zhenguan0的个人博客分享 http://blog.sciencenet.cn/u/zhenguan0

博文

一篇关于PDMS弹性基底材料引入集成电路测试探针卡的论文

已有 3114 次阅读 2015-1-24 20:48 |系统分类:论文交流

Design, fabrication and characterization of MEMS probe card for fine pitch IC testing

TaoYuan, Di Chen, Jingdong Chen, HualinFu, Steffen Kurth, Thomas Otto and Thomas Gessner

Design, fabrication and characterization of MEMS probe card for fine pitch IC testing.pdf

This article introduces a novel type of MEMS probecard that uses polymer (polydimethylsiloxane, PDMS) as an elastic layer. Theelastic layer provides the flexibility when the probes are in contact with thechip pads. Through-holes in the PDMS and the low temperature co-fired ceramic(LTCC) substrate lead the signals or power to the back side of the LTCCsubstrate. The proposed MEMS probe card configuration potentially improves theprobe density and simplifies the fabrication process. The probes are formed byelectroplating on the PDMS substrate. The PDMS elastic substrate probe cardwith a probe pitch of 100 μm was developed for area array pad testing. Thecontact force is approximately 18 mN when the probes overdrive is 20 μm.Coplanar waveguides structures can be fabricated on the PDMS surface. The measuredinsertion loss is 0.2 dB at 3 GHz. The test data exhibited that the PDMSelastic substrate probe card is suitable for high-frequency wafer level ICtesting.


Design, fabrication and characterization of MEMS probe card for fine pitch IC testing.pdf



https://blog.sciencenet.cn/blog-59157-862464.html

上一篇:发表在Microelectronic Engineering上的有关血液分离的论文
下一篇:发表在Applied Physics Letters上关于PDMS气泡产生机制的论文
收藏 IP: 110.178.74.*| 热度|

0

该博文允许注册用户评论 请点击登录 评论 (0 个评论)

数据加载中...
扫一扫,分享此博文

Archiver|手机版|科学网 ( 京ICP备07017567号-12 )

GMT+8, 2024-3-28 16:17

Powered by ScienceNet.cn

Copyright © 2007- 中国科学报社

返回顶部