Jiratti Tengsuthiwat, Mavinkere Rangappa Sanjay, Suchart Siengchin, Catalin I. Pruncu
2020, Polymers - Article
The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer...more
2009, Transactions of The Japan Institute of Electronics Packaging - Article
Three-dimensional molded interconnected devices (3D-MID) extend the range of classical printed circuit boards (PCB) to the third dimension. Electrical circuits can be routed over any surface forms. Th...more
2016, 2016 12th International Congress Molded Interconnect Devices (MID) - Proceeding
In this paper we present a technology for the production of randomly shaped 3D electronic circuits, which is complementary to the 3D-MID technology. The technology is based on conventional printed cir...more
2016, 2016 IEEE/SICE International Symposium on System Integration (SII) - Proceeding
The installation of industrial robot systems requires considerable human effort both related to the mechanical and electromechanical setup. However, the task of programming a robot is of particular im...more
Due to their vast number of benefits, plenty of complex and miniaturized three dimensional molded interconnect devices are developed. One especially demanding process step during their manufacturing i...more
2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding
This paper describes a method for producing three-dimensional user interfaces. The technology is based on the conventional production of film insert molding components. As part of a research project, ...more
2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Proceeding
This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for ...more
Christian Goth, Thomas Kuhn, Gerald Gion, Jörg Franke
2014, Advanced Materials Research - Article
The adhesion test of metallic structures on MID (Molded Interconnect Devices) parts is an unsolved issue. So far no method really works reliably. The test methods which are conventionally used are the...more
2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Proceeding
Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space (L/S)=150 μm/150 μm and $L/S= 150~\mu m/100~\mu ...more
Philipp Ninz, Frank Kern, Eugen Ermantraut, Hagen Müller, Wolfgang Eberhardt, André Zimmermann, Rainer Gadow
2018, Procedia CIRP - Article
Laser induced selective activation and metallization of ceramics is a novel additive metal plating process enabling the application fine metallic paths or metallic surfaces on complex three-dimension...more
The present paper reports on the local atmospheric pressure plasma pretreatment of polymeric substrates for a subsequent metallization by electroless nickel and copper electrolytes, respectively. Plas...more
Annette Wimmer, Herbert Reichel, Bernhard Rauch, René Schramm, Johannes Hörber, Bastian Habler
2016, 2016 12th International Congress Molded Interconnect Devices (MID) - Proceeding
For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for a...more
Wimmer Annette, Schirmer Julian, Reichel Herbert, Reichenberger Marcus
2021, 2021 14th International Congress Molded Interconnect Devices (MID) - Proceeding
This paper describes a method for the technical engineering of threedimensional mechatronic interconnect devices. The technology is based on the conventional production of film insert molding componen...more
2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding
Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space $(\mathrm{L}/\mathrm{S}) = 150 \mu \mathrm{m}/150 \mu {\mat...more
F. Tricot, C. Venet, D. Beneventi, D. Curtil, D. Chaussy, T. P. Vuong, J. E. Broquin, N. Reverdy-Bruas
2018, RSC Advances - Article
<p xmlns="http://www.ncbi.nlm.nih.gov/JATS1" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">Evaluation of the printing quality of a direct writing process developed fo...more
Ph. Lombard, M. Cabrera, V. Semet, B. Allard, S. Kamotesov, Maël Moguedet, J-Y Charmeau
2017, J3eA - Article
Dans un contexte concurrentiel accru, les industries doivent développer de nouvelles solutions pour répondre à des défis majeurs (innovation, design, fonctionnalité, consommation…). La plastronique, q...more
Enrico Sita, Csongor Márk Horváth, Trygve Thomessen, Péter Korondi, Anthony G. Pipe
2017, 2017 IEEE/SICE International Symposium on System Integration (SII) - Proceeding
Planning and monitoring the manufacturing of high quality one-of-a-kind products are challenging tasks. In the implementation of an industrial system, the commissioning phase is typically comprised of...more
2005, Microengineering of Metals and Ceramics - Chapter
This chapter contains sections titled: Introduction Types of Microcomponents Characteristic Features of Microinjection Molding Machinery and Peripherals for Microinjection Molding Molding Tools for Mi...more