（ EI Compendex & ISTP）
Male, Maldives  May 23～24, 2011

2011年第一届软磁材料国际学术大会
http://www.etp-conference.org/ICSMM2011/index.htm

 

     ICSMM is a leading International Conference on Soft Magnetic Materials. The International Conference on Soft Magnetic Materials aims to bring together academic scientists, leading engineers, industry researchers and scholar students to exchange and share their experiences and research results about all aspects of Soft Magnetic Materials, and discuss the practical challenges encountered and the solutions adopted.

      All ICSMM 2011 Accepted Papers will be published by Advanced Materials Research, ISSN: 1022-6680, which will be indexed by EI Compendex and ISTP.

        2011软磁材料国际学术会议将于5月23-24日在马尔代夫召开。会议由国际智能信息技术应用学会（IITA）主办，论文投稿可以是中、英文稿件，但是最后版本必须是英文。会议论文集将由国际期刊Advanced Materials Research（国际刊号:1022-6680) 出版，所有录用的论文将被EI和ISTP检索。优秀论文会后将推荐到SCI或EI国际期刊发表。

è  ICSMM 2011是Trans Tech Publications Inc.(www.ttp.net)重点支持的会议。

 

è  ICSMM 2011已经进入科学网会议列表：http://meeting.sciencenet.cn/cinfo.aspx?cid=1258
 
è  ICSMM 2011 Website: http://www.etp-conference.org/ICSMM2011/index.htm
 
è  The paper submission system is open: https://www.easychair.org/conferences/?conf=icsmm2011  

       投稿系统已开放: https://www.easychair.org/conferences/?conf=icsmm2011 
        为了方便作者投稿，如遇投稿系统繁忙，可以把稿件直接发到 ICSMM2011reg@126.com

è  Paper submission投稿
      投稿论文可以是中、英文稿件，但是最后版本必须是英文稿件。

 

è  优惠注册价格&灵活参会方式
      优惠注册价格：普通注册2600，学生注册2400，相同第一作者第二篇起每篇仅收1800出版费
      参会作者现场领取论文集和发票，没到会作者论文集和发票在会后一个月内速递,不影响论文索引 
è  Important Date:
      Paper Submission Deadline： Mar. 10, 2011
      Acceptance notification (录用通知): APR. 1, 2011 (We will review paper as soon as possible)
 
è  Contact us:
      The secretary of ICSMM 2011
      Tel: +86-13719187412, Dr Wang
      Email: ICSMM2011reg@126.com
     咨询QQ：1847915167

TOPICS：
Submissions of papers describing original work in, but not limited to, the following topics are enthusiastically encouraged.

 

Basic problems, magnetization processes, domain studies, micromagnetics.
Grain-oriented and non-oriented electrical steels.
Fe-Ni, Fe-Co, amorphous, and nanocrystalline alloys.
Soft ferrites, powder cores, and composite materials.
Thin films, metamaterials, novel and special materials.
Magnetic measurements and instrumentation.
Transformers, motors, actuators, and other power applications.
Sensors, high-frequency and electronic applications.
Shielding, environment, and energy saving applications.