3 June 2019

Element Six launches diamond thermal-material-grade Diafilm TM220, offering thermal conductivity over 2200W/mK

In booth 1190 at the International Microwave Symposium (IMS 2019) in Boston, MA, USA, Luxembourg-registered synthetic diamond materials firm Element Six (E6, part of the De Beers Group) is launching the diamond thermal-material-grade Diafilm TM220, which is claimed to be the first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200W/mK.

The launch is in response to the ever-increasing demand for more content and bandwidth, which is pushing the boundaries of semiconductor thermal management. The shift to higher frequencies is creating a unique opportunity for chemical vapor deposition (CVD) diamond, and Element Six says that the launch extends its portfolio of thermal materials to even higher heat-spreading capabilities.

The new grade of CVD diamond thermal material is suitable for the thermal management of high-power-density radio frequency (RF) and application-specific integrated circuits (ASIC) devices, as well resistive components for power management at high frequencies. Diafilm TM220 also has applications in gallium nitride (GaN)-based RF, in addition to monolithic microwave integrated circuits (MMICs) for phase-array radar, space and satellite, 5G base stations and beyond. Moreover, the success of terabit rate optoelectronics networks for both metro and long-haul content delivery is predicated on high-efficiency thermal management.

As with the other material grades of Diafilm TM, TM220 is thermally isotropic, spreading heat with equal efficiency in a planar direction as well as through the material. Additional Diafilm TM220 properties include dielectric permittivity, optical clarity, electrical insulation, low density and chemical inertness, making it suitable for pushing the boundaries of advanced thermal management as either an active or passive component, says the firm.

“This new material validates the unique multi-functionality of CVD diamond and further demonstrates Element Six’s leadership and innovation in CVD diamond synthesis and material characterization, where we continue to open up new areas of advancement,” says Speaking at IMS, Thomas Obeloer, business development manager for Thermal Applications. “We have already had positive feedback from customers in RF device packaging, x-ray generation and the high-performance ASIC sector, who were early adopters of the TM220 grade,” he adds.

Material blanks of Diafilm TM220 are available in standard thicknesses and can be made to meet specific customer requirements. To match the high performance of the diamond, the use of high-quality, sputter-deposited thin-film metallization is offered, and specifications to meet advanced needs for wire bonding or direct deposition of solder materials onto the CVD diamond can be supplied.

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5 June 2017

Element Six develops new thermal grade of CVD diamond heat spreader for high-frequency, high-power-density devices

Luxembourg-registered synthetic diamond materials firm Element Six (E6), a member of the De Beers Group of Companies, has developed a new thermal grade of synthetic diamond grown by chemical vapor deposition (CVD). Diafilm ETC700 is both thermally and electrically conductive and is suited to effectively managing heat in high-frequency, high-power-density devices, says the firm.

With a thermal conductivity of up to 700W/mK, Diafilm ETC700 CVD diamond heat spreaders are three times more effective in spreading heat than alternative ceramic solutions, reckons Element Six. This electrically conductive all-diamond solution does not require the metal coatings typical of other heat-management materials, resulting in reduced frequency-dependent conductive losses. Diafilm ETC700 is also claimed to outperform other commercially available metallized, non-diamond heat spreader materials or common metal solutions. A larger conduction cross-section enables better RF performance by improving the ground-plane isolation. Diafilm ETC700 maintains a high bulk thermal conductivity, while the bulk electrical conductivity reduces capacitive coupling between ground planes at low frequencies, and reduces conductive losses at higher frequencies.

Element Six claims that its range of Diafilm heat spreaders (available in a range of sizes, thicknesses and metallization) has the highest known thermal conductivity of any solid material at room temperature. With the addition of Diafilm ETC700, Element Six has expanded its portfolio to a total of six material grades spanning several levels of thermal, electrical performance and cost points, ranging from 700W/mK to 2000W/mK.

“For more than two decades, Element Six’s CVD diamond has proven to be the most effective heat management material, far surpassing the performance of competing materials such as copper or ceramics,” claims business development manager Thomas Obeloer. “Our team of developers is committed to continually improving upon our already industry-leading technology to meet new demands in advanced electronics and high-frequency devices.”

CVD diamond is said to be a superior material for high-power-density/high-frequency devices due to a unique combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. Diafilm ETC700 is claimed to offer better electrical device operation, lower operating temperatures and improved reliability and longer lifespans for high-frequency active semiconductors.