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《信息与电子工程前沿(英文)》(FITEE)
“软件数据智能化分析”专题
征稿通知
2021年9月10日截稿,2022年4月刊出
软件数据智能化分析一直是软件工程研究领域的热点问题。随着诸如BERT、TRANSFORMER等人工智能分析新技术不断涌现,这些智能分析技术在各类软件开发和测试过程衍生的数据分析中取得积极效果,但也面临一些挑战。
为此,中国工程院院刊《信息与电子工程前沿(英文)》筹备“软件数据智能化分析”专题,公开征集智能化软件工程领域最新论文。该专题围绕软件数据智能化分析的相关问题、技术、场景、实践等,聚焦软件工程数据汇聚、软件工程信息融合、软件工程知识提炼等新方法、技术、平台与工具。通过吸引高质量的论文成果,使得软件开发者和研究者对如何利用人工智能和大数据最新技术和工具解决软件工程相关领域的问题(比如代码检索、缺陷定位和修复等)有更深入的了解。希冀这些高质量成果为开发软件产品和研究相关课题提供帮助和启发。
专题紧密结合当今智能化软件工程热点问题,包括但不限于以下主题:
专题编委会
主编:
张 涛,澳门科技大学
李 戈,北京大学
孙小兵,扬州大学
郑子彬,中山大学
主要时间点:
截稿:2021年9月10日
录用:2021年12月30日
出版:2022年4月
联系:
FITEE编辑部
邮箱:jzus_zzy@zju.edu.cn
电话:+86-571-88273162
投稿要求、期刊简介等,请见下方Call for Papers。
欢迎国内外相关领域专家、学者踊跃投稿!
FITEE Special Issue on
Software Data Intelligence Analysis (SDIA)
Call for Papers
(Submission by Sept. 10, 2021)
Software data intelligence analysis (SDIA) is a research hotspot. A series of artificial intelligence based data analysis technologies such as BERT and TRANSFORMER have been proposed. They have shown positive effects for the data analysis process of software development and testing.
With this background, the journal Frontiers of Information Technology & Electronic Engineering (FITEE) is organizing a special issue on "Software Data Intelligent Analysis," which accepts articles in the field of intelligent software engineering. This special issue covers the problems, technologies, settings, and practices of SDIA. By abstracting high quality articles, the special issue is aimed to facilitate developers and researchers to deeply understand how to use big data and new artificial intelligence technologies to resolve problems in the software engineering field, e.g., code search, bug localization, and bug fixing, as well as to help and enlighten researchers and engineers when they study such research topics and develop new software products.
The special issue covers multifaceted aspects of SDIA, including but not limited to:
Software engineering data coverage approaches, technologies, and tools
Software engineering information fusion approaches, technologies, and tools
Software engineering knowledge refining approaches, technologies, and tools
Intelligence analysis approaches, technologies, and tools for software construction
Intelligence analysis approaches, technologies, and tools for software testing
Intelligence analysis approaches, technologies, and tools for software development
Intelligence analysis approaches, technologies, and tools for software maintenance
Review, empirical study, and practices of SDIA
Editorial Board:
Editor-in-Chief:
Assoc Prof. Tao Zhang, Macau Univ Sci Technol, Macau, China
Editors (in alphabetical order of last names):
Assoc Prof. Ge Li, Peking Univ
Prof. Xiaobing Sun, Yangzhou Univ
Prof. Zibing Zheng, Sun Yat-sen Univ
Manuscript submission deadline:Sept.10,2021
Acceptance notification:Dec.30,2021
Publication date:Apr.,2022
Submission Instructions:
All submitted manuscripts must be written in English and must not be under consideration elsewhere for publication. Guidelines for authors are available athttp://www.jzus.zju.edu.cn/manuscript.php. Either Word or LaTeX format is acceptable. When Word format is used, the layout of the text should be in single column, 1.5 line spacing, 10.5 pt font size, and Times New Roman font. A template for LaTeX is available athttp://www.jzus.zju.edu.cn/download/FITEE_LaTex_template.zip. Manuscripts should be submitted via https://www.editorialmanager.com/zusc/ under the article type “S.I.-SDIA.”All articles will undergo international peer review and crosscheck processes before they are accepted to ensure high quality.
Introduction to FITEE:
FITEE is an international peer-reviewed journal launched by the Chinese Academy of Engineering (CAE) and Zhejiang University, co-published by Zhejiang University Press &Springer, and indexed by SCI-E (IF=1.604, 2019 JCR). FITEE aims to publish the latest implementation of applications, principles, and algorithms in the broad area of Electrical and Electronic Engineering.
Contact:
Editorial Office
Email: jzus_zzy@zju.edu.cn
Tel: +86 (0)571-88273162
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Frontiers of Information Technology & Electronic Engineering(简称FITEE,中文名《信息与电子工程前沿(英文)》,ISSN 2095-9184,CN 33-1389/TP)是信息电子类综合性英文学术月刊,SCI-E、EI收录,最新影响因子1.604,进入JCR Q2分区。前身为2010年创办的《浙江大学学报英文版C辑:计算机与电子》,2015年更为现名,现为中国工程院信息与电子工程学部唯一院刊。覆盖计算机、信息与通信、控制、电子、光学等领域。文章类型包括研究论文、综述、个人视点、评述等。现任主编为中国工程院院士潘云鹤、卢锡城。实行国际同行评审制,初次转达意见一般在2~3个月内。文章一经录用将快速在线。
2019年,荣获中国科协等七部委推出的中国科技期刊卓越行动计划项目资助(梯队期刊)。
官网:http://www.jzus.zju.edu.cn
期刊Springer主页:http://www.springer.com/computer/journal/11714
在线投稿:http://www.editorialmanager.com/zusc
更多信息,请见:FITEE影响因子提升55%,首次跨入Q2区
“信息与电子工程前沿FITEE”(fitee_cae)为中国工程院院刊《信息与电子工程前沿(英文)》(SCI-E、EI检索期刊)官方微信,功能包括:传播期刊的学术文章;为刊物关联学人(读者、作者、评审人、编委,等)提供便捷服务;发布学术写作、评审、编辑、出版等相关资讯;介绍信息与电子工程领域学术人物、学术思想、学术成果,展示该领域科学研究前沿进展;为该领域海内外学者提供友好互动平台。
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