/060259 | TRANSPORT SYSTEM | SINFONIA TECHNOLOGY CO., LTD. |
| WO/2021/070624 | BONDING DEVICE AND BONDING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/095374 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND IMAGE-CAPTURING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/070661 | BONDING SYSTEM AND METHOD FOR INSPECTING MULTILAYER SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/065803 | METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE | KYOCERA CORPORATION |
| WO/2021/065843 | MAINTENANCE APPARATUS, MAINTENANCE METHOD, AND MAINTENANCE PROGRAM | ADVANTEST CORPORATION |
| WO/2021/065897 | HOLDING TOOL AND MANUFACTURING METHOD | FUDOW COMPANY LIMITED |
| WO/2021/065919 | MEMBER FOR PLASMA PROCESSING APPARATUSES AND PLASMA PROCESSING APPARATUS PROVIDED WITH SAME | KYOCERA CORPORATION |
| WO/2021/070682 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/100332 | SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE CAPTURING DEVICE, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/066137 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/079724 | MEMBER FOR SEMICONDUCTOR CLEANING APPARATUS | DAIKIN INDUSTRIES, LTD. |
| WO/2021/070782 | ELECTRONIC COMPONENT PROCESSING DEVICE | UENO SEIKI CO., LTD. |
| WO/2021/090624 | METHOD FOR CALIBRATING COORDINATE POSITION IDENTIFICATION PRECISION OF LASER SURFACE INSPECTION DEVICE, AND SEMICONDUCTOR WAFER EVALUATION METHOD | SUMCO CORPORATION |
| WO/2021/186773 | SEMICONDUCTOR DEVICE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
| WO/2021/075330 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/161582 | SUBSTRATE CONVEYING DEVICE, AND SUBSTRATE POSITIONAL DISPLACEMENT MEASURING METHOD | KAWASAKI JUKOGYO KABUSHIKI KAISHA |
| WO/2021/070910 | NITRIDE SEMICONDUCTOR STRUCTURE, NITRIDE SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/075353 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/079779 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/079780 | ETCHING METHOD FOR SILICON NITRIDE AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | SHOWA DENKO K.K. |
| WO/2021/095420 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/075434 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/075475 | DEVICE MANAGEMENT SYSTEM | UHURU CORPORATION |
| WO/2021/131253 | VAPOR PHASE GROWTH DEVICE | SUMCO CORPORATION |
| WO/2021/090657 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/095433 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/085160 | SUBSTRATE PROCESSING METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/075540 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/117341 | MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME | AGC INC. |
| WO/2021/085212 | SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/085213 | SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/079879 | SEMICONDUCTOR DEVICE AND DICING METHOD | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/117351 | WAFER MANUFACTURING SYSTEM | SUMCO CORPORATION |
| WO/2021/131276 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/095474 | METHOD FOR ETCHING CRYSTALLINE OXIDE, METHOD FOR FORMING TRENCH, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/152934 | PASSIVE COMPONENT WITH ELECTRODE AND ASSEMBLY OF PASSIVE COMPONENT WITH ELECTRODE | MURATA MANUFACTURING CO., LTD. |
| WO/2021/079955 | FILM FOR FORMING PROTECTIVE FILM, COMPOSITE SHEET FOR FORMING PROTECTIVE FILM, AND PRODUCTION METHOD OF SMALL PIECE WITH PROTECTIVE FILM | LINTEC CORPORATION |
| WO/2021/124689 | OPTICAL SENSOR | JAPAN DISPLAY INC. |
| WO/2021/090737 | EXHAUST GAS TREATMENT DEVICE | EDWARDS JAPAN LIMITED |
| WO/2021/085463 | ELECTRONIC COMPONENT CONVEYING DEVICE | UENO SEIKI CO., LTD. |
| WO/2021/100427 | FILM FORMING METHOD AND FILM FORMING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/124693 | METHOD FOR PRODUCING EPITAXIAL SILICON WAFER | SUMCO CORPORATION |
| WO/2021/152943 | IMAGING DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/085556 | SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | KYOCERA CORPORATION |
| WO/2021/085558 | SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/095553 | TRANSPORT DEVICE AND TRANSPORT METHOD | MCK CO., LTD. |
| WO/2021/152945 | STORAGE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SONY GROUP CORPORATION |
| WO/2021/100446 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/240840 | PICKUP DEVICE AND PICKUP METHOD | CANON MACHINERY INC. |
| WO/2021/090798 | ETCHING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/100466 | METHOD FOR REMOVING ADHERING MATERIAL AND FILM FORMING METHOD | SHOWA DENKO K.K. |
| WO/2021/090848 | METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE, AND EPITAXIAL SUBSTRATE | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| WO/2021/149324 | SUBSTRATE PROCESSING APPARATUS | J.E.T. CO., LTD. |
| WO/2021/181747 | SEMICONDUCTOR DEVICE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
| WO/2021/106527 | SUBSTRATE BONDING DEVICE AND METHOD | NIKON CORPORATION |
| WO/2021/090944 | SEMICONDUCTOR DEVICE | NEW JAPAN RADIO CO., LTD. |
| WO/2021/149330 | WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHOD | HAMAMATSU PHOTONICS K.K. |
| WO/2021/111818 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/117402 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/124732 | APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SHINKAWA LTD. |
| WO/2021/106580 | CHEMICAL SOLUTION FOR FORMING PROTECTIVE FILM, AND METHOD FOR CLEANING WAFER | CENTRAL GLASS CO., LTD. |
| WO/2021/100579 | IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/106581 | CONTROL DEVICE, SUBSTRATE PROCESSING SYSTEM, AND CONTROL METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/100583 | Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. |
| WO/2021/100591 | SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD | SHINKAWA LTD. |
| WO/2021/106597 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/100605 | SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/095823 | CLEANING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING CLEANING SHEET | TOHOKU BUTSURYU CO., LTD. |
| WO/2021/100625 | SEMICONDUCTOR DEVICE, ELECTRICAL CIRCUIT AND WIRELESS COMMUNICATION DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124756 | VAPOR PHASE GROWTH APPARATUS AND VAPOR PHASE GROWTH METHOD | SUMCO CORPORATION |
| WO/2021/100675 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/166345 | SEMICONDUCTOR FAILURE ANALYSIS DEVICE AND SEMICONDUCTOR FAILURE ANALYSIS METHOD | HAMAMATSU PHOTONICS K.K. |
| WO/2021/106704 | FILM-FORMING APPARATUS AND METHOD OF USING FILM-FORMING APPARATUS | AIR WATER INC. |
| WO/2021/106717 | METHOD FOR CONTROLLING SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/117448 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/131449 | CLEANING SOLUTION AND CLEANING METHOD | FUJIFILM ELECTRONIC MATERIALS CO., LTD. |
| WO/2021/131451 | CLEANING METHOD AND CLEANING FLUID | FUJIFILM ELECTRONIC MATERIALS CO., LTD. |
| WO/2021/124800 | SILICON CARBIDE SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| WO/2021/106809 | SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SYSTEM HAVING SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/106811 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM | FLOSFIA INC. |
| WO/2021/140763 | EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/111918 | FOREIGN MATTER INSPECTION DEVICE, FOREIGN MATTER INSPECTION METHOD, PROCESSING DEVICE, AND ARTICLE MANUFACTURING METHOD | CANON KABUSHIKI KAISHA |
| WO/2021/124810 | METHOD FOR MANUFACTURING PASSIVATION FILM | SHOWA DENKO K.K. |
| WO/2021/117485 | SUBSTRATE CLEANING SYSTEM AND SUBSTRATE CLEANING METHOD | EBARA CORPORATION |
| WO/2021/152983 | TREATMENT CONDITION SPECIFICATION METHOD, SUBSTRATE TREATMENT METHOD, SUBSTRATE PRODUCT MANUFACTURING METHOD, COMPUTER PROGRAM, STORAGE MEDIUM, TREATMENT CONDITION SPECIFICATION DEVICE, AND SUBSTRATE TREATMENT DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/106939 | SEMICONDUCTOR APPARATUS | ROHM CO., LTD. |
| WO/2021/131472 | PROTECTIVE FILM FORMATION AGENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP | TOKYO OHKA KOGYO CO., LTD. |
| WO/2021/149350 | IMAGING ELEMENT AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/140776 | COMPOUND SEMICONDUCTOR APPARATUS, AMD METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/107115 | CIRCUIT SUBSTRATE, SUBSTRATE FOR PROBE CARD, AND PROBE CARD | KYOCERA CORPORATION |
| WO/2021/112022 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/145079 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/145080 | SEMICONDUCTOR APPARATUS | FUJI ELECTRIC CO., LTD. |
| WO/2021/117534 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/117556 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/112130 | WAFER PROCESSING DEVICE | REXXAM CO., LTD. |
| WO/2021/117585 | IMAGING ELEMENT PACKAGE AND METHOD OF MANUFACTURING IMAGING ELEMENT PACKAGE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/124900 | SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/181768 | CLEANING METHOD OF ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELEMENT CHIP | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/161635 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | JAPAN DISPLAY INC. |
| WO/2021/131671 | SUBSTRATE PROCESSING APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/117728 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE TREATMENT DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/145110 | HOLDING DEVICE | NGK SPARK PLUG CO., LTD. |
| WO/2021/153033 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/125094 | SEMICONDUCTOR STORAGE DEVICE | SOCIONEXT INC. |
| WO/2021/131808 | METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE | KYOCERA CORPORATION |
| WO/2021/117898 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | CONNECTEC AMERICA, INC. |
| WO/2021/131832 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/125138 | SEMICONDUCTOR STORAGE DEVICE | SOCIONEXT INC. |
| WO/2021/131873 | FILM FORMATION METHOD AND FILM FORMATION APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/131891 | TRENCH TYPE MOSFET | NOVEL CRYSTAL TECHNOLOGY, INC. |
| WO/2021/131893 | TRENCH-TYPE MESFET | NOVEL CRYSTAL TECHNOLOGY, INC. |
| WO/2021/131897 | SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE PROVIDED WITH SOLDER BUMP | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/140849 | POLYCRYSTALLINE FILM, METHOD FOR FORMING POLYCRYSTALLINE FILM, LASER CRYSTALLIZATION DEVICE AND SEMICONDUCTOR DEVICE | V TECHNOLOGY CO., LTD. |
| WO/2021/131905 | SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE PROVIDED WITH SOLDER BUMP | SHOWA DENKO MATERIALS CO., LTD. |
| WO/2021/131972 | SUBSTRATE PROCESSING APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/132010 | FILM FORMING METHOD AND FILM FORMING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/132122 | CLEANING DEVICE, POLISHING DEVICE, AND DEVICE AND METHOD FOR CALCULATING ROTATIONAL RATE OF SUBSTRATE IN CLEANING DEVICE | EBARA CORPORATION |
| WO/2021/132133 | SEMICONDUCTOR CHIP CLEANING METHOD AND SEMICONDUCTOR CHIP CLEANING DEVICE | YAMAHA ROBOTICS HOLDINGS CO., LTD. |
| WO/2021/132142 | IMPRINTING DEVICE AND IMPRINTING METHOD | SCIVAX CORPORATION |
| WO/2021/132145 | SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TAMURA CORPORATION |
| WO/2021/140898 | NITRIDE SEMICONDUCTOR DEVICE | PANASONIC CORPORATION |
| WO/2021/132163 | FILM FORMATION METHOD AND FILM FORMATION DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/125358 | GAS SUPPLY METHOD, SUBSTRATE PROCESSING METHOD, AND GAS SUPPLY DEVICE | SHINWA CONTROLS CO., LTD |
| WO/2021/140904 | CONTACTOR, INSPECTION JIG, INSPECTION DEVICE, AND METHOD FOR MANUFACTURING SAID CONTACTOR | NIDEC READ CORPORATION |
| WO/2021/171764 | PLASMA PROCESSING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/161668 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR | FUJI ELECTRIC CO., LTD. |
| WO/2021/145182 | OPTICAL PROBE, PROBE CARD, MEASURING SYSTEM, AND MEASURING METHOD | KABUSHIKI KAISHA NIHON MICRONICS |
| WO/2021/132443 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/220551 | PLASMA TREATMENT DEVICE | HITACHI HIGH-TECH CORPORATION |
| WO/2021/132481 | RESISTIVITY MEASURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, RESISTIVITY MEASURING PROGRAM, AND RESISTIVITY MEASURING DEVICE | KOKUSAI ELECTRIC SEMICONDUCTOR SERVICE INC. |
| WO/2021/132611 | IC CHIP-MOUNTING DEVICE AND IC CHIP-MOUNTING METHOD | SATO HOLDINGS KABUSHIKI KAISHA |
| WO/2021/132613 | IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD | SATO HOLDINGS KABUSHIKI KAISHA |
| WO/2021/132614 | IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD | SATO HOLDINGS KABUSHIKI KAISHA |
| WO/2021/171785 | SEMICONDUCTOR DEVICE, AND TEST SYSTEM | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/192481 | METHOD OF MANUFACTURING ELECTRODE PLATE FOR PLASMA PROCESSING DEVICE AND ELECTRODE PLATE FOR PLASMA PROCESSING DEVICE | MITSUBISHI MATERIALS CORPORATION |
| WO/2021/153169 | SEMICONDUCTOR STORAGE DEVICE | SOCIONEXT INC. |
| WO/2021/153171 | COMPOSITION, AND SUBSTRATE PROCESSING METHOD | FUJIFILM CORPORATION |
| WO/2021/171798 | IMAGING DEVICE AND LIGHT DETECTION DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/149532 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/153219 | ETCHING METHOD | SHOWA DENKO K.K. |
| WO/2021/171806 | SUBSTRATE PROCESSING APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/171810 | SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/192502 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/149551 | TRANSFER DEVICE, PROCESSING SYSTEM, AND TRANSFER METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/166496 | SEMICONDUCTOR FAULT ANALYSIS DEVICE AND SEMICONDUCTOR FAULT ANALYSIS METHOD | HAMAMATSU PHOTONICS K.K. |
| WO/2021/157316 | SUCTIONING ASSISTANCE FILM AND METHOD FOR SUCTIONING SEMICONDUCTOR WAFER | MITSUI CHEMICALS TOHCELLO, INC. |
| WO/2021/181863 | ASSESSMENT DEVICE, TEST SYSTEM, ASSESSMENT METHOD, AND ASSESSMENT PROGRAM | ADVANTEST CORPORATION |
| WO/2021/145397 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/149599 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/171823 | TERMINAL AND CONNECTION METHOD | SONY GROUP CORPORATION |
| WO/2021/220559 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | HAMAMATSU PHOTONICS K.K. |
| WO/2021/153361 | METHOD FOR REMOVING SEMICONDUCTOR CHIP WITH PROTECTIVE FILM | LINTEC CORPORATION |
| WO/2021/192551 | METHOD FOR FORMING SEMICONDUCTOR LAYER | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
| WO/2021/153404 | SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/153416 | JOINING DEVICE AND JOINING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/199611 | WAFER PROCESSING DEVICE, FLUID DISCHARGE DEVICE, FLUID SUPPLY DEVICE, AND FLUID SUPPLY METHOD | REXXAM CO., LTD. |
| WO/2021/153452 | SUBSTRATE HOLDING APPARATUS | V TECHNOLOGY CO., LTD. |
| WO/2021/176879 | SUBSTRATE PROCESSING DEVICE, JIG, CALIBRATION METHOD FOR SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/157440 | FILTER CLEANING SYSTEM AND FILTER CLEANING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/181923 | GRIPPER DEVICE, CONVEYANCE VEHICLE, AND CONVEYANCE METHOD | MURATA MACHINERY, LTD. |
| WO/2021/181924 | GRIPPER DEVICE, CONVEYANCE VEHICLE, AND CONVEYANCE METHOD | MURATA MACHINERY, LTD. |
| WO/2021/229860 | MANUFACTURING ASSIST SYSTEM AND MANUFACTURING ASSIST METHOD | TOWA CORPORATION |
| WO/2021/176903 | TREATMENT LIQUID | FUJIFILM CORPORATION |
| WO/2021/157470 | CUTTING DEVICE, BONDING MATERIAL TRANSFER DEVICE, AND MOUNTING DEVICE | TORAY ENGINEERING CO., LTD. |
| WO/2021/161824 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/176913 | PROCESSING SOLUTION AND PROCESSING SOLUTION CONTAINER | FUJIFILM CORPORATION |
| WO/2021/157523 | SAMPLE HOLDER | KYOCERA CORPORATION |
| WO/2021/157544 | HEAT TREATMENT APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/171931 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/161855 | SOLID-STATE IMAGING ELEMENT AND IMAGING SYSTEM | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/157578 | OPTICAL DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS THAT USE LOCAL ETCHING | NTT ELECTRONICS CORPORATION |
| WO/2021/171935 | HEAT TREATMENT METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/166645 | SEMICONDUCTOR STORAGE DEVICE | SOCIONEXT INC. |
| WO/2021/199665 | SOLID-STATE IMAGING DEVICE, PRODUCTION METHOD FOR SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/161897 | PHOSPHATING LIQUID RECLAMATION DEVICE, SUBSTRATE PROCESSING DEVICE, PHOSPHATING LIQUID RECLAMATION METHOD AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/166674 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/171969 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | SOCIONEXT INC. |
| WO/2021/166696 | WORKPIECE CUTTING METHOD AND RESIN APPLYING DEVICE | KYORITSU CHEMICAL & CO., LTD. |
| WO/2021/176952 | TREATMENT LIQUID AND TREATMENT LIQUID STORAGE BODY | FUJIFILM CORPORATION |
| WO/2021/157719 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | FLOSFIA INC. |
| WO/2021/186944 | METHOD FOR CONTROLLING DONOR CONCENTRATION IN SILICON SINGLE CRYSTAL SUBSTRATE | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/171986 | DRY ETCHING METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT, AND CLEANING METHOD | SHOWA DENKO K.K. |
| WO/2021/192662 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE INVERTING METHOD | SCREEN HOLDINGS CO., LTD. |
| WO/2021/199687 | METHOD FOR CONTROLLING DONOR CONCENTRATION IN SILICON SINGLE CRYSTAL SUBSTRATE | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/186954 | PROCESSING DEVICE, DISPLAY DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/192700 | JOINED STRUCTURE | AGC INC. |
| WO/2021/186965 | SURFACE-EMITTING LASER ELEMENT AND SURFACE-EMITTING LASER ELEMENT MANUFACTURING METHOD | KYOTO UNIVERSITY |
| WO/2021/261003 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
| WO/2021/162083 | METHOD FOR PRODUCING STRUCTURAL BODY AND APPARAUS FOR PRODUCING STRUCTURAL BODY | SCIOCS COMPANY LIMITED |
| WO/2021/176996 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/162107 | METHOD FOR RECYCLING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | KYOCERA CORPORATION |
| WO/2021/172064 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/172067 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR, AND FIELD EFFECT TRANSISTOR | WASEDA UNIVERSITY |
| WO/2021/172074 | PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/245992 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/182046 | DIAMOND FIELD EFFECT TRANSISTOR AND MEHTOD FOR PRODUCING SAME | WASEDA UNIVERSITY |
| WO/2021/166963 | SINGULATION METHOD | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/220590 | SEMICONDUCTOR WAFER CLEANING METHOD | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/172176 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/167060 | SOLID-STATE IMAGING DEVICE | TOWER PARTNERS SEMICONDUCTOR CO., LTD. |
| WO/2021/167083 | COPPER BONDING WIRE | NIPPON MICROMETAL CORPORATION |
| WO/2021/182083 | INSPECTION JIG AND SUBSTRATE INSPECTION DEVICE COMPRISING SAME | NIDEC READ CORPORATION |
| WO/2021/177078 | SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/172397 | SEMICONDUCTOR PROCESS LIQUID FOR RUTHENIUM | TOKUYAMA CORPORATION |
| WO/2021/172400 | SUBSTRATE HOLDING HAND AND SUBSTRATE TRANSFER ROBOT | KAWASAKI JUKOGYO KABUSHIKI KAISHA |
| WO/2021/172427 | POLISHING COMPOSITION INCLUDING ZIRCONIA PARTICLES AND OXIDIZING AGENT | FUJIMI INCORPORATED |
| WO/2021/192800 | SEMICONDUCTOR INTEGRATED CIRCUIT | KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO |
| WO/2021/192801 | PROCESS MONITOR AND PROCESS MONITORING METHOD | SUMITOMO HEAVY INDUSTRIES, LTD. |
| WO/2021/192832 | LAMINATE, METHOD FOR MANUFCTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. |
| WO/2021/240935 | ETCHING METHOD FOR SILICON WAFER | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/229894 | SILICON WAFER ETCHING METHOD AND ETCHING APPARATUS | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/177292 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | DENSO CORPORATION |
| WO/2021/192853 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/192854 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/182189 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/182193 | PROBE CARD | NHK SPRING CO., LTD. |
| WO/2021/182225 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/187104 | SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/187105 | GROUP MANAGEMENT DEVICE AND GROUP MANAGEMENT SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/229898 | DRY ETCHING METHOD OF SEMICONDUCTOR SUBSTRATE AND DRY ETCHING METHOD OF SILICON OXIDE FILM | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/182277 | POLISHING COMPOSITION AND POLISHING METHOD | FUJIMI INCORPORATED |
| WO/2021/182278 | POLISHING COMPOSITION AND POLISHING METHOD | FUJIMI INCORPORATED |
| WO/2021/182292 | SUBSTRATE-PROCESSING DEVICE, EXHAUST FLOW RATE CONTROL DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/177409 | ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFACTURING METHOD | TDK CORPORATION |
| WO/2021/182311 | DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DRY ETCHING GAS COMPOSITION | CENTRAL GLASS COMPANY, LIMITED |
| WO/2021/187163 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/199919 | METHOD FOR PRODUCING ELECTRONIC DEVICE | MITSUI CHEMICALS TOHCELLO, INC. |
| WO/2021/187174 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/182352 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/192935 | ELECTROSTATIC CHUCK DEVICE AND SLEEVE FOR ELECTROSTATIC CHUCK DEVICE | TOMOEGAWA CO., LTD. |
| WO/2021/177466 | CONTROL DEVICE, CONTROL METHOD, AND PROGRAM | NIKON CORPORATION |
| WO/2021/192938 | METHOD FOR MANUFACTURING BONDED WAFER AND BONDED WAFER | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/225027 | METHOD FOR FORMING THERMAL OXIDE FILM OF SEMICONDUCTOR SUBSTRATE | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/240944 | SEMICONDUCTOR DEVICE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
| WO/2021/192990 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/240945 | ELECTROSTATIC CHUCK | NGK INSULATORS, LTD. |
| WO/2021/193016 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND SUBSTRATE PROCESSING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/187263 | SUBLIMABLE FILM FORMATION COMPOSITION AND METHOD FOR PRODUCING SUBSTRATE | CENTRAL GLASS COMPANY, LIMITED |
| WO/2021/240948 | METHOD FOR FORMING THERMAL OXIDE FILM OF SEMICONDUCTOR SUBSTRATE | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/182524 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| WO/2021/187277 | SUBSTRATE TREATMENT APPARATUS, HEAT INSULATION MATERIAL ASSEMBLY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/182532 | IMPRINT DEVICE | SCIVAX CORPORATION |
| WO/2021/182545 | PRODUCTION METHOD FOR PATTERNED ORGANIC FILM, PRODUCTION APPARATUS FOR PATTERNED ORGANIC FILM, ORGANIC SEMICONDUCTOR DEVICE PRODUCED BY SAME, AND INTEGRATED CIRCUIT INCLUDING ORGANIC SEMICONDUCTOR DEVICE | THE UNIVERSITY OF TOKYO |
| WO/2021/220633 | SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR GENERATING LEARNED MODEL, AND LEARNED MODEL | SCREEN HOLDINGS CO., LTD. |
| WO/2021/187319 | SUBSTRATE CONVEYANCE MODULE, PROCESSING SYSTEM, AND SUBSTRATE CONVEYANCE METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/187339 | CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICE | NIDEC READ CORPORATION |
| WO/2021/187340 | LOAD PORT ADAPTER | NIDEC READ CORPORATION |
| WO/2021/193135 | MOUNTING METHOD, MOUNTING DEVICE, AND TRANSFER DEVICE | TORAY ENGINEERING CO., LTD. |
| WO/2021/193150 | COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING BONDED STRUCTURE | MITSUI MINING & SMELTING CO., LTD. |
| WO/2021/193160 | METHOD AND APPARATUS FOR FORMING SILICON CARBIDE-CONTAINING FILM | TOKYO ELECTRON LIMITED |
| WO/2021/193164 | METHOD AND DEVICE FOR FORMING SILICON CARBIDE-CONTAINING FILM | TOKYO ELECTRON LIMITED |
| WO/2021/187422 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/187425 | SUBSTRATE PROCESSING DEVICE, EXHAUST DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/200074 | TRANSFER DEVICE, AND POSITION CORRECTION METHOD FOR TRANSFER DEVICE | TORAY ENGINEERING CO., LTD. |
| WO/2021/215145 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/193302 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/200174 | IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193338 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/200240 | ETCHING METHOD AND ETCHING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/200263 | MOUNTING DEVICE | TORAY ENGINEERING CO., LTD. |
| WO/2021/193473 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE STAGE COVER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/193480 | SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/210350 | FILM-FORMING DEVICE AND FILM-FORMING METHOD | SHIN-ETSU CHEMICAL CO., LTD. |
| WO/2021/205855 | WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD | SHIN-ETSU ENGINEERING CO., LTD. |
| WO/2021/193516 | SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELING | NISSAN CHEMICAL CORPORATION |
| WO/2021/193535 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| WO/2021/256040 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/193629 | WIDE GAP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING WIDE GAP SEMICONDUCTOR DEVICE | SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. |
| WO/2021/215178 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | ROHM CO., LTD. |
| WO/2021/205884 | SEMICONDUCTOR DEVICE | KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO |
| WO/2021/210368 | ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENTS | SHOWA DENKO K.K. |
| WO/2021/200660 | WAFER PROCESSING SHEET AND WAFER PROCESSING METHOD | DENKA COMPANY LIMITED |
| WO/2021/205909 | SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/205918 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/200786 | ADHESIVE SHEET | LINTEC CORPORATION |
| WO/2021/200810 | CERAMIC CIRCUIT BOARD WITH RESIST CURED FILM, MANUFACTURING METHOD THEREFOR, AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD | DENKA COMPANY LIMITED |
| WO/2021/205925 | INTEGRATED CIRCUIT | MINEBEA MITSUMI INC. |
| WO/2021/220696 | SELECTIVE FILM FORMATION MEHTOD | TOKYO ELECTRON LIMITED |
| WO/2021/225047 | DEPOSITION DEVICE AND PLATE | NUFLARE TECHNOLOGY, INC. |
| WO/2021/205931 | AG ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | NIPPON MICROMETAL CORPORATION |
| WO/2021/200861 | BONDED SUBSTRATE | KYOCERA CORPORATION |
| WO/2021/210380 | JOINING SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/210385 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/201037 | STAMP TOOL , TRANSFER DEVICE , AND ELEMENT ARRAY MANUFACTURING METHOD | TDK CORPORATION |
| WO/2021/201038 | STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MULTI-COMPONENT TRANSFER APPARATUS, AND METHOD FOR MANUFACTURING ELEMENT ARRAY | TDK CORPORATION |
| WO/2021/250984 | SEMICONDUCTOR INSPECTING METHOD AND SEMICONDUCTOR INSPECTING DEVICE | HAMAMATSU PHOTONICS K.K. |
| WO/2021/201108 | FLOW PATH MEMBER AND METHOD FOR MANUFACTURING SAME | KYOCERA CORPORATION |
| WO/2021/240990 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/201216 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/201219 | COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR | SHIN-ETSU CHEMICAL CO., LTD. |
| WO/2021/201220 | COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR | SHIN-ETSU CHEMICAL CO., LTD. |
| WO/2021/201235 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/205994 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/240998 | SOLID-STATE IMAGING ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/210431 | SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/210451 | SUBSTRATE ARRANGEMENT DEVICE, TRANSPORT DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/241017 | JOINING JIG AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
| WO/2021/215247 | BACK-GRINDING ADHESIVE FILM, AND ELECTRONIC DEVICE MANUFACTURING METHOD | MITSUI CHEMICALS TOHCELLO, INC. |
| WO/2021/220768 | SHEET DETACHMENT METHOD AND SHEET DETACHMENT DEVICE, AND DIVIDING METHOD AND DIVIDING DEVICE | LINTEC CORPORATION |
| WO/2021/220772 | POWER AMPLIFYING DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/241044 | METHOD FOR MANUFACTURING SOI WAFER | SHIN-ETSU HANDOTAI CO., LTD. |
| WO/2021/250996 | PROCESSING DEVICE AND METHOD | TOKYO SEIMITSU CO., LTD. |
| WO/2021/241058 | SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/220834 | ETCHING METHOD AND ETCHING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/220841 | PRE-COATING METHOD AND TREATMENT DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/241059 | SEMICONDUCTOR DEVICE | SONY GROUP CORPORATION |
| WO/2021/225066 | SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD | SHINKAWA LTD. |
| WO/2021/241065 | SUCTION-ATTRACTING MECHANISM, ARTICLE MANUFACTURING DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE | CANON KABUSHIKI KAISHA |
| WO/2021/220865 | CLEANING METHOD FOR CUP OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | TOKYO ELECTRON LIMITED |
| WO/2021/206185 | INSPECTION JIG AND INSPECTION DEVICE | NIDEC-READ CORPORATION |
| WO/2021/215445 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/215466 | BONDED SUBSTRATE | KYOCERA CORPORATION |
| WO/2021/220906 | PATTERN DEFECT DETECTION METHOD | TASMIT, INC. |
| WO/2021/241095 | DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SHINKAWA LTD. |
| WO/2021/220965 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
| WO/2021/230060 | METHOD FOR MANUFACTURING BARRIER METAL-FREE METAL WIRING STRUCTURE, AND BARRIER METAL-FREE METAL WIRING STRUCTURE | EBARA CORPORATION |
| WO/2021/225091 | FILM FORMING METHOD AND FILM FORMING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/221092 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
| WO/2021/241124 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, METHOD FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR GENERATING LEARNED MODEL, AND LEARNED MODEL | SCREEN HOLDINGS CO., LTD. |
| WO/2021/235227 | PATTERN MEASUREMENT METHOD | TASMIT, INC. |
| WO/2021/235269 | BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD | SHINKAWA LTD. |
| WO/2021/230283 | SEMICONDUCTOR DEVICE FOR POWER AMPLIFICATION | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/241231 | SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD FOR GENERATING TRAINING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR GENERATING TRAINED MODEL, AND TRAINED MODEL | SCREEN HOLDINGS CO., LTD. |
| WO/2021/261102 | ELECTRONIC COMPONENT | ROHM CO., LTD. |
| WO/2021/251050 | SUBSTRATE PROCESSING DEVICE, COMPUTER-READABLE RECORDING MEDIUM WITH PROGRAM RECORDED THEREIN, AND SUBSTRATE PROCESSING METHOD | EBARA CORPORATION |
| WO/2021/241242 | SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | HITACHI HIGH-TECH CORPORATION |
| WO/2021/256133 | PROBE CARD | YOKOWO CO., LTD. |
| WO/2021/241256 | PLASMA TREATMENT DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/230344 | CLEANING DEVICE AND CLEANING METHOD | EBARA CORPORATION |
| WO/2021/256142 | IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| WO/2021/256162 | IMAGING ELEMENT, IMAGING DEVICE, AND IMAGING SYSTEM | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| WO/2021/246202 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/241448 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM | KOKUSAI ELECTRIC CORPORATION |
| WO/2021/246227 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
| WO/2021/256182 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | DENSO CORPORATION |
| WO/2021/241561 | HEAT TREATMENT APPARATUS | SCREEN HOLDINGS CO., LTD. |
| WO/2021/251128 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/246241 | SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT | MITSUBISHI ELECTRIC CORPORATION |
| WO/2021/246279 | SUPPORT SUBSTRATE FOR BONDED WAFER | SUMCO CORPORATION |
| WO/2021/246280 | SIC SEMICONDUCTOR ELEMENT MANUFACTURING METHOD AND SIC SEMICONDUCTOR ELEMENT | KYOTO UNIVERSITY |
| WO/2021/241722 | SOLID-STATE IMAGING DEVICE | TOWER PARTNERS SEMICONDUCTOR CO., LTD. |
| WO/2021/251174 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | SCREEN HOLDINGS CO., LTD. |
| WO/2021/246328 | OPERATION METHOD FOR SUBSTRATE PROCESSING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/246361 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/251197 | SUBSTRATE HOLDING APPARATUS | KAWASAKI JUKOGYO KABUSHIKI KAISHA |
| WO/2021/246396 | WIRE BONDING DEVICE | SHINKAWA LTD. |
| WO/2021/256308 | FILM FORMATION METHOD AND PLASMA TREATMENT DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/256317 | PRESSURIZING SUCTION-ATTACHMENT TABLE AND PRESSURIZING DEVICE EQUIPPED WITH SAME | HITACHI ZOSEN CORPORATION |
| WO/2021/256327 | PLANARIZATION METHOD AND PHOTOCURABLE COMPOSITION | CANON KABUSHIKI KAISHA |
| WO/2021/256383 | SUBSTRATE SOLUTION TREATMENT DEVICE AND SUBSTRATE SOLUTION TREATMENT METHOD | TOKYO ELECTRON LIMITED |
| WO/2021/256433 | SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD | SHINKAWA LTD. |
| WO/2021/256434 | CONTROL DEVICE FOR LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD | SUMITOMO HEAVY INDUSTRIES, LTD. |
| WO/2021/261352 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND MAP CREATING DEVICE | TOKYO ELECTRON LIMITED |
| WO/2021/261397 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
| WO/2021/261494 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR EPITAXIAL SUBSTRATE, AND SEMICONDUCTOR EPITAXIAL SUBSTRATE | KYOCERA CORPORATION |
| WO/2021/006408 | PUMP BACKSTREAM PREVENTING STRUCTURE FOR SEMICONDUCTOR MANUFACTURING DEVICE | KIM, Tae Wha |
| WO/2021/020602 | WAFER PROCESSING APPARATUS INCLUDING PARTICLE SENSOR | SEMICON TECH GLOBAL LIMITED |
| WO/2021/025184 | MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD USING SAME TO REMOVE MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEMENT | LG ELECTRONICS INC. |
| WO/2021/040111 | APPARATUS AND METHOD FOR COLLECTING SEMICONDUCTOR LIGHT EMITTING DIODES | LG ELECTRONICS INC. |
| WO/2021/054507 | SELF-ASSEMBLY APPARATUS FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENTS | LG ELECTRONICS INC. |
| WO/2021/054508 | SELF-ASSEMBLY APPARATUS FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENTS | LG ELECTRONICS INC. |
| WO/2021/029493 | LARGE-AREA HEATER | POWER CUBESEMI INC. |
| WO/2021/090999 | SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE | HANWHA CORPORATION |
| WO/2021/054541 | METHOD FOR DRY ETCHING COPPER THIN FILM | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| WO/2021/137335 | LIFT PIN, WAFER PROCESSING APPARATUS COMPRISING SAME, AND METHOD FOR PRODUCING WAFERS | SK SILTRON CO., LTD. |
| WO/2021/117974 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUPPLY DEVICE AND SUPPLY METHOD | LG ELECTRONICS INC. |
| WO/2021/149842 | STATE MEASUREMENT APPARATUS EMPLOYING CAPACITIVE SCHEME | JD CO.,LTD. |
| WO/2021/149858 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT COLLECTING METHOD AND SEMICONDUCTOR LIGHT-EMITTING ELEMENT COLLECTING METHOD USING SAME | LG ELECTRONICS INC. |
| WO/2021/157750 | CAPACITANCE-TYPE STATE MEASURING DEVICE USING SENSOR-MOUNTED WAFER | JD CO.,LTD. |
| WO/2021/054546 | ASSEMBLY CHAMBER FOR SELF-ASSEMBLY OF SEMICONDUCTOR LIGHT-EMITTING DIODES | LG ELECTRONICS INC. |
| WO/2021/054547 | CHIP TRAY FOR SELF-ASSEMBLY AND METHOD FOR SUPPLYING SEMICONDUCTOR LIGHT EMITTING DIODE | LG ELECTRONICS INC. |
| WO/2021/162152 | SEMICONDUCTOR LIGHT-EMITTING DEVICE SELF-ASSEMBLY APPARATUS AND METHOD | LG ELECTRONICS INC. |
| WO/2021/054548 | SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | LG ELECTRONICS INC. |
| WO/2021/054549 | DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | LG ELECTRONICS INC. |
| WO/2021/054550 | DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | LG ELECTRONICS INC. |
| WO/2021/162158 | CHIP TRAY FOR SELF-ASSEMBLY, AND METHOD FOR SUPPLYING SEMICONDUCTOR LIGHT EMITTING ELEMENTS | LG ELECTRONICS INC. |
| WO/2021/162160 | CHIP DISPENSER FOR SELF-ASSEMBLY | LG ELECTRONICS INC. |
| WO/2021/172613 | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD | ENH KOREA CO., LTD. |
| WO/2021/006453 | PUMP BACKSTREAM PREVENTING STRUCTURE FOR SEMICONDUCTOR MANUFACTURING DEVICE | KIM, Tae Wha |
| WO/2021/100978 | SIDE WIRING MANUFACTURING APPARATUS, SIDE WIRING MANUFACTURING METHOD, AND DISPLAY APPARATUS MANUFACTURING METHOD | LG DISPLAY CO.,LTD. |
| WO/2021/172652 | INSPECTION DEVICE AND METHOD FOR INSPECTING AND REPAIRING DISPLAY PANEL BY USING SAME | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/182675 | LOGISTICS AUTOMATION EQUIPMENT FOR SEMICONDUCTOR WAFER MANUFACTURING DEVICE | SK SILTRON CO., LTD. |
| WO/2021/153846 | INGOT TEMPERATURE CONTROLLER AND WIRE SAWING DEVICE HAVING SAME | SK SILTRON CO., LTD. |
| WO/2021/002590 | GAS SUPPLY DEVICE FOR SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING DEVICE | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/246536 | DISPLAY DEVICE MANUFACTURING SUBSTRATE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING SAME | LG ELECTRONICS INC. |
| WO/2021/033884 | PLASMA ETCHING METHOD | AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/117991 | ETCHING AND/OR DRILLING APPARATUS USING RESONANCE FREQUENCY OF WATER DROPLET, AND ETCHING AND/OR DRILLING METHOD USING SAME | GACHON UNIVERSITY OF INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/010593 | LED TRANSFER METHOD AND DISPLAY MODULE MANUFACTURED THEREBY | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/020714 | DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE MANUFACTURING METHOD | SAMSUNG DISPLAY CO., LTD. |
| WO/2021/145516 | INSPECTION APPARATUS AND INSPECTION METHOD FOR WAFER EDGE DEFECTS | COMIZOA CO.,LTD. |
| WO/2021/251527 | CLOSED CHAMBER | LG ELECTRONICS INC. |
| WO/2021/002605 | SUBSTRATE PROCESSING APPARATUS | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/172665 | TELLURIUM OXIDE, AND THIN FILM TRANSISTOR COMPRISING SAME AS CHANNEL LAYER | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY |
| WO/2021/025287 | ELECTROSTATIC CHUCK HEATER AND MANUFACTURING METHOD THEREFOR | MICO CERAMICS LTD. |
| WO/2021/002653 | METHOD AND APPARATUS FOR MANUFACTURING LED PANEL | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/002717 | COMBINED SILICONE RING FOR SEMICONDUCTOR ETCHING APPARATUS | TECHNOLOGY MAKERS CO., LTD. |
| WO/2021/040227 | LASER TRANSFER APPARATUS AND TRANSFER METHOD USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/015474 | PLASMA ETCHING APPARATUS COMPONENT FOR MANUFACTURING SEMICONDUCTOR COMPRISING COMPOSITE SINTERED BODY AND MANUFACTURING METHOD THEREFOR | KOREA INSTITUTE OF MACHINERY AND MATERIALS |
| WO/2021/025314 | DEPOSITION METHOD FOR CARBON-CONTAINING THIN FILM | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY |
| WO/2021/033934 | SUBSTRATE SUPPORT ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS | EUGENE TECHNOLOGY CO., LTD. |
| WO/2021/025460 | LED SPIN CHUCK | HS HI-TECH CO., LTD. |
| WO/2021/025498 | GAS INFLOW DEVICE AND SUBSTRATE PROCESSING DEVICE USING SAME | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/034008 | HUMIDITY REDUCTION DEVICE PROVIDED IN LOAD PORT MODULE TO REDUCE HUMIDITY IN WAFER CONTAINER, AND SEMICONDUCTOR PROCESSING DEVICE INCLUDING SAME | JUSTEM CO., LTD. |
| WO/2021/040391 | MICRO LED TRANSFER METHOD | DIFLAT CO.,LTD. |
| WO/2021/075708 | SELECTIVE DROPLET FLOW SURFACE AND METHOD FOR MANUFACTURING SAME | THE INDUSTRY & ACADEMIC COOPERPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) |
| WO/2021/045587 | RAPID THERMAL PROCESSING EQUIPMENT COOLING SYSTEM | NEWYOUNG SYSTEM CO., LTD. |
| WO/2021/054670 | METHOD AND SYSTEM FOR REMOVING L-FC IN PLASMA ETCHING PROCESS | DAEJEON UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION |
| WO/2021/132849 | APPARATUS FOR TRANSFERRING LED | LG DISPLAY CO.,LTD. |
| WO/2021/246579 | SUBSTRATE HEAT-TREATMENT APPARATUS USING VCSEL | VIATRON CO., LTD. |
| WO/2021/060860 | METHOD FOR MANUFACTURING THIN FILM | SOULBRAIN CO., LTD. |
| WO/2021/060864 | THIN FILM FABRICATION METHOD | SOULBRAIN CO., LTD. |
| WO/2021/096067 | METHOD FOR PROCESSING SEMICONDUCTOR WAFER | OPTO ELECTRONICS SOLUTIONS |
| WO/2021/080327 | SELECTIVE LASER TRANSFER DEVICE AND TRANSFER METHOD | KOREA INSTITUTE OF MACHINERY & MATERIALS |
| WO/2021/112404 | VIA FORMATION METHOD, SEMICONDUCTOR DEVICE PREPARATION METHOD ON BASIS THEREOF, AND SEMICONDUCTOR DEVICE | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| WO/2021/096114 | METHOD OF MANUFACTURING SOI SUBSTRATE | THE SHUM |
| WO/2021/096126 | SUBSTRATE PROCESSING APPARATUS | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/091218 | APPARATUS FOR TRANSFERRING PLURALITY OF CHIPS AND METHOD OF TRANSFERRING PLURALITY OF CHIPS | YANG, Jin Sok |
| WO/2021/091219 | METHOD FOR SORTING CHIPS | YANG, Jin Sok |
| WO/2021/112417 | SUBSTRATE PROCESSING DEVICE COMPRISING DOOR UNIT HAVING INCLINED SURFACE | KCTECH CO.,LTD. |
| WO/2021/101288 | TRANSISTOR, METHOD FOR MANUFACTURING SAME, AND TERNARY INVERTER COMPRISING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/137432 | TRANSISTOR, TERNARY INVERTER COMPRISING SAME, AND TRANSISTOR MANUFACTURING METHOD | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/101289 | TRANSISTOR, TERNARY INVERTER INCLUDING SAME, AND TRANSISTOR MANUFACTURING METHOD | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/137433 | TUNNEL FIELD EFFECT TRANSISTOR AND TERNARY INVERTER COMPRISING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/157825 | GALLIUM NITRIDE/DIAMOND WAFER | RFHIC CORPORATION |
| WO/2021/157826 | GALLIUM NITRIDE/DIAMOND WAFER | RFHIC CORPORATION |
| WO/2021/157827 | GALLIUM NITRIDE/DIAMOND WAFER | RFHIC CORPORATION |
| WO/2021/157828 | GALLIUM NITRIDE/DIAMOND WAFER | RFHIC CORPORATION |
| WO/2021/101341 | ELEMENT TRANSFER METHOD, AND ELECTRONIC PANEL MANUFACTURING METHOD USING SAME | KOREA INSTITUTE OF MACHINERY & MATERIALS |
| WO/2021/112471 | METHOD FOR FORMING ELECTRODE | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/206261 | METHOD FOR MANUFACTURING TWO-DIMENSIONAL MATERIAL HAVING VERTICALLY ALIGNED NANOPATTERNS | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
| WO/2021/112569 | BYPRODUCT COLLECTION DEVICE INTEGRATED WITH COOLING WATER CIRCULATION SYSTEM | J-SOLUTION CO., LTD. |
| WO/2021/112611 | SUBSTRATE PROCESSING DEVICE, METHOD FOR PREPARING SUBSTRATE PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHOD | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/118305 | LAMP APPARATUS FOR WAFER CLEANING APPARATUS AND CLEANING APPARATUS USING SAME | CTLAB CO., LTD. |
| WO/2021/118317 | LIQUID CHEMICAL SUPPLY DEVICE SYSTEM AND METHOD THEREOF CAPABLE OF PROCESSING GASES CONTAINED THEREIN | VERSUM MATERIALS HYT INC. |
| WO/2021/210751 | ANTI-SLIP PAD FOR TEMPORARY BONDING, INCLUDING PATTERN PART ON BOTH SIDES THEREOF | GLINT MATERIALS CO., LTD. |
| WO/2021/210752 | SEMICONDUCTOR WAFER TRANSPORTING CARRIER COMPRISING ANTI-SLIP PADS | GLINT MATERIALS CO., LTD. |
| WO/2021/230453 | SLIP PREVENTION PAD PREVENTING POPPING PHENOMENON FOR CONVEYING SEMICONDUCTOR WAFER, AND ROBOT ARM BLADE EQUIPPED WITH SAME | GLINT MATERIALS CO., LTD. |
| WO/2021/125775 | MICRO-LED TRANSFER METHOD AND MICRO-LED TRANSFER APPARATUS | SEOUL VIOSYS CO., LTD. |
| WO/2021/125778 | MICRO LED BONDING EVALUATION DEVICE AND MICRO LED BONDING EVALUATION METHOD USING SAME | SEOUL VIOSYS CO., LTD. |
| WO/2021/167218 | GAS COLLECTING SYSTEM AND GAS COLLECTING METHOD | HANYANG TECHNOLOGY INDUSTRY CO.,LTD. |
| WO/2021/133003 | LIGHT EMITTING DIODE TRANSFER SYSTEM AND CONTROL METHOD THEREOF | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/137595 | METHOD FOR FORMING MATERIAL FILM USING SURFACE PROTECTION MATERIAL | EUGENE TECHNOLOGY MATERIALS |
| WO/2021/187735 | SAW AND PLACEMENT SYSTEM | TONITEC CO., LTD. |
| WO/2021/145695 | THIN FILM FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME | INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY |
| WO/2021/162252 | REVERSIBLE COATING METHOD AND ENCAPSULATION METHOD FOR STRUCTURAL FILLING OF SUBSTRATE | NANOIN INC. |
| WO/2021/145716 | SYSTEM FOR STABILIZING FLOW OF GAS INTRODUCED INTO SENSOR | ATIKOREA CO., LTD. |
| WO/2021/201393 | SYSTEM AND METHOD FOR CONFIRMING MOUNTED STATE OF PICKER MOUNTS | INTEKPLUS CO.,LTD. |
| WO/2021/145744 | SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/150047 | SUBSTRATE PROCESSING APPARATUS AND SPRAY MODULE OF SUBSTRATE PROCESSING APPARATUS | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/157951 | WAFER PROCESSING APPARATUS | TES CO.,LTD |
| WO/2021/158042 | APPARATUS FOR SEPARATING SEMICONDUCTOR CHIP AND METHOD FOR SEPARATING SEMICONDUCTOR BY USING SAME | LG CHEM, LTD. |
| WO/2021/256656 | METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM | S.S.P. INC. |
| WO/2021/206287 | PLASMA ETCHING METHOD USING PERFLUOROISOPROPYL VINYL ETHER (PIPVE) | AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/215640 | MICRO-LED MANUFACTURING DEVICE | HARDRAM CO., LTD. |
| WO/2021/215641 | MICRO LED CHIP TRANSFER METHOD | HARDRAM CO., LTD. |
| WO/2021/225263 | PLASMA ETCHING METHOD USING PENTAFLUOROPROPANOL | AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/225264 | PLASMA ETCHING METHOD USING PERFLUOROPROPYL CARBINOL | AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| WO/2021/194178 | SUBSTRATE PROCESSING DEVICE | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/241869 | SUBSTRATE PROCESSING DEVICE | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/194270 | WAFER CARRIER | SEOUL VIOSYS CO., LTD. |
| WO/2021/241877 | EXPOSURE PATTERN, EXPOSURE MASK USED FOR FORMING SAME, AND METHOD FOR FORMING EXPOSURE PATTERN USING SAME | DONGWOO FINE-CHEM CO., LTD. |
| WO/2021/206444 | WIRING FILM MANUFACTURING METHOD, WIRING FILM, AND DISPLAY DEVICE COMPRISING SAME | CUPRUM MATERIALS CORP. |
| WO/2021/210862 | NON-RIGID PAD FOR DEVICE TRANSFER, METHOD FOR MANUFACTURING NON-RIGID PAD FOR DEVICE TRANSFER, AND NON-RIGID PAD GROUP FOR DEVICE TRANSFER COMPRISING NON-RIGID PAD FOR DEVICE TRANSFER | CENTER FOR ADVANCED META-MATERIALS |
| WO/2021/210907 | SEMICONDUCTOR LAYER, METHOD FOR MANUFACTURING SAME, AND TRANSISTOR COMPRISING SAME | HANSOL CHEMICAL CO.,LTD |
| WO/2021/215741 | PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING LED CHIP, METHOD FOR TRANSFERRING LED CHIP USING PHOTOSENSITIVE TRANSFER RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING SAME | LIGHTIZER CO., LTD. |
| WO/2021/215767 | FLUID SHUT-OFF VALVE | SHIN, Gyeong Soon |
| WO/2021/210969 | SCANNING SYSTEM | NVISANA |
| WO/2021/241909 | MICRO-LED TRANSFER DEVICE AND MICRO-LED TRANSFER METHOD USING SAME | SAMSUNG ELECTRONICS CO., LTD. |
| WO/2021/230637 | APPARATUS AND METHOD FOR DEBONDING ELECTRONIC DEVICE | YANG, Jin Sok |
| WO/2021/241935 | SEMICONDUCTOR CHIP DELAMINATION DEVICE AND CONTROL METHOD THEREFOR | ENGION CO., LTD. |
| WO/2021/246697 | METHOD FOR FABRICATING β-GA2O3 THIN FILM | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| WO/2021/246701 | DRY ETCHING METHOD FOR COPPER THIN FILM | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| WO/2021/242015 | SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSPECTING SUBSTRATE PROCESSING SYSTEM | JUSUNG ENGINEERING CO., LTD. |
| WO/2021/256772 | ROTATION SHAFT SEALING DEVICE AND SEMICONDUCTOR SUBSTRATE PROCESSING DEVICE USING SAME | SEALINK CORP. |
| WO/2021/251800 | HIGH DIELECTRIC FILM AND SEMICONDUCTOR OR CAPACITOR DEVICE COMPRISING SAME | THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) |
| WO/2021/261866 | HIGH DIELECTRIC HYDROCARBON THIN FILM AND SEMICONDUCTOR DEVICE USING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/261867 | HIGH DIELECTRIC HYDROCARBON THIN FILM, AND SEMICONDUCTOR DEVICE USING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/261868 | CAPACITOR USING HIGH DIELECTRIC HYDROCARBON THIN FILM AND SEMICONDUCTOR DEVICE USING SAME | UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY) |
| WO/2021/133159 | A METHOD OF FORMING GRAPHENE NANOMESH | MIMOS BERHAD |
| WO/2021/107769 | LEAD FRAME BASED MOLDED RADIO FREQUENCY PACKAGE | AMPLEON NETHERLANDS B.V. |
| WO/2021/075966 | COMPONENT PROCESSING APPARATUS, SUCH AS A PRESSURE SINTERING APPARATUS OR A COMPONENT ENCAPSULATION APPARATUS | BOSCHMAN TECHNOLOGIES BV |
| WO/2021/137697 | AN ACTUATOR DEVICE FOR USE IN A POSITIONING SYSTEM AS WELL AS SUCH POSITIONING SYSTEM. | VDL ENABLING TECHNOLOGIES GROUP B.V. |
| WO/2021/187982 | A METHOD OF MANUFACTURING A SEMI-CONDUCTING THIN FILM DEVICE | NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
| WO/2021/049996 | BONDING OF ELECTRICALLY CONDUCTING WIRE TO CONTACT PAD OF A MICROCHIP | RIBET, Federico |
| WO/2021/154141 | PATTERNING OF MULTILAYER TRANSITION METAL DICHALCOGENIDES | SMENA TECH AB |
| WO/2021/091478 | COMPONENT HANDLER | SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD |
| WO/2021/188042 | BONDING APPARATUS, SYSTEM, AND METHOD OF BONDING | AIRISE PTE. LTD. |
| WO/2021/183084 | POWER CONVERSION CIRCUIT HAVING COMPONENTS WITH A THERMAL EXPANSION COEFFICIENT MATCHED | KUVV ELEKTRONİK ANONİM ŞİRKETİ |
| WO/2021/006858 | FAB MANAGEMENT WITH DYNAMIC SAMPLING PLANS, OPTIMIZED WAFER MEASUREMENT PATHS AND OPTIMIZED WAFER TRANSPORT, USING QUANTUM COMPUTING | KLA-TENCOR CORPORATION |
| WO/2021/006890 | DATA-DRIVEN MISREGISTRATION PARAMETER CONFIGURATION AND MEASUREMENT SYSTEM AND METHOD | KLA-TENCOR CORPORATION |
| WO/2021/010952 | LARGE-AREA HIGH DENSITY PLASMA PROCESSING CHAMBER FOR FLAT PANEL DISPLAYS | APPLIED MATERIALS, INC. |
| WO/2021/025695 | ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/040677 | EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/045759 | SEMICONDUCTOR COMPOSITE LAYERS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
| WO/2021/050052 | HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATION | APPLIED MATERIALS, INC. |
| WO/2021/054928 | PERIODIC SEMICONDUCTOR DEVICE MISREGISTRATION METROLOGY SYSTEM AND METHOD | KLA CORPORATION |
| WO/2021/096530 | PRESERVING HIERARCHICAL STRUCTURE INFORMATION WITHIN A DESIGN FILE | APPLIED MATERIALS, INC. |
| WO/2021/112856 | METHOD OF FABRICATING A HOLLOW WALL FOR CONTROLLING DIRECTIONAL DEPOSITION OF MATERIAL | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/015816 | SEMICONDUCTOR MATERIAL HAVING TUNABLE PERMITTIVITY AND TUNABLE THERMAL CONDUCTIVITY | IQE PLC |
| WO/2021/133419 | PACKAGING PROCESS FOR SIDE-WALL PLATING WITH A CONDUCTIVE FILM | VISHAY GENERAL SEMICONDUCTOR, LLC |
| WO/2021/133420 | PACKAGING PROCESS FOR PLATING WITH SELECTIVE MOLDING | VISHAY GENERAL SEMICONDUCTOR, LLC |
| WO/2021/167581 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING A SEMICONDUCTOR WAFER LEVELING RIM | JABIL INC. |
| WO/2021/167583 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING A FIBER OPTIC COUPLER | JABIL INC. |
| WO/2021/167584 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING SELF EXTRACTING GRIPS FOR AN END EFFECTOR | JABIL INC. |
| WO/2021/173154 | REDUCTION OF SIDEWALL NOTCHING FOR HIGH ASPECT RATIO 3D NAND ETCH | LAM RESEARCH CORPORATION |
| WO/2021/145907 | SELF-ALIGNED IMPLANTS FOR SILICON CARBIDE (SIC) TECHNOLOGIES AND FABRICATION METHOD | MICROCHIP TECHNOLOGY INC. |
| WO/2021/194468 | HIGH PRECISION EDGE RING CENTERING FOR SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/188122 | SUBSTRATE TRAY TRANSFER SYSTEM FOR SUBSTRATE PROCESS EQUIPMENT | APPLIED MATERIALS, INC. |
| WO/2021/194512 | SUBSTRATE SUPPORT TEMPERATURE PROBE DIAGNOSTICS AND MANAGEMENT | LAM RESEARCH CORPORATION |
| WO/2021/206670 | SYSTEMS AND METHODS FOR CORRECTION OF IMPACT OF WAFER TILT ON MISREGISTRATION MEASUREMENTS | KLA CORPORATION |
| WO/2021/206684 | SEMICONDUCTOR PROCESSING SYSTEM WITH IN-SITU ELECTRICAL BIAS AND METHODS THEREOF | TOKYO ELECTRON LIMITED |
| WO/2021/015833 | METHODS AND APPARATUS FOR FORMING DUAL METAL INTERCONNECTS | APPLIED MATERIALS, INC. |
| WO/2021/034354 | METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE USING NON-CONTACT TEMPERATURE MEASUREMENT | APPLIED MATERIALS, INC. |
| WO/2021/034355 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE USING MICROWAVE ENERGY | APPLIED MATERIALS, INC. |
| WO/2021/225579 | METROLOGY TARGETS FOR HIGH TOPOGRAPHY SEMICONDUCTOR STACKS | KLA CORPORATION |
| WO/2021/225587 | INTER-STEP FEEDFORWARD PROCESS CONTROL IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES | KLA CORPORATION |
| WO/2021/050116 | SELECTIVE LIQUIPHOBIC SURFACE MODIFICATION OF SUBSTRATES | BREWER SCIENCE, INC. |
| WO/2021/040823 | NON-PLASMA ETCH OF TITANIUM-CONTAINING MATERIAL LAYERS WITH TUNABLE SELECTIVITY TO ALTERNATE METALS AND DIELECTRICS | TOKYO ELECTRON LIMITED |
| WO/2021/021265 | ANISOTROPIC EPITAXIAL GROWTH | APPLIED MATERIALS, INC. |
| WO/2021/162727 | IMPROVED GROUP III NITRIDE SUBSTRATE, METHOD OF MAKING, AND METHOD OF USE | SLT TECHNOLOGIES, INC |
| WO/2021/011101 | GAS PHASE ETCH WITH CONTROLLABLE ETCH SELECTIVITY OF METALS | TOKYO ELECTRON LIMITED |
| WO/2021/021279 | DOSE REDUCTION OF PATTERNED METAL OXIDE PHOTORESISTS | APPLIED MATERIALS, INC. |
| WO/2021/141614 | THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY PERFORATED DIELECTRIC MOAT STRUCTURE AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/162735 | FIELD EFFECT TRANSISTORS CONTAINING ELECTRIC FIELD ASSIST LAYERS AT GATE CORNERS AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/003011 | PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD | INTERNATIONAL TEST SOLUTIONS, INC. |
| WO/2021/177990 | SEMICONDUCTOR DIE CONTAINING SILICON NITRIDE STRESS COMPENSATING REGIONS AND METHOD FOR MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/015890 | SELECTIVELY-PLIABLE CHEMICAL VAPOR DEPOSITION (CVD) DIAMOND OR OTHER HEAT SPREADER | RAYTHEON COMPANY |
| WO/2021/055032 | METHOD FOR TEMPORARILY BONDING A SEMICONDUCTOR SUBSTRATE TO A CARRIER | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/007002 | METHOD FOR FORMING FILM STACKS WITH MULTIPLE PLANES OF TRANSISTORS HAVING DIFFERENT TRANSISTOR ARCHITECTURES | TOKYO ELECTRON LIMITED |
| WO/2021/007003 | MULTIPLE PLANES OF TRANSISTORS WITH DIFFERENT TRANSISTOR ARCHITECTURES TO ENHANCE 3D LOGIC AND MEMORY CIRCUITS | TOKYO ELECTRON LIMITED |
| WO/2021/015893 | METHOD FOR PLANARIZATION OF SPIN-ON AND CVD-DEPOSITED ORGANIC FILMS | TOKYO ELECTRON LIMITED |
| WO/2021/177991 | SEMICONDUCTOR DEVICE CONTAINING TUBULAR LINER SPACER FOR LATERAL CONFINEMENT OF SELF-ALIGNED SILICIDE PORTIONS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/021340 | CARRIER FOUP AND A METHOD OF PLACING A CARRIER | APPLIED MATERIALS, INC. |
| WO/2021/003031 | METHODS AND APPARATUS FOR CURING DIELECTRIC MATERIAL | APPLIED MATERIALS, INC. |
| WO/2021/021342 | METHOD OF PRE ALIGNING CARRIER, WAFER AND CARRIER-WAFER COMBINATION FOR THROUGHPUT EFFICIENCY | APPLIED MATERIALS, INC. |
| WO/2021/021344 | LOW EMISSION IMPLANTATION MASK AND SUBSTRATE ASSEMBLY | APPLIED MATERIALS, INC. |
| WO/2021/025795 | MULTI-DIMENSIONAL PLANES OF LOGIC AND MEMORY FORMATION USING SINGLE CRYSTAL SILICON ORIENTATIONS | TOKYO ELECTRON LIMITED ('TEL') |
| WO/2021/025796 | APPARATUS AND METHOD FOR SIMULTANEOUS FORMATION OF DIFFUSION BREAK, GATE CUT, AND INDEPENDENT N AND P GATES FOR 3D TRANSISTOR DEVICES | TOKYO ELECTRON LIMITED |
| WO/2021/211154 | MISREGISTRATION TARGET HAVING DEVICE-SCALED FEATURES USEFUL IN MEASURING MISREGISTRATION OF SEMICONDUCTOR DEVICES | KLA CORPORATION |
| WO/2021/107986 | SYSTEMS AND METHODS FOR METROLOGY OPTIMIZATION BASED ON METROLOGY LANDSCAPES | KLA CORPORATION |
| WO/2021/021351 | SUBSTRATE PROCESSING MONITORING | APPLIED MATERIALS, INC. |
| WO/2021/003070 | MODULATING FILM PROPERTIES BY OPTIMIZING PLASMA COUPLING MATERIALS | APPLIED MATERIALS, INC. |
| WO/2021/025806 | METHOD FOR INCREASING PATTERN DENSITY ON A WAFER | TOKYO ELECTRON LIMITED |
| WO/2021/021357 | TEMPERATURE PROFILE MEASUREMENT AND SYNCHRONIZED CONTROL ON SUBSTRATE AND SUSCEPTOR IN AN EPITAXY CHAMBER | APPLIED MATERIALS, INC. |
| WO/2021/025809 | PEDESTAL WITH MULTI-ZONE HEATING | APPLIED MATERIALS, INC. |
| WO/2021/029976 | METHOD FOR PITCH SPLIT PATTERNING USING SIDEWALL IMAGE TRANSFER | TOKYO ELECTRON LIMITED |
| WO/2021/003131 | ADAPTIVE LANE DETECTION SYSTEMS AND METHODS | LI-COR, INC. |
| WO/2021/021377 | SYSTEM AND METHOD FOR ELECTROSTATICALLY CHUCKING A SUBSTRATE TO A CARRIER | APPLIED MATERIALS, INC. |
| WO/2021/003224 | METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTIVE PASSIVATION | LAM RESEARCH CORPORATION |
| WO/2021/003235 | SPACER OPEN PROCESS BY DUAL PLASMA | MATTSON TECHNOLOGY, INC. |
| WO/2021/003288 | METHODS OF USING LASER ENERGY TO REMOVE PARTICLES FROM A SURFACE | ENTEGRIS, INC. |
| WO/2021/007105 | METHODS AND APPARATUS FOR MICROWAVE PROCESSING OF POLYMER MATERIALS | APPLIED MATERIALS, INC. |
| WO/2021/003427 | NANOSHEET TRANSISTOR STACK | QUALCOMM INCORPORATED |
| WO/2021/003434 | HERMETIC HETEROGENEOUS INTEGRATION PLATFORM FOR ACTIVE AND PASSIVE ELECTRONIC COMPONENTS | INJECTENSE, INC. |
| WO/2021/011229 | ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER | APPLIED MATERIALS, INC. |
| WO/2021/011233 | ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER | APPLIED MATERIALS, INC. |
| WO/2021/011246 | ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER | APPLIED MATERIALS, INC. |
| WO/2021/011253 | ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER | APPLIED MATERIALS, INC. |
| WO/2021/011254 | HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS | APPLIED MATERIALS, INC. |
| WO/2021/011261 | MULTI-LID STRUCTURE FOR SEMICONDUCTOR PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/007399 | PROCESS FOR A 3-DIMENSIONAL ARRAY OF HORIZONTAL NOR-TYPE MEMORY STRINGS | SUNRISE MEMORY CORPORATION |
| WO/2021/011303 | TOXIC OUTGAS CONTROL POST PROCESS | AXCELIS TECHNOLOGIES, INC. |
| WO/2021/007536 | METHOD FOR THRESHOLD VOLTAGE TUNING THROUGH SELECTIVE DEPOSITION OF HIGH-K METAL GATE (HKMG) FILM STACKS | TOKYO ELECTRON LIMITED |
| WO/2021/025824 | BRIDGE APPARATUS AND METHOD FOR SEMICONDUCTOR DIE TRANSFER | ROHINNI, LLC |
| WO/2021/016008 | WAFER CUSHION | ENTEGRIS, INC. |
| WO/2021/011718 | PROCESSING OF WORKPIECES USING DEPOSITION PROCESS AND ETCH PROCESS | MATTSON TECHNOLOGY, INC. |
| WO/2021/011761 | METHOD FOR MITIGATING LATERIAL FILM GROWTH IN AREA SELECTIVE DEPOSITION | TOKYO ELECTRON LIMITED |
| WO/2021/021456 | METHOD FOR USING ULTRA THIN RUTHENIUM METAL HARD MASK FOR ETCHING PROFILE CONTROL | TOKYO ELECTRON LIMITED |
| WO/2021/016042 | METHOD FOR TUNING STRESS TRANSITIONS OF FILMS ON A SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/016115 | MULTI-OBJECT CAPABLE LOADLOCK SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/011910 | MULTI-ZONE HEATER MODEL-BASED CONTROL IN SEMICONDUCTOR MANUFACTURING | APPLIED MATERIALS, INC. |
| WO/2021/016145 | COMBINED TRANSMITTED AND REFLECTED LIGHT IMAGING OF INTERNAL CRACKS IN SEMICONDUCTOR DEVICES | KLA CORPORATION |
| WO/2021/034439 | INTEGRATED ASSEMBLIES HAVING RUGGED MATERIAL FILL, AND METHODS OF FORMING INTEGRATED ASSEMBLIES | MICRON TECHNOLOGY, INC. |
| WO/2021/021501 | INTEGRATED HARDWARE-SOFTWARE COMPUTER VISION SYSTEM FOR AUTONOMOUS CONTROL AND INSPECTION OF SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/021504 | ISOLATION VALVE | APPLIED MATERIALS, INC. |
| WO/2021/021513 | SEMICONDUCTOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING | APPLIED MATERIALS, INC. |
| WO/2021/016384 | FLEXING SEMICONDUCTOR STRUCTURES AND RELATED TECHNIQUES | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| WO/2021/016389 | SYSTEMS AND METHODS FOR HORIZONTAL WAFER PACKAGING | RORZE AUTOMATION, INC. |
| WO/2021/055098 | METHOD FOR FABRICATION OF HIGH DENSITY LOGIC AND MEMORY FOR ADVANCED CIRCUIT ARCHITECTURE | TOKYO ELECTRON LIMITED |
| WO/2021/021582 | SYSTEM AND METHOD FOR DETERMINING DEFECTS USING PHYSICS-BASED IMAGE PERTURBATIONS | KLA CORPORATION |
| WO/2021/034447 | DEPOSITION PROCESS | TOKYO ELECTRON LIMITED |
| WO/2021/016584 | GROUNDING MECHANISM FOR MULTI-LAYER FOR ELECTROSTATIC CHUCK, AND RELATED METHODS | ENTEGRIS, INC. |
| WO/2021/021691 | WAFER PRE-ALIGNMENT APPARATUS AND METHOD | YASKAWA AMERICA, INC. |
| WO/2021/061271 | INTEGRATED ASSEMBLIES HAVING BARRIER MATERIAL BETWEEN SILICON-CONTAINING MATERIAL AND ANOTHER MATERIAL REACTIVE WITH SILICON | MICRON TECHNOLOGY, INC. |
| WO/2021/025891 | RECONFIGURABLE FINFET-BASED ARTIFICIAL NEURON AND SYNAPSE DEVICES | APPLIED MATERIALS, INC. |
| WO/2021/030042 | SYSTEMS, DEVICES, AND METHODS FOR DRYING MATERIAL DEPOSITED ON SUBSTRATES FOR ELECTRONIC DEVICE MANUFACTURING | KATEEVA, INC. |
| WO/2021/086463 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE | APPLIED MATERIALS, INC. |
| WO/2021/025914 | HIGH DENSITY LOGIC FORMATION USING MULTI-DIMENSIONAL LASER ANNEALING | TOKYO ELECTRON LIMITED |
| WO/2021/025920 | HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/022016 | METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION | APPLIED MATERIALS, INC. |
| WO/2021/022029 | ROBOT EMBEDDED VISION APPARATUS | BROOKS AUTOMATION, INC. |
| WO/2021/022049 | ROBOT EMBEDDED VISION APPARATUS | BROOKS AUTOMATION, INC. |
| WO/2021/030070 | HYBRID WAFER DICING APPROACH USING AN ACTIVELY-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/030074 | METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATION | APPLIED MATERIALS, INC. |
| WO/2021/022150 | ALUMINUM NITRIDE MULTILAYER POWER MODULE INTERPOSER AND METHOD | NOOTENS, Stephen, P. |
| WO/2021/030081 | HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/026049 | SEMICONDUCTING DEVICES, BACK END OF LINE PORTIONS FOR SEMICONDUCTING DEVICES, AND DIELECTRIC MATERIALS INCORPORATING DEUTERIUM | THE RESEARCH FOUNDATION FOR SUNY |
| WO/2021/026110 | MOVEABLE EDGE RINGS WITH REDUCED CAPACITANCE VARIATION FOR SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/026222 | SEAL FOR A FLOW RESTRICTOR | ICHOR SYSTEMS, INC. |
| WO/2021/026282 | SEMICONDUCTOR HOT-SPOT AND PROCESS-WINDOW DISCOVERY COMBINING OPTICAL AND ELECTRON-BEAM INSPECTION | KLA CORPORATION |
| WO/2021/026283 | MODIFIED STACKS FOR 3D NAND | APPLIED MATERIALS, INC. |
| WO/2021/026430 | SPINDLE ASSEMBLY FOR WAFER TRANSFER IN A MULTI-STATION PROCESS MODULE | LAM RESEARCH CORPORATION |
| WO/2021/041002 | SEMICONDUCTOR PROCESSING APPARATUS WITH IMPROVED UNIFORMITY | APPLIED MATERIALS, INC. |
| WO/2021/030199 | METHOD AND SYSTEM FOR CAPPING OF CORES FOR SELF-ALIGNED MULTIPLE PATTERNING | TOKYO ELECTRON LIMITED |
| WO/2021/030309 | LOW-K DIELECTRIC FILMS | APPLIED MATERIALS, INC. |
| WO/2021/030310 | NON-CONFORMAL HIGH SELECTIVITY FILM FOR ETCH CRITICAL DIMENSION CONTROL | APPLIED MATERIALS, INC. |
| WO/2021/030332 | PEALD TITANIUM NITRIDE WITH DIRECT MICROWAVE PLASMA | APPLIED MATERIALS, INC. |
| WO/2021/034595 | HEATED SUBSTRATE SUPPORT WITH THERMAL BAFFLES | APPLIED MATERIALS, INC. |
| WO/2021/034623 | DESIGN-ASSISTED INSPECTION FOR DRAM AND 3D NAND DEVICES | KLA CORPORATION |
| WO/2021/034641 | SILICON COMPOUNDS AND METHODS FOR DEPOSITING FILMS USING SAME | VERSUM MATERIALS US, LLC |
| WO/2021/076212 | GAP FILL DEPOSITION PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/034738 | METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHANICAL PLANARIZATION IN WAFER-LEVEL PACKAGING APPLICATIONS | APPLIED MATERIALS, INC. |
| WO/2021/066947 | HIGH PERFORMANCE NANOSHEET FABRICATION METHOD WITH ENHANCED HIGH MOBILITY CHANNEL ELEMENTS | TOKYO ELECTRON LIMITED |
| WO/2021/066951 | METHOD OF MAKING MULTIPLE NANO LAYER TRANSISTORS TO ENHANCE A MULTIPLE STACK CFET PERFORMANCE | TOKYO ELECTRON LIMITED |
| WO/2021/034854 | CALIBRATION OF AN ALIGNER STATION OF A PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/034857 | MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINER | APPLIED MATERIALS, INC. |
| WO/2021/034968 | SYSTEMS AND METHODS FOR A LIFT AND ROTATE WAFER HANDLING PROCESS | OEM GROUP, LLC |
| WO/2021/055134 | CRYOGENIC ELECTROSTATIC CHUCK | APPLIED MATERIALS, INC. |
| WO/2021/035132 | MULTI-STATE RF PULSING TO CONTROL MASK SHAPE AND BREAKING SELECTIVITY VERSUS PROCESS MARGIN TRADE-OFF | LAM RESEARCH CORPORATION |
| WO/2021/080676 | SEMICONDUCTOR APPARATUS HAVING STACKED DEVICES AND METHOD OF MANUFACTURE THEREOF | TOKYO ELECTRON LIMITED |
| WO/2021/041366 | SPACER ETCHING PROCESS | MATTSON TECHNOLOGY, INC. |
| WO/2021/041389 | METHODS FOR PROCESSING A WORKPIECE USING FLUORINE RADICALS | MATTSON TECHNOLOGY, INC. |
| WO/2021/041462 | SILICON OXIDE SELECTIVE DRY ETCH PROCESS | MATTSON TECHNOLOGY, INC. |
| WO/2021/041593 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. |
| WO/2021/086480 | OXIDE LINER STRESS BUFFER | RAYTHEON COMPANY |
| WO/2021/041643 | THERMAL DIFFUSER FOR A SEMICONDUCTOR WAFER HOLDER | WATLOW ELECTRIC MANUFACTURING COMPANY |
| WO/2021/041832 | METHODS AND APPARATUS FOR CLEANING METAL CONTACTS | APPLIED MATERIALS, INC. |
| WO/2021/041916 | HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW PRESSURE | LAM RESEARCH CORPORATION |
| WO/2021/041917 | SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES | HRL LABORATORIES, LLC |
| WO/2021/080690 | METHODS FOR ETCHING METAL FILMS USING PLASMA PROCESSING | TOKYO ELECTRON LIMITED |
| WO/2021/050308 | REPULSION MESH AND DEPOSITION METHODS | APPLIED MATERIALS, INC. |
| WO/2021/086491 | INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNER INTERCONNECT, A DIELECTRIC LAYER AND A CONDUCTIVE LAYER | QUALCOMM INCORPORATED |
| WO/2021/066984 | CONVEYOR INSPECTION SYSTEM, SUBSTRATE ROTATOR, AND TEST SYSTEM HAVING THE SAME | APPLIED MATERIALS, INC. |
| WO/2021/066986 | CONVEYOR INSPECTION SYSTEM, SUBSTRATE ROTATOR, AND TEST SYSTEM HAVING THE SAME | APPLIED MATERIALS, INC. |
| WO/2021/046061 | SMALL MOLECULE FILMS FOR SACRIFICIAL BRACING, SURFACE PROTECTION, AND QUEUE-TIME MANAGEMENT | LAM RESEARCH CORPORATION |
| WO/2021/055166 | ATOMIC LAYER ETCHING OF METALS | APPLIED MATERIALS, INC. |
| WO/2021/050333 | ETCHING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. |
| WO/2021/046208 | SHUTTER DISK | APPLIED MATERIALS, INC. |
| WO/2021/046212 | INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/046269 | MULTI-REGIONAL EPITAXIAL GROWTH AND RELATED SYSTEMS AND ARTICLES | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| WO/2021/262208 | WAVELET SYSTEM AND METHOD FOR AMELIORATING MISREGISTRATION AND ASYMMETRY OF SEMICONDUCTOR DEVICES | KLA CORPORATION |
| WO/2021/046301 | COMMON ELECTROSTATIC CHUCK FOR DIFFERING SUBSTRATES | APPLIED MATERIALS, INC. |
| WO/2021/080695 | SUPER VIA INTEGRATION IN INTEGRATED CIRCUITS | QUALCOMM INCORPORATED |
| WO/2021/061376 | REVERSE CONTACT AND SILICIDE PROCESS FOR THREE-DIMENSIONAL LOGIC DEVICES | TOKYO ELECTRON LIMITED |
| WO/2021/050400 | IC HAVING TRENCH-BASED METAL-INSULATOR-METAL CAPACITOR | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/050446 | AUTOMATIC TEACHING OF SUBSTRATE HANDLING FOR PRODUCTION AND PROCESS CONTROL TOOLS | KLA CORPORATION |
| WO/2021/050453 | LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE PASTES | ORMET CIRCUITS, INC. |
| WO/2021/050489 | PROCESSING SYSTEM AND METHOD OF DELIVERING A REACTANT GAS | APPLIED MATERIALS, INC. |
| WO/2021/050602 | ELECTROSTATIC PUCK AND METHOD OF MANUFACTURE | WATLOW ELECTRIC MANUFACTURING COMPANY |
| WO/2021/076247 | DEFLECTABLE PLATENS AND ASSOCIATED METHODS | APPLIED MATERIALS, INC. |
| WO/2021/050731 | METHOD FOR RELAXING SEMICONDUCTOR FILMS INCLUDING THE FABRICATION OF PSEUDO-SUBSTRATES | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| WO/2021/080706 | SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT | EUGENUS, INC. |
| WO/2021/055399 | METHOD OF BOTTOM-UP METALLIZATION IN A RECESSED FEATURE | TOKYO ELECTRON LIMITED |
| WO/2021/055542 | METHOD OF FORMING A NARROW TRENCH | TOKYO ELECTRON LIMITED |
| WO/2021/061480 | CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURES | GLOBALWAFERS CO., LTD. |
| WO/2021/055606 | PLASMA IMMERSION METHODS FOR ION IMPLANTATION | ENTEGRIS, INC. |
| WO/2021/061499 | UNSUPERVISED LEARNING-BASED REFERENCE SELECTION FOR ENHANCED DEFECT INSPECTION SENSITIVITY | KLA CORPORATION |
| WO/2021/061501 | PATTERN-TO-DESIGN ALIGNMENT FOR ONE-DIMENSIONAL UNIQUE STRUCTURES | KLA CORPORATION |
| WO/2021/055693 | METHODS FOR THE TREATMENT OF WORKPIECES | MATTSON TECHNOLOGY, INC. |
| WO/2021/076269 | METHODS FOR FORMING MICROELECTRONIC DEVICES WITH SELF-ALIGNED INTERCONNECTS, AND RELATED DEVICES AND SYSTEMS | MICRON TECHNOLOGY, INC. |
| WO/2021/055755 | SEAMLESS GAPFILL WITH DIELECTRIC ALD FILMS | APPLIED MATERIALS, INC. |
| WO/2021/055918 | METHODS AND APPARATUS FOR DEPOSITING DIELECTRIC MATERIAL | APPLIED MATERIALS, INC. |
| WO/2021/061541 | SYSTEMS AND METHODS FOR AUTONOMOUS PROCESS CONTROL AND OPTIMIZATION OF SEMICONDUCTOR EQUIPMENT USING LIGHT INTERFEROMETRY AND REFLECTOMETRY | LAM RESEARCH CORPORATION |
| WO/2021/061585 | VARIATION-BASED SEGMENTATION FOR WAFER DEFECT DETECTION | KLA CORPORATION |
| WO/2021/055991 | MULTI-WAFER VOLUME SINGLE TRANSFER CHAMBER FACET | APPLIED MATERIALS, INC. |
| WO/2021/067092 | MASK ENCAPSULATION TO PREVENT DEGRADATION DURING FABRICATION OF HIGH ASPECT RATIO FEATURES | LAM RESEARCH CORPORATION |
| WO/2021/061907 | TUNABLE AND NON-TUNABLE HEAT SHIELDS TO AFFECT TEMPERATURE DISTRIBUTION PROFILES OF SUBSTRATE SUPPORTS | LAM RESEARCH CORPORATION |
| WO/2021/080726 | METHOD OF DEPOSITING LAYERS | APPLIED MATERIALS, INC. |
| WO/2021/062069 | EQUI-PROBABILITY DEFECT DETECTION | KLA CORPORATION |
| WO/2021/062145 | SELECTIVE AND SELF-LIMITING TUNGSTEN ETCH PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/062188 | PATTERNING A SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/062255 | INTEGRATED CIRCUITS HAVING DIELECTRIC LAYERS INCLUDING AN ANTI-REFLECTIVE COATING | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/062349 | ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN SEMICONDUCTOR PROCESS TOOLS | APPLIED MATERIALS, INC. |
| WO/2021/062367 | NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/067188 | INTEGRATED CAPACITOR WITH EXTENDED HEAD BUMP BOND PILLAR | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/067239 | METROLOGY MODULE WITH PARALLEL ACQUISITION OF BROADBAND POLARIZED SPECTRA | LAM RESEARCH CORPORATION |
| WO/2021/076320 | SYSTEMS AND METHODS FOR MONITORING ONE OR MORE CHARACTERISTICS OF A SUBSTRATE | TOKYO ELECTRON LIMITED |
| WO/2021/091634 | SYSTEM AND METHOD TO CALIBRATE A PLURALITY OF WAFER INSPECTION SYSTEM (WIS) MODULES | TOKYO ELECTRON LIMITED |
| WO/2021/091635 | METHODS AND SYSTEMS TO MONITOR, CONTROL, AND SYNCHRONIZE DISPENSE SYSTEMS | TOKYO ELECTRON LIMITED |
| WO/2021/096601 | SYSTEMS AND METHODS FOR AUTOMATED VIDEO ANALYSIS DETECTION TECHNIQUES FOR SUBSTRATE PROCESS | TOKYO ELECTRON LIMITED |
| WO/2021/141648 | HARDWARE IMPROVEMENTS AND METHODS FOR THE ANALYSIS OF SPINNING REFLECTIVE SUBSTRATES | TOKYO ELECTRON LIMITED |
| WO/2021/091636 | SYSTEMS AND METHODS FOR SPIN PROCESS VIDEO ANALYSIS DURING SUBSTRATE PROCESSING | TOKYO ELECTRON LIMITED |
| WO/2021/067362 | SELECTIVE COBALT VERTICAL ETCH | APPLIED MATERIALS, INC. |
| WO/2021/067813 | NOVEL METHODS FOR GATE INTERFACE ENGINEERING | APPLIED MATERIALS, INC. |
| WO/2021/067909 | INTEGRATED CIRCUIT WITH SCRIBE LANE PATTERNS FOR DEFECT REDUCTION | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/071767 | AUTOCLEAN FOR LOAD LOCKS IN SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/071777 | METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES | APPLIED MATERIALS, INC. |
| WO/2021/076387 | SIGNAL-DOMAIN ADAPTATION FOR METROLOGY | KLA CORPORATION |
| WO/2021/071999 | SEMICONDUCTOR SUBSTRATE BEVEL CLEANING | LAM RESEARCH CORPORATION |
| WO/2021/086577 | METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT INTERCONNECTION | APPLIED MATERIALS, INC. |
| WO/2021/072199 | PEDESTAL HEATER FOR SPATIAL MULTI-WAFER PROCESSING TOOL | APPLIED MATERIALS, INC. |
| WO/2021/072200 | WAFER HEATER WITH BACKSIDE AND INTEGRATED BEVEL PURGE | APPLIED MATERIALS, INC. |
| WO/2021/076613 | DOPED THROUGH-CONTACT STRUCTURES | APPLIED MATERIALS, INC. |
| WO/2021/076636 | MOLYBDENUM FILL | LAM RESEARCH CORPORATION |
| WO/2021/076746 | SELECTIVE ATTACHMENT TO ENHANCE SIO<sb>2</sb>:SIN<sb>X</sb> ETCH SELECTIVITY | LAM RESEARCH CORPORATION |
| WO/2021/076843 | SELECTIVE ETCH PROCESS USING HYDROFLUORIC ACID AND OZONE GASES | MATTSON TECHNOLOGY, INC. |
| WO/2021/076854 | MULTILAYER REFLECTOR AND METHODS OF MANUFACTURE AND PATTERNING | APPLIED MATERIALS, INC. |
| WO/2021/080953 | MONOLITHIC ANISOTROPIC SUBSTRATE SUPPORTS | LAM RESEARCH CORPORATION |
| WO/2021/118688 | APPARATUS FOR MEASURING TEMPERATURE IN A VACUUM AND MICROWAVE ENVIRONMENT | APPLIED MATERIALS, INC. |
| WO/2021/081027 | WAFER CARRIER FOR SEMICONDUCTOR PROCESSING | MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC. |
| WO/2021/081155 | METHODS FOR GAA I/O FORMATION BY SELECTIVE EPI REGROWTH | APPLIED MATERIALS, INC. |
| WO/2021/118695 | METHODS AND APPARATUS FOR MEASURING EDGE RING TEMPERATURE | APPLIED MATERIALS, INC. |
| WO/2021/096653 | MODULAR LED HEATER | APPLIED MATERIALS, INC. |
| WO/2021/081308 | METHOD OF FABRICATING A RESONANT CAVITY AND DISTRIBUTED BRAGG REFLECTOR MIRRORS FOR A VERTICAL CAVITY SURFACE EMITTING LASER ON A WING OF AN EPITAXIAL LATERAL OVERGROWTH REGION | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| WO/2021/086745 | WAFER HANDLING ROBOT WITH GRAVITATIONAL FIELD SENSOR | LAM RESEARCH CORPORATION |
| WO/2021/081379 | METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE | APPLIED MATERIALS, INC. |
| WO/2021/150280 | METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT | APPLIED MATERIALS, INC. |
| WO/2021/091708 | DEFLECTABLE PLATEN AND ASSOCIATED METHOD | APPLIED MATERIALS, INC. |
| WO/2021/081477 | METAL-COVERED CHIP SCALE PACKAGES | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/081482 | HIGH-SILICON-CONTENT WET-REMOVABLE PLANARIZING LAYER | BREWER SCIENCE, INC. |
| WO/2021/086788 | CAP OXIDATION FOR FINFET FORMATION | APPLIED MATERIALS, INC. |
| WO/2021/086822 | AMORPHOUS SILICON-BASED FILMS RESISTANT TO CRYSTALLIZATION | APPLIED MATERIALS, INC. |
| WO/2021/086860 | SURFACE ENCASING MATERIAL LAYER | APPLIED MATERIALS, INC. |
| WO/2021/101681 | COIN-SLOT AND BALL-LOCK CERAMIC LIFT PIN HOLDERS | LAM RESEARCH CORPORATION |
| WO/2021/112976 | HYBRID LOW RESISTANCE METAL LINES | QUALCOMM INCORPORATED |
| WO/2021/087053 | CONTROL SYSTEM FOR ADAPTIVE CONTROL OF A THERMAL PROCESSING SYSTEM | MATTSON TECHNOLOGY, INC. |
| WO/2021/087132 | METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILL | LAM RESEARCH CORPORATION |
| WO/2021/091786 | SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL | APPLIED MATERIALS, INC. |
| WO/2021/087274 | METHOD TO IMPROVE THE PERFORMANCE OF GALLIUM-CONTAINING LIGHT-EMITTING DEVICES | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| WO/2021/087315 | POROUS III-NITRIDES AND METHODS OF USING AND MAKING THEREOF | YALE UNIVERSITY |
| WO/2021/087427 | TESTING SEMICONDUCTOR COMPONENTS | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/096712 | AN APPARATUS AND METHOD FOR THE MINIMIZATION OF UNDERCUT DURING A UBM ETCH PROCESS | VEECO INSTRUMENTS INC. |
| WO/2021/087452 | FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLENISHABLE, MULTISCALE WATER REPELLENCY | PRESIDENT AND FELLOWS OF HARVARD COLLEGE |
| WO/2021/091835 | METHODS TO REDUCE MATERIAL SURFACE ROUGHNESS | APPLIED MATERIALS, INC. |
| WO/2021/150289 | IN-SITU LIGHT DETECTION METHODS AND APPARATUS FOR ULTRAVIOLET SEMICONDUCTOR SUBSTRATE PROCESSING | APPLIED MATERIALS, INC. |
| WO/2021/101700 | METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS MEMORY BIT LINE METAL | APPLIED MATERIALS, INC. |
| WO/2021/101701 | SPLIT ASH PROCESSES FOR VIA FORMATION TO SUPPRESS DAMAGE TO LOW-K LAYERS | TOKYO ELECTRON LIMITED |
| WO/2021/092396 | ENVIRONMENTAL CONTROL MATERIAL HOLDER | ENTEGRIS, INC. |
| WO/2021/113030 | METHOD OF MAKING 3D CIRCUITS WITH INTEGRATED STACKED 3D METAL LINES FOR HIGH DENSITY CIRCUITS | TOKYO ELECTRON LIMITED |
| WO/2021/096865 | SYSTEMS AND METHODS FOR CONTROLLING NON-UNIFORMITY | APPLIED MATERIALS, INC. |
| WO/2021/096907 | GAS DELIVERY SYSTEMS AND METHODS | APPLIED MATERIALS, INC. |
| WO/2021/096914 | REDUCED HYDROGEN DEPOSITION PROCESSES | APPLIED MATERIALS, INC. |
| WO/2021/096987 | MULTI-FINGER ROBOT APPARATUS, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHODS ADAPTED TO TRANSPORT MULTIPLE SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING | APPLIED MATERIALS, INC. |
| WO/2021/097022 | SILYL PSEUDOHALIDES FOR SILICON CONTAINING FILMS | APPLIED MATERIALS, INC. |
| WO/2021/097032 | TRANSFER MATERIAL LAYERS FOR GRAPHENE FABRICATION PROCESS | REGENTS OF THE UNIVERSITY OF MINNESOTA |
| WO/2021/097134 | PORE MEASUREMENT DEVICE | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| WO/2021/097148 | FINFET CIRCUITS EMPLOYING REPLACEMENT N-TYPE FET SOURCE/DRAIN (S/D) TO AVOID OR PREVENT SHORT DEFECTS AND RELATED METHODS OF FABRICATION | QUALCOMM INCORPORATED |
| WO/2021/141665 | AUTOCONFIGURATION OF HARDWARE COMPONENTS OF VARIOUS MODULES OF A SUBSTRATE PROCESSING TOOL | LAM RESEARCH CORPORATION |
| WO/2021/101843 | EDGE UNIFORMITY TUNABILITY ON BIPOLAR ELECTROSTATIC CHUCK | APPLIED MATERIALS, INC. |
| WO/2021/101852 | CLUSTERING SUB-CARE AREAS BASED ON NOISE CHARACTERISTICS | KLA CORPORATION |
| WO/2021/101866 | SEMICONDUCTORS WITH IMPROVED THERMAL BUDGET AND PROCESS OF MAKING SEMICONDUCTORS WITH IMPROVED THERMAL BUDGET | CREE, INC. |
| WO/2021/101909 | INTERCONNECT STRUCTURE WITH SELECTIVE ELECTROPLATED VIA FILL | LAM RESEARCH CORPORATION |
| WO/2021/108175 | WAFER PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE | CANON KABUSHIKI KAISHA |
| WO/2021/108176 | THERMAL TREATMENTS USING A PLURALITY OF EMBEDDED RESISTANCE TEMPERATURE DETECTORS (RTDs) | TOKYO ELECTRON LIMITED |
| WO/2021/102106 | RECYCLED GLASS AND GLASS-CERAMIC CARRIER SUSTRATES | CORNING INCORPORATED |
| WO/2021/102181 | CRYOGENIC WAFER TESTING SYSTEM | HIGH PRECISION DEVICES INC. |
| WO/2021/102198 | INDIUM-GALLIUM-NITRIDE STRUCTURES AND DEVICES | OPNOVIX CORP. |
| WO/2021/108252 | DOPING PROCESSES IN METAL INTERCONNECT STRUCTURES | LAM RESEARCH CORPORATION |
| WO/2021/108393 | GLASS WAFERS FOR SEMICONDUCTOR DEVICE FABRICATION | CORNING INCORPORATED |
| WO/2021/108400 | MULTIZONE FLOW GASBOX FOR PROCESSING CHAMBER | APPLIED MATERIALS, INC. |
| WO/2021/113128 | RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE | APPLIED MATERIALS, INC. |
| WO/2021/108724 | STUD BUMPED PRINTED CIRCUIT ASSEMBLY | HSIO TECHNOLOGIES, LLC |
| WO/2021/108772 | DEVICES COMPRISING DISTRIBUTED BRAGG REFLECTORS AND METHODS OF MAKING THE DEVICES | UNM RAINFOREST INNOVATIONS |
| WO/2021/118815 | OXYGEN RADICAL ASSISTED DIELECTRIC FILM DENSIFICATION | APPLIED MATERIALS, INC. |
| WO/2021/118818 | METHODS FOR REMOVING AN OXIDE FILM FROM A SOI STRUCTURE AND METHODS FOR PREPARING A SOI STRUCTURE | GLOBALWAFERS CO., LTD. |
| WO/2021/113178 | CHAMBER DEPOSITION AND ETCH PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/113191 | TOMOGRAPHY BASED SEMICONDUCTOR MEASUREMENTS USING SIMPLIFIED MODELS | KLA CORPORATION |
| WO/2021/113204 | HIGH BORON-CONTENT HARD MASK MATERIALS | APPLIED MATERIALS, INC. |
| WO/2021/118831 | ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESS | APPLIED MATERIALS, INC. |
| WO/2021/113338 | SUBSTRATE PROCESSING APPARATUS | BROOKS AUTOMATION, INC. |
| WO/2021/118862 | MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND MASK SELECTIVITY | LAM RESEARCH CORPORATION |
| WO/2021/162770 | FILLING EMPTY STRUCTURES WITH DEPOSITION UNDER HIGH-ENERGY SEM FOR UNIFORM DE LAYERING | APPLIED MATERIALS ISRAEL LTD. |
| WO/2021/188168 | HALIDE PEROVSKITE NANOCRYSTAL ARRAY AND METHODS OF MAKING THE SAME | NORTHWESTERN UNIVERSITY |
| WO/2021/126580 | ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS | UNIQARTA, INC. |
| WO/2021/118993 | SELF-ASSEMBLED MONOLAYERS AS SACRIFICIAL CAPPING LAYERS | TOKYO ELECTRON LIMITED |
| WO/2021/138006 | SYSTEMS AND METHODS FOR REMOVAL OF HARDMASK | MATTSON TECHNOLOGY, INC. |
| WO/2021/119180 | AUTOTEACH ENCLOSURE SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/138018 | STATION-TO-STATION CONTROL OF BACKSIDE BOW COMPENSATION DEPOSITION | LAM RESEARCH CORPORATION |
| WO/2021/126696 | ENCAPSULATED RFID IN CONSUMABLE CHAMBER PARTS | LAM RESEARCH CORPORATION |
| WO/2021/126697 | BAKE DEVICES FOR HANDLING AND UNIFORM BAKING OF SUBSTRATES | APPLIED MATERIALS, INC. |
| WO/2021/178019 | SYSTEM AND METHOD FOR MANAGING SUBSTRATE OUTGASSING | APPLIED MATERIALS, INC. |
| WO/2021/188174 | SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUIT | APPLIED MATERIALS, INC. |
| WO/2021/126848 | ASYMMETRIC PURGED BLOCK BENEATH WAFER PLANE TO MANAGE NON-UNIFORMITY | LAM RESEARCH CORPORATION |
| WO/2021/126857 | MULTI-ZONE ELECTROSTATIC CHUCK | APPLIED MATERIALS, INC. |
| WO/2021/126889 | SURFACE PROFILING AND TEXTURING OF CHAMBER COMPONENTS | APPLIED MATERIALS, INC. |
| WO/2021/126919 | PURGING SPINDLE ARMS TO PREVENT DEPOSITION AND WAFER SLIDING | LAM RESEARCH CORPORATION |
| WO/2021/126965 | SYSTEMS AND METHODS FOR PROVIDING MAINTENANCE ACCESS TO ELECTRONIC DEVICE MANUFACTURING TOOLS | APPLIED MATERIALS, INC. |
| WO/2021/126996 | VAPOR DELIVERY SYSTEMS FOR SOLID AND LIQUID MATERIALS | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
| WO/2021/133612 | TARGETED HEAT CONTROL SYSTEMS | APPLIED MATERIALS, INC. |
| WO/2021/127086 | OPTICAL SENSOR WITH TRENCH ETCHED THROUGH DIELECTRIC OVER SILICON | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/127218 | PROCESS FOR PREPARING A CHANNEL REGION OF A THIN-FILM TRANSISTOR | SUNRISE MEMORY CORPORATION |
| WO/2021/221728 | COOLED SUBSTRATE SUPPORT ASSEMBLY FOR RADIO FREQUENCY ENVIRONMENTS | APPLIED MATERIALS, INC. |
| WO/2021/127272 | SEMICONDUCTOR PROCESSING CHUCKS FEATURING RECESSED REGIONS NEAR OUTER PERIMETER OF WAFER FOR MITIGATION OF EDGE/CENTER NONUNIFORMITY | LAM RESEARCH CORPORATION |
| WO/2021/146025 | METHOD OF MAKING A CONTINUOUS CHANNEL BETWEEN 3D CMOS | TOKYO ELECTRON LIMITED |
| WO/2021/127464 | ULTRA-LOW TEMPERATURE ALD TO FORM HIGH-QUALITY SI-CONTAINING FILM | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
| WO/2021/127467 | GROUP V ELEMENT-CONTAINING FILM FORMING COMPOSITIONS AND VAPOR DEPOSITION OF GROUP V ELEMENT-CONTAINING FILM | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
| WO/2021/127470 | AREA SELECTIVE DEPOSITION OF METAL CONTAINING FILMS | L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
| WO/2021/127616 | THROUGH-GATE CO-IMPLANT SPECIES TO CONTROL DOPANT PROFILE IN TRANSISTORS | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/150337 | CARBON NANOTUBE ELECTROSTATIC CHUCK | APPLIED MATERIALS, INC. |
| WO/2021/188180 | SIDEWALL PROTECTION LAYER FORMATION FOR SUBSTRATE PROCESSING | TOKYO ELECTRON LIMITED |
| WO/2021/138132 | HIGH-THROUGHPUT MULTI-STAGE MANUFACTURING PLATFORM AND METHOD FOR PROCESSING A PLURALITY OF SUBSTRATES | TOKYO ELECTRON LIMITED |
| WO/2021/138134 | METHODS AND APPARATUS FOR DIGITAL MATERIAL DEPOSITION ONTO SEMICONDUCTOR WAFERS | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/188181 | METHODS FOR EUV INVERSE PATTERNING IN PROCESSING OF MICROELECTRONIC WORKPIECES | TOKYO ELECTRON LIMITED |
| WO/2021/194593 | METHODS TO REDUCE MICROBRIDGE DEFECTS IN EUV PATTERNING FOR MICROELECTRONIC WORKPIECES | TOKYO ELECTRON LIMITED |
| WO/2021/150346 | METHODS FOR MAKING DOUBLE-SIDED SEMICONDUCTOR DEVICES AND RELATED DEVICES, ASSEMBLIES, PACKAGES AND SYSTEMS | MICRON TECHNOLOGY, INC. |
| WO/2021/262236 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LOW RESISTANCE SOURCE-LEVEL CONTACT AND METHOD OF MAKING THEREOF | SANDISK TECHNOLOGIES LLC |
| WO/2021/252019 | METHOD AND APPARATUS FOR DEPOSITING A MULTI-SECTOR FILM ON BACKSIDE OF A SEMICONDUCTOR WAFER | SANDISK TECHNOLOGIES LLC |
| WO/2021/141798 | CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/242321 | SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING BONDING PADS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/141806 | AUTOMATED CLEANING OF ROBOT ARMS OF SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/236168 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING WRAP AROUND WORD LINES AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/221738 | THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING LAYERS AND METHODS FOR FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/138528 | 3D COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) DEVICE AND METHOD OF FORMING THE SAME | TOKYO ELECTRON LIMITED |
| WO/2021/011945 | INTEGRATION OF VERTICAL GAN VARACTOR WITH HEMT | QUALCOMM INCORPORATED |
| WO/2021/022275 | FINFET SEMICONDUCTOR DEVICE | QUALCOMM INCORPORATED |
| WO/2021/011946 | INTEGRATION OF VERTICAL GAN VARACTOR WITH HEMT | QUALCOMM INCORPORATED |
| WO/2021/007585 | MELT DETECTION SYSTEMS AND METHODS OF USING THE SAME | VEECO INSTRUMENTS INC. |
| WO/2021/011950 | MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSING | LAM RESEARCH CORPORATION |
| WO/2021/030822 | PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE | CANON KABUSHIKI KAISHA |
| WO/2021/030823 | PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE | CANON KABUSHIKI KAISHA |
| WO/2021/022291 | INTEGRATED ADAPTIVE POSITIONING SYSTEMS AND ROUTINES FOR AUTOMATED WAFER-HANDLING ROBOT TEACH AND HEALTH CHECK | LAM RESEARCH CORPORATION |
| WO/2021/030833 | MODEL BASED CONTROL OF WAFER NON-UNIFORMITY | LAM RESEARCH CORPORATION |
| WO/2021/035236 | SUBSTANTIALLY CARBON-FREE MOLYBDENUM-CONTAINING AND TUNGSTEN-CONTAINING FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING | LAM RESEARCH CORPORATION |
| WO/2021/030836 | TUNGSTEN DEPOSITION | LAM RESEARCH CORPORATION |
| WO/2021/035254 | REDUCING LINE BENDING DURING METAL FILL PROCESS | LAM RESEARCH CORPORATION |
| WO/2021/046572 | STIMULUS RESPONSIVE POLYMER FILMS AND FORMULATIONS | LAM RESEARCH CORPORATION |
| WO/2021/141835 | PROJECTION AND DISTANCE SEGMENTATION ALGORITHM FOR WAFER DEFECT DETECTION | KLA CORPORATION |
| WO/2021/201940 | CYCLIC SELF-LIMITING ETCH PROCESS | TOKYO ELECTRON LIMITED |
| WO/2021/154468 | WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR APPLICATIONS | APPLIED MATERIALS, INC. |
| WO/2021/262249 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING III-V COMPOUND SEMICONDUCTOR CHANNEL LAYER AND METHOD OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
| WO/2021/146098 | MIXED METAL BASEPLATES FOR IMPROVED THERMAL EXPANSION MATCHING WITH THERMAL OXIDE SPRAYCOAT | LAM RESEARCH CORPORATION |
| WO/2021/142357 | TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING AND RAMPING | LAM RESEARCH CORPORATION |
| WO/2021/142400 | ADVANCED IN-LINE PART AVERAGE TESTING | KLA CORPORATION |
| WO/2021/146123 | MULTIPLE PATTERNING WITH SELECTIVE MANDREL FORMATION | TOKYO ELECTRON LIMITED |
| WO/2021/150392 | GATE ALL AROUND TRANSISTORS WITH HIGH CHARGE MOBILITY CHANNEL MATERIALS | QUALCOMM INCORPORATED |
| WO/2021/150397 | FLEXIBLE GAA NANOSHEET HEIGHT AND CHANNEL MATERIALS | QUALCOMM INCORPORATED |
| WO/2021/146229 | GROUP III HEMT AND CAPACITOR THAT SHARE STRUCTURAL FEATURES | CREE, INC. |
| WO/2021/173243 | COMPLEMENTARY CELL CIRCUITS EMPLOYING ISOLATION STRUCTURES FOR DEFECT REDUCTION AND RELATED METHODS OF FABRICATION | QUALCOMM INCORPORATED |
| WO/2021/150419 | HIGH-THROUGHPUT DRY ETCHING OF SILICON OXIDE AND SILICON NITRIDE MATERIALS BY IN-SITU AUTOCATALYST FORMATION | TOKYO ELECTRON LIMITED |
| WO/2021/158346 | SHOWERHEAD ASSEMBLY | APPLIED MATERIALS, INC. |
| WO/2021/146623 | METHOD FOR ETCHING OR DEPOSITION | ENTEGRIS, INC. |
| WO/2021/178052 | CAPACITIVE SENSOR FOR CHAMBER CONDITION MONITORING | APPLIED MATERIALS, INC. |
| WO/2021/150548 | EDGE RING TRANSFER WITH AUTOMATED ROTATIONAL PRE-ALIGNMENT | LAM RESEARCH CORPORATION |
| WO/2021/178062 | NANOWIRE WITH REDUCED DEFECTS | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/150625 | METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITIING A CAPPING LAYER IN A STRUCTURE | APPLIED MATERIALS, INC. |
| WO/2021/151067 | SELECTIVE DEPOSITION OF SICON BY PLASMA ALD | APPLIED MATERIALS, INC. |
| WO/2021/154640 | SUBSTRATE TRANSPORT APPARATUS | BROOKS AUTOMATION, INC. |
| WO/2021/154641 | UV CURE FOR LOCAL STRESS MODULATION | LAM RESEARCH CORPORATION |
| WO/2021/154653 | ALLOY FILM ETCH | LAM RESEARCH CORPORATION |
| WO/2021/167754 | MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILM | APPLIED MATERIALS, INC. |
| WO/2021/154747 | PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES | LAM RESEARCH CORPORATION |
| WO/2021/154754 | COMPONENT WITH PROTECTIVE SURFACE FOR PROCESSING CHAMBER | LAM RESEARCH CORPORATION |
| WO/2021/154765 | SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE PRINT CHECK ALIGNMENT | KLA CORPORATION |
| WO/2021/158402 | ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES | LAM RESEARCH CORPORATION |
| WO/2021/154899 | SYSTEM AND METHOD FOR IDENTIFYING LATENT RELIABILITY DEFECTS IN SEMICONDUCTOR DEVICES | KLA CORPORATION |
| WO/2021/154949 | WAFER CHUCK WITH THERMAL TUNING CAVITY FEATURES | LAM RESEARCH CORPORATION |
| WO/2021/154957 | SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLY | LITTELFUSE, INC. |
| WO/2021/178078 | INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS | QUALCOMM INCORPORATED |
| WO/2021/162871 | HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY | LAM RESEARCH CORPORATION |
| WO/2021/158482 | METHOD FOR USING ULTRA-THIN ETCH STOP LAYERS IN SELECTIVE ATOMIC LAYER ETCHING | TOKYO ELECTRON LIMITED |
| WO/2021/158608 | LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTOR | BOWLING GREEN STATE UNIVERSITY |
| WO/2021/158727 | METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING CUTTING TOOLS TO EXPOSE METALIZATION PADS THROUGH A CAP STRUCTURE AND RELATED CUTTING DEVICES | AKOUSTIS, INC. |
| WO/2021/158748 | SELECTIVE DEPOSITION OF CONDUCTIVE CAP FOR FULLY-ALIGNED-VIA (FAV) | TOKYO ELECTRON LIMITED |
| WO/2021/162932 | METHODS AND APPARATUS FOR IMPROVING FLOW UNIFORMITY IN A PROCESS CHAMBER | APPLIED MATERIALS, INC. |
| WO/2021/158846 | METHODS FOR PRESSURE RAMPED PLASMA PURGE | APPLIED MATERIALS, INC. |
| WO/2021/158942 | SUBSTRATE PROCESSING APPARATUS | BROOKS AUTOMATION, INC. |
| WO/2021/167809 | CORE REMOVAL | LAM RESEARCH CORPORATION |
| WO/2021/188226 | PLANARIZATION OF SPIN-ON FILMS | TOKYO ELECTRON LIMITED |
| WO/2021/201989 | HIGH TEMPERATURE MICRO-ZONE ELECTROSTATIC CHUCK | APPLIED MATERIALS, INC. |
| WO/2021/163202 | METHOD FOR FORMING COMPONENTS WITHOUT ADDING TABS DURING ETCHING | HUTCHINSON TECHNOLOGY INCORPORATED |
| WO/2021/163221 | OXIDATION INHIBITING GAS IN A MANUFACTURING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/163230 | LARGE AREA GROUP III NITRIDE CRYSTALS AND SUBSTRATES, METHODS OF MAKING, AND METHODS OF USE | SLT TECHNOLOGIES, INC. |
| WO/2021/216170 | NITROGEN-DOPED CARBON HARDMASK FILMS | APPLIED MATERIALS, INC. |
| WO/2021/173360 | BATCH PROCESSING OVEN AND METHOD | YIELD ENGINEERING SYSTEMS, INC. |
| WO/2021/167836 | HYDROGEN FREE SILICON DIOXIDE | APPLIED MATERIALS, INC. |
| WO/2021/211197 | LOW- VOLTAGE ELECTRON BEAM CONTROL OF CONDUCTIVE STATE AT A COMPLEX-OXIDE INTERFACE | UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION |
| WO/2021/178123 | SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES | APPLIED MATERIALS, INC. |
| WO/2021/163553 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING A FLIPPER FOR IN-PROCESS SUBSTRATES | JABIL INC. |
| WO/2021/163664 | APPARATUS, SYSTEM AND METHOD FOR PROVIDING A SUBSTRATE CHUCK | JABIL INC. |
| WO/2021/167904 | PARTIAL DISCHARGE SUPPRESSION IN HIGH VOLTAGE SOLID-STATE DEVICES | SAMPAYAN, Stephen |
| WO/2021/173400 | FORMING A SEMICONDUCTOR FEATURE USING ATOMIC LAYER ETCH | TOKYO ELECTRON LIMITED |
| WO/2021/168025 | WAFER LIFT PIN MECHANISM FOR PREVENTING LOCAL BACKSIDE DEPOSITION | LAM RESEARCH CORPORATION |
| WO/2021/173421 | DIELECTRIC ETCH STOP LAYER FOR REACTIVE ION ETCH (RIE) LAG REDUCTION AND CHAMFER CORNER PROTECTION | TOKYO ELECTRON LIMITED |
| WO/2021/168134 | GRAPHENE INTEGRATION | LAM RESEARCH CORPORATION |
| WO/2021/183270 | METHODS FOR GAPFILL IN SUBSTRATES | APPLIED MATERIALS, INC. |
| WO/2021/173498 | SEMICONDUCTOR PROCESSING CHAMBER WITH DUAL-LIFT MECHANISM FOR EDGE RING ELEVATION MANAGEMENT | LAM RESEARCH CORPORATION |
| WO/2021/183279 | SUBSTRATE SUPPORTS INCLUDING BONDING LAYERS WITH STUD ARRAYS FOR SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/173557 | MULTI-LAYER HARDMASK FOR DEFECT REDUCTION IN EUV PATTERNING | LAM RESEARCH CORPORATION |
| WO/2021/173607 | RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL STRUCTURES ON MICROELECTRONIC WORKPIECES | TOKYO ELECTRON LIMITED |
| WO/2021/173682 | TRANSMISSION-BASED TEMPERATURE MEASUREMENT OF A WORKPIECE IN A THERMAL PROCESSING SYSTEM | MATTSON TECHNOLOGY, INC. |
| WO/2021/173685 | SUPPORT STRUCTURE FOR THERMAL PROCESSING SYSTEMS | MATTSON TECHNOLOGY, INC. |
| WO/2021/178192 | CHILLER MAKE-BREAK CONNECTOR FOR SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/173788 | CU<sb>3</sb>SN VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3D-INTEGRATION | RAYTHEON COMPANY |
| WO/2021/173876 | SERVO CONTROL OF A LIFT APPARATUS AND METHODS OF USE THEREOF | APPLIED MATERIALS, INC. |
| WO/2021/173886 | THERMAL ICEFILL AND RECESS ETCH MATCHING | LAM RESEARCH CORPORATION |
| WO/2021/178249 | METHOD TO PRODUCE GRAPHENE AND METAL-GRAPHENE COMPOSITE FILMS USING MICROPLASMA-BASED SYNTHESIS | WEST VIRGINIA UNIVERSITY |
| WO/2021/174137 | LOW ETCH PIT DENSITY, LOW SLIP LINE DENSITY, AND LOW STRAIN INDIUM PHOSPHIDE | AXT, INC. |
| WO/2021/178266 | LINEAR ARRANGEMENT FOR SUBSTRATE PROCESSING TOOLS | LAM RESEARCH CORPORATION |
| WO/2021/178267 | PEDESTAL INCLUDING PEDESTAL PLATES FOR SEMICONDUCTOR FAB TOOLS AND METHOD FOR ORIENTING THE PEDESTAL PLATES | LAM RESEARCH CORPORATION |
| WO/2021/178270 | ADAPTER PLATE TO ATTACH TURBO PUMPS TO PROCESS MODULES | LAM RESEARCH CORPORATION |
| WO/2021/178310 | CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSING | LAM RESEARCH CORPORATION |
| WO/2021/178341 | LAMINATE STACKED ON DIE FOR HIGH VOLTAGE ISOLATION CAPACITOR | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/202029 | INSPECTION SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/178399 | ATOMIC LAYER ETCHING OF MOLYBDENUM | LAM RESEARCH CORPORATION |
| WO/2021/242345 | SAG NANOWIRE GROWTH WITH ION IMPLANTATION | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/242346 | SAG NANOWIRE GROWTH WITH A PLANARIZATION PROCESS | MICROSOFT TECHNOLOGY LICENSING, LLC |
| WO/2021/178436 | DISPENSING APPARATUS | ILLINOIS TOOL WORKS INC. |
| WO/2021/183332 | LONG WAVE INFRARED THERMAL SENSOR FOR INTEGRATION INTO TRACK SYSTEM | TOKYO ELECTRON LIMITED |
| WO/2021/178478 | LOW TEMPERATURE STEAM FREE OXIDE GAPFILL | APPLIED MATERIALS, INC. |
| WO/2021/178703 | MANIFOLD FOR A SUBSTRATE CONTAINER | ENTEGRIS, INC. |
| WO/2021/194724 | LOAD LOCK WITH INTEGRATED FEATURES | APPLIED MATERIALS, INC. |
| WO/2021/202059 | LIGHT EMITTING DEVICE WITH SMALL FOOTPRINT | HERNER, Scott, Brad |
| WO/2021/183472 | METAL DEPOSITION PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. |
| WO/2021/188325 | DETERMINING METROLOGY-LIKE INFORMATION FOR A SPECIMEN USING AN INSPECTION TOOL | KLA CORPORATION |
| WO/2021/183621 | SELECTIVE OXIDATION AND SIMPLIFIED PRE-CLEAN | APPLIED MATERIALS, INC. |
| WO/2021/188339 | SYSTEM AND METHODS FOR WAFER DRYING | TOKYO ELECTRON LIMITED |
| WO/2021/202070 | HIGH ASPECT RATIO DIELECTRIC ETCH WITH CHLORINE | LAM RESEARCH CORPORATION |
| WO/2021/183728 | GAP FILL METHODS USING CATALYZED DEPOSITION | APPLIED MATERIALS, INC. |
| WO/2021/194752 | LOAD LOCK WITH INTEGRATED FEATURES | APPLIED MATERIALS, INC. |
| WO/2021/188352 | PLANARIZING ORGANIC FILMS | TOKYO ELECTRON LIMITED |
| WO/2021/242355 | METHODS OF MODIFYING PORTIONS OF LAYER STACKS | APPLIED MATERIALS, INC. |
| WO/2021/202080 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | LAM RESEARCH CORPORATION |
| WO/2021/194768 | FEATURE FILL WITH NUCLEATION INHIBITION | LAM RESEARCH CORPORATION |
| WO/2021/194776 | CATALYTIC FORMATION OF BORON AND CARBON FILMS | APPLIED MATERIALS, INC. |
| WO/2021/194780 | SUBSTRATE HOLDER FOR USE WITH INTERFEROMETER | CORNING INCORPORATED |
| WO/2021/194782 | POSITIONING DEVICES FOR RADIALLY POSITIONING SUBSTRATES WITH RESPECT TO AN AIR BEARING DEVICE | CORNING INCORPORATED |
| WO/2021/236213 | BACKSIDE DEPOSITON TUNING OF STRESS TO CONTROL WAFER BOW IN SEMICONDUCTOR PROCESSING | TOKYO ELECTRON LIMITED |
| WO/2021/188581 | CALIBRATION OF AN ELECTRONICS PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/188605 | SHEATH AND TEMPERATURE CONTROL OF A PROCESS KIT IN A SUBSTRATE PROCESSING CHAMBER | APPLIED MATERIALS, INC. |
| WO/2021/230980 | SELECTIVE DEPOSITION OF CARBON ON PHOTORESIST LAYER FOR LITHOGRAPHY APPLICATIONS | APPLIED MATERIALS, INC. |
| WO/2021/188752 | MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER | ADVANCED MICRO DEVICES, INC. |
| WO/2021/189000 | SUBSTRATE TRANSFER SYSTEMS AND METHODS OF USE THEREOF | APPLIED MATERIALS, INC. |
| WO/2021/202136 | COOLED EDGE RING WITH INTEGRATED SEALS | LAM RESEARCH CORPORATION |
| WO/2021/194974 | SUBSTRATE PROCESSING SYSTEM CARRIER | APPLIED MATERIALS, INC. |
| WO/2021/194977 | ENCLOSURE SYSTEM SHELF | APPLIED MATERIALS, INC. |
| WO/2021/206898 | BOTTOM PURGE FOR SEMICONDUCTOR PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/202171 | RAPID AND PRECISE TEMPERATURE CONTROL FOR THERMAL ETCHING | LAM RESEARCH CORPORATION |
| WO/2021/195190 | IN-SITU WAFER THICKNESS AND GAP MONITORING USING THROUGH BEAM LASER SENSOR | LAM RESEARCH CORPORATION |
| WO/2021/202193 | METHOD OF PATTERNING A METAL FILM WITH IMPROVED SIDEWALL ROUGHNESS | TOKYO ELECTRON LIMITED |
| WO/2021/202229 | PROCESSING OF WORKPIECES USING FLUOROCARBON PLASMA | MATTSON TECHNOLOGY, INC. |
| WO/2021/195463 | PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST PACKAGE SUBSTRATE | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/195476 | DECK BOARD APPARATUS AND METHOD OF MAKING SAME | STRONGWELL CORPORATION |
| WO/2021/221839 | ELECTROSTATIC CLAMPING SYSTEM AND METHOD | APPLIED MATERIALS, INC. |
| WO/2021/221841 | SYSTEM AND METHOD FOR LIQUID DISPENSE AND COVERAGE CONTROL | TOKYO ELECTRON LIMITED |
| WO/2021/195595 | INDIUM GALLIUM NITRIDE LIGHT EMITTING DIODES WITH REDUCED STRAIN | GOOGLE LLC |
| WO/2021/206939 | SEMICONDUCTOR SUBSTRATE SUPPORT WITH INTERNAL CHANNELS | APPLIED MATERIALS, INC. |
| WO/2021/206940 | SLIDE AND PIVOT ASSEMBLIES FOR PROCESS MODULE BIAS ASSEMBLIES OF SUBSTRATE PROCESSING SYSTEMS | LAM RESEARCH CORPORATION |
| WO/2021/195607 | HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS INTEGRITY | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/202411 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | LAM RESEARCH CORPORATION |
| WO/2021/206950 | CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORS | LAM RESEARCH CORPORATION |
| WO/2021/202611 | SLIT VALVE PNEUMATIC CONTROL | APPLIED MATERIALS, INC. |
| WO/2021/221849 | HIGH PERFORMANCE MULTI-DIMENSIONAL DEVICE AND LOGIC INTEGRATION | TOKYO ELECTRON LIMITED |
| WO/2021/221850 | ADAPTIVE GEOMETRY FOR OPTIMAL FOCUSED ION BEAM ETCHING | APPLIED MATERIALS ISRAEL LTD. |
| WO/2021/202741 | METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS | MAVLIEV, Rashid |
| WO/2021/202808 | SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL | LAM RESEARCH CORPORATION |
| WO/2021/202911 | METHOD OF FORMING HOLES FROM BOTH SIDES OF SUBSTRATE | APPLIED MATERIALS, INC. |
| WO/2021/203000 | DUAL GATE AND SINGLE ACTUATOR SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/203021 | PROGRAMMABLE NANOLITHOGRAPHY MASK | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| WO/2021/221862 | SYSTEMS AND METHODS TO CONTROL CRITICAL DIMENSION (CD) SHRINK RATIO THROUGH RADIO FREQUENCY (RF) PULSING | TOKYO ELECTRON LIMITED |
| WO/2021/207286 | SELECTIVE ETCH USING DEPOSITION OF A METALLOID OR METAL CONTAINING HARDMASK | LAM RESEARCH CORPORATION |
| WO/2021/216283 | NOVEL METHODS FOR GAS PHASE SELECTIVE ETCHING OF SILICON-GERMANIUM LAYERS | PRAXAIR TECHNOLOGY, INC. |
| WO/2021/207537 | METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC LAYER FOR BOTTOM UP GAPFILL | APPLIED MATERIALS, INC. |
| WO/2021/207608 | HIGH TEMPERATURE VACUUM SEAL | APPLIED MATERIALS, INC. |
| WO/2021/221886 | HEATER COVER PLATE FOR UNIFORMITY IMPROVEMENT | APPLIED MATERIALS, INC. |
| WO/2021/211397 | THERMALLY CONTROLLED LID STACK COMPONENTS | APPLIED MATERIALS, INC. |
| WO/2021/231008 | FLOATING PIN FOR SUBSTRATE TRANSFER | APPLIED MATERIALS, INC. |
| WO/2021/211429 | SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTING WAFER | ELEMENTAL SCIENTIFIC, INC. |
| WO/2021/211480 | MINI-ENVIRONMENT SYSTEM FOR CONTROLLING OXYGEN AND HUMIDITY LEVELS WITHIN A SAMPLE TRANSPORT DEVICE | KLA CORPORATION |
| WO/2021/211486 | METHODS AND APPARATUS FOR INTEGRATED COBALT DISILICIDE FORMATION | APPLIED MATERIALS, INC. |
| WO/2021/225759 | MULTI-ZONE PLATEN TEMPERATURE CONTROL | APPLIED MATERIALS, INC. |
| WO/2021/211528 | METHODS OF DIELECTRIC MATERIAL FILL AND TREATMENT | APPLIED MATERIALS, INC. |
| WO/2021/211536 | VALVE APPARATUSES AND RELATED METHODS FOR REACTIVE PROCESS GAS ISOLATION AND FACILITATING PURGE DURING ISOLATION | MKS INSTRUMENTS, INC. |
| WO/2021/211844 | INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/242433 | GENERATING A LOW-TEMPERATURE SUBSTRATE PROTECTIVE LAYER | LAM RESEARCH CORPORATION |
| WO/2021/211988 | TARGET FOR OPTICAL MEASUREMENT OF TRENCHES | ONTO INNOVATION INC. |
| WO/2021/216453 | COMPLIANCE COMPONENTS FOR SEMICONDUCTOR PROCESSING SYSTEM | APPLIED MATERIALS, INC. |
| WO/2021/216455 | CRYSTALLINE DIELECTRIC SYSTEMS FOR INTERCONNECT CIRCUIT MANUFACTURING | TOKYO ELECTRON LIMITED |
| WO/2021/216462 | ENHANCED CLOSED LOOP GAS BASED HEAT EXCHANGE | LAM RESEARCH CORPORATION |
| WO/2021/225774 | EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR APPLICATIONS | LAM RESEARCH CORPORATION |
| WO/2021/216520 | THERMAL INTERFACE FOR THERMAL LEVELER | MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC. |
| WO/2021/216557 | METHODS AND APPARATUS FOR REDUCING DEFECTS IN PRECLEAN CHAMBERS | APPLIED MATERIALS, INC. |
| WO/2021/231046 | METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA | APPLIED MATERIALS, INC. |
| WO/2021/225790 | INERT GAS IMPLANTATION FOR HARD MASK SELECTIVITY IMPROVEMENT | LAM RESEARCH CORPORATION |
| WO/2021/257180 | INTEGRATED TRANSISTORS WITH SHARED ELECTRODE | MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC. |
| WO/2021/225818 | III-V COMPOUND SEMICONDUCTOR DIES WITH STRESS-TREATED INACTIVE SURFACES AND MANUFACTURING METHODS THEREOF | QUALCOMM INCORPORATED |
| WO/2021/257185 | CRYOGENIC ATOMIC LAYER ETCH WITH NOBLE GASES | APPLIED MATERIALS, INC. |
| WO/2021/247168 | METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES | APPLIED MATERIALS, INC. |
| WO/2021/225860 | PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS OF IMPLEMENTING THE SAME | WOLFSPEED, INC. |
| WO/2021/222603 | RETICLE POD SEALING | ENTEGRIS, INC. |
| WO/2021/225880 | SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES AND METHODS OF FABRICATING | QUALCOMM INCORPORATED |
| WO/2021/225883 | SEAMLESS GAP FILL WITH DIELECTRIC ALD FILMS | APPLIED MATERIALS, INC. |
| WO/2021/247175 | MID-CHAMBER FLOW OPTIMIZER | LAM RESEARCH CORPORATION |
| WO/2021/231122 | METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THROUGH SENSORS AND CONTROL ALGORITHMS | LAM RESEARCH CORPORATION |
| WO/2021/231127 | EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS | LAM RESEARCH CORPORATION |
| WO/2021/226016 | MULTIPLE PATTERNING WITH ORGANOMETALLIC PHOTOPATTERNABLE LAYERS WITH INTERMEDIATE FREEZE STEPS | INPRIA CORPORATION |
| WO/2021/231138 | AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD CONTROL | LAM RESEARCH CORPORATION |
| WO/2021/226170 | BINARY METAL LINER LAYERS | APPLIED MATERIALS, INC. |
| WO/2021/226203 | MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL | APPLIED MATERIALS, INC. |
| WO/2021/252104 | SUBSTRATE COMPRISING A HIGH-DENSITY INTERCONNECT PORTION EMBEDDED IN A CORE LAYER | QUALCOMM INCORPORATED |
| WO/2021/252107 | METHOD TO FORM NARROW SLOT CONTACTS | TOKYO ELECTRON LIMITED |
| WO/2021/252108 | METHOD OF MAKING 3D ISOLATION | TOKYO ELECTRON LIMITED |
| WO/2021/226280 | FRONT SURFACE AND BACK SURFACE ORIENTATION DETECTION OF TRANSPARENT SUBSTRATE | APPLIED MATERIALS, INC. |
| WO/2021/226287 | METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE | APPLIED MATERIALS, INC. |
| WO/2021/231157 | SYSTEM, METHOD, AND TARGET FOR WAFER ALIGNMENT | KLA CORPORATION |
| WO/2021/236359 | SYSTEMS AND METHODS FOR SELECTIVE ION MASS SEGREGATION IN PULSED PLASMA ATOMIC LAYER ETCHING | TOKYO ELECTRON LIMITED |
| WO/2021/231215 | APPARATUS AND METHODS FOR REAL-TIME WAFER CHUCKING DETECTION | APPLIED MATERIALS, INC. |
| WO/2021/231306 | RESIDUE-FREE REMOVAL OF STIMULUS RESPONSIVE POLYMERS FROM SUBSTRATES | LAM RESEARCH CORPORATION |
| WO/2021/231307 | CONTROLLED DEGRADATION OF A STIMULI-RESPONSIVE POLYMER FILM | LAM RESEARCH CORPORATION |
| WO/2021/231456 | METHOD FOR DRY ETCHING SILICON CARBIDE FILMS FOR RESIST UNDERLAYER APPLICATIONS | TOKYO ELECTRON LIMITED |
| WO/2021/231469 | ELECTROSTATIC CHUCK HAVING A GAS FLOW FEATURE, AND RELATED METHODS | ENTEGRIS, INC. |
| WO/2021/231525 | SOLDER TRENCH | NOKIA TECHNOLOGIES OY |
| WO/2021/231537 | SEAL RETAINER FOR A COMPONENT ASSEMBLY AND METHOD OF INSTALLING A COMPONENT INTO AN APPARATUS FOR CONTROLLING FLOW | ICHOR SYSTEMS, INC. |
| WO/2021/257208 | METHOD FOR REDUCING LATERAL FILM FORMATION IN AREA SELECTIVE DEPOSITION | TOKYO ELECTRON LIMITED |
| WO/2021/231629 | HIGH FREQUENCY RF GENERATOR AND DC PULSING | EAGLE HARBOR TECHNOLOGIES, INC. |
| WO/2021/236406 | SEAL INSERTION TOOL FOR A FLUID DELIVERY MODULE AND METHOD OF INSTALLING A SEAL INTO A FLUID DELIVERY MODULE | ICHOR SYSTEMS, INC. |
| WO/2021/262340 | RADIATION OF SUBSTRATES DURING PROCESSING AND SYSTEMS THEREOF | TOKYO ELECTRON LIMITED |
| WO/2021/236493 | DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER PROTECTIONS | APPLIED MATERIALS, INC. |
| WO/2021/236886 | WET FUNCTIONALIZATION OF DIELECTRIC SURFACES | LAM RESEARCH CORPORATION |
| WO/2021/262352 | AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING | APPLIED MATERIALS, INC. |
| WO/2021/237032 | LOW RESISTIVITY CONTACTS AND INTERCONNECTS | LAM RESEARCH CORPORATION |
| WO/2021/262361 | LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH | APPLIED MATERIALS, INC. |
| WO/2021/237175 | METHOD FOR PATTERN REDUCTION USING A STAIRCASE SPACER | TOKYO ELECTRON LIMITED |
| WO/2021/242658 | TRANSFERRING LARGE-AREA GROUP III-NITRIDE SEMICONDUCTOR MATERIAL AND DEVICES TO ARBITRARY SUBSTRATES | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY |
| WO/2021/257254 | SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD TEMPERATURE CONTROL | GLOBALWAFERS CO., LTD. |
| WO/2021/262371 | SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST DEPOSITION | LAM RESEARCH CORPORATION |
| WO/2021/242781 | VARIABLE LOOP CONTROL FEATURE | APPLIED MATERIALS, INC. |
| WO/2021/243161 | MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRONICS PACKAGE FORMED THEREBY | GENERAL ELECTRIC COMPANY |
| WO/2021/243225 | 3D ELECTRICAL INTEGRATION USING COMPONENT CARRIER EDGE CONNECTIONS TO A 2D CONTACT ARRAY | FORM FACTOR, INC. |
| WO/2021/243325 | ROBOT FOR HIGH-TEMPERATURE APPLICATIONS | PERSIMMON TECHNOLOGIES CORPORATION |
| WO/2021/247573 | DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER SOURCE | APPLIED MATERIALS, INC. |
| WO/2021/247586 | DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER SOURCE | APPLIED MATERIALS, INC. |
| WO/2021/247592 | IN-FEATURE WET ETCH RATE RATIO REDUCTION | LAM RESEARCH CORPORATION |
| WO/2021/247627 | MONOBLOC PEDESTAL FOR EFFICIENT HEAT TRANSFER | LAM RESEARCH CORPORATION |
| WO/2021/252229 | FULLY SELF-ALIGNED SUBTRACTIVE ETCH | APPLIED MATERIALS, INC. |
| WO/2021/247633 | IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL INTERCONNECT LEVEL | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/252246 | IMAGE ALIGNMENT SETUP FOR SPECIMENS WITH INTRA- AND INTER-SPECIMEN VARIATIONS USING UNSUPERVISED LEARNING AND ADAPTIVE DATABASE GENERATION METHODS | KLA CORPORATION |
| WO/2021/252276 | PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES AND THERMAL VOIDS | LAM RESEARCH CORPORATION |
| WO/2021/247979 | FLUORINE-FREE TUNGSTEN ALD FOR DIELECTRIC SELECTIVITY IMPROVEMENT | APPLIED MATERIALS, INC. |
| WO/2021/248099 | A-AXIS JOSEPHSON JUNCTIONS WITH IMPROVED SMOOTHNESS | AMBATURE, INC. |
| WO/2021/257301 | FORMING A SEMICONDUCTOR DEVICE USING A PROTECTIVE LAYER | TOKYO ELECTRON LIMITED |
| WO/2021/257311 | A FINFET WITH LATERAL CHARGE BALANCE AT THE DRAIN DRIFT REGION | TEXAS INSTRUMENTS INCORPORATED |
| WO/2021/257317 | GATE INTERFACE ENGINEERING WITH DOPED LAYER | APPLIED MATERIALS, INC. |
| WO/2021/252758 | FLAT BOTTOM SHADOW RING | LAM RESEARCH CORPORATION |
| WO/2021/252826 | SURFACE PROFILE MAPPING FOR EVALUATING III-N DEVICE PERFORMANCE AND YIELD | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY |
| WO/2021/257392 | METHOD FOR AREA SELECTIVE DEPOSITION USING A SURFACE CLEANING PROCESS | TOKYO ELECTRON LIMITED |
| WO/2021/257396 | METHOD FOR NUCLEATION OF CONDUCTIVE NITRIDE FILMS | ENTEGRIS, INC. |
| WO/2021/252967 | THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL | APPLIED MATERIALS, INC. |
| WO/2021/257440 | METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOW | APPLIED MATERIALS, INC. |
| WO/2021/257462 | SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS | LAM RESEARCH CORPORATION |
| WO/2021/257488 | ROBOTIC END EFFECTOR EQUIPPED WITH REPLACEABLE WAFER CONTACT PADS | FABWORX SOLUTIONS, INC. |
| WO/2021/257537 | METHODS AND APPARATUS FOR ALUMINUM OXIDE SURFACE RECOVERY | APPLIED MATERIALS, INC. |
| WO/2021/262488 | SYSTEMS AND METHODS FOR CHUCK CLEANING | KLA CORPORATION |
| WO/2021/262522 | HARD MASK DEPOSITION USING DIRECT CURRENT SUPERIMPOSED RADIO FREQUENCY PLASMA | TOKYO ELECTRON LIMITED |
| WO/2021/262527 | SELECTIVE DEPOSITION USING GRAPHENE AS AN INHIBITOR | LAM RESEARCH CORPORATION |
| WO/2021/257889 | BATCH WAFER DEGAS CHAMBER AND INTEGRATION INTO FACTORY INTERFACE AND VACUUM-BASED MAINFRAME | APPLIED MATERIALS, INC. |
| WO/2021/262529 | DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST | LAM RESEARCH CORPORATION |
| WO/2021/262542 | LOW-TEMPERATURE PLASMA PRE-CLEAN FOR SELECTIVE GAP FILL | APPLIED MATERIALS, INC. |
| WO/2021/262543 | ULTRA-THIN FILMS WITH TRANSITION METAL DICHALCOGENIDES | APPLIED MATERIALS, INC. |
| WO/2021/262585 | MULTI-STATION PROCESSING TOOLS WITH STATION-VARYING SUPPORT FEATURES FOR BACKSIDE PROCESSING | LAM RESEARCH CORPORATION |
| WO/2021/262778 | SEMICONDUCTOR OVERLAY MEASUREMENTS USING MACHINE LEARNING | KLA CORPORATION |
| WO/2021/262841 | IODINE-CONTAINING FLUOROCARBON AND HYDROFLUOROCARBON COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | L'AIR LIQUIDE, SOCIETE ANONYME POURL'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE |
| WO/2021/262993 | WAFER BOATS FOR SUPPORTING SEMICONDUCTOR WAFERS IN A FURNACE | GLOBALWAFERS CO., LTD. |
| WO/2021/179000 | RING STRUCTURE WITH COMPLIANT CENTERING FINGERS | LAM RESEARCH CORPORATION |
https://blog.sciencenet.cn/blog-681765-1365959.html
上一篇：2021年电气元件和结构部件领域的PCT专利申请状况——中国占25%，美国占15%，日本占29%，欧洲占14%
下一篇：2021年半导体零配件领域的PCT专利申请状况——中国占23%，美国占14%，日本占49%，欧洲占6%
