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Design, fabrication and characterization of MEMS probe card for fine pitch IC testing
TaoYuan, Di Chen, Jingdong Chen, HualinFu, Steffen Kurth, Thomas Otto and Thomas Gessner
Design, fabrication and characterization of MEMS probe card for fine pitch IC testing.pdf
This article introduces a novel type of MEMS probecard that uses polymer (polydimethylsiloxane, PDMS) as an elastic layer. Theelastic layer provides the flexibility when the probes are in contact with thechip pads. Through-holes in the PDMS and the low temperature co-fired ceramic(LTCC) substrate lead the signals or power to the back side of the LTCCsubstrate. The proposed MEMS probe card configuration potentially improves theprobe density and simplifies the fabrication process. The probes are formed byelectroplating on the PDMS substrate. The PDMS elastic substrate probe cardwith a probe pitch of 100 μm was developed for area array pad testing. Thecontact force is approximately 18 mN when the probes overdrive is 20 μm.Coplanar waveguides structures can be fabricated on the PDMS surface. The measuredinsertion loss is 0.2 dB at 3 GHz. The test data exhibited that the PDMSelastic substrate probe card is suitable for high-frequency wafer level ICtesting.
Design, fabrication and characterization of MEMS probe card for fine pitch IC testing.pdf
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