1

半导体制造

1798

15.1%

2

半导体零配件

945

12.9%

3

半导体元件

1268

7.7%

4

半导体组件与集成电路

1226

7.4%

5

信息存储

193

2.8%

6

材料化学与纳米

132

1.1%

7

光学和摄影

232

1.1%

8

基本电子电路

89

1.0%

9

电气元件和结构部件

128

0.7%

10

计算机一般零部件

131

0.6%

11

电热与等离子体

51

0.5%

12

光电辐射测量与核物理

65

0.5%

13

材料测试

32

0.3%

14

物理测量

32

0.2%

15

成型加工作业

48

0.2%

16

分离和混合加工作业

31

0.2%

17

计算机应用与软件工程

54

0.2%

18

发电和输变电

26

0.2%

19

物理信号和控制

26

0.1%

20

图像处理

19

0.1%

10526196

Structure and formation method of   semiconductor device structure

Teng Yi-Chuan

10526199

High efficiency getter design in vacuum   MEMS device

Chen Ting-Jung

10526703

Film formation apparatus for forming   semiconductor structure having shower head with plural hole patterns and with   corresponding different plural hole densities

Huang Chih-Hui

10526719

Magnetic structure for metal plating   control

Tsai Ming-Chin

10527788

Package structure and methods of forming   same

Lai Jui Hsieh

10527791

Semiconductor device and method of   manufacturing

Kuo Ying-Hao

10527926

Pressurized tin collection bucket with   in-line draining mechanism

Yang Chi

10527928

Optical proximity correction methodology   using pattern classification for target placement

Wang Hung-Chun

10527941

Extreme ultraviolet photoresist and method

Liu Chen-Yu

10528693

Layout optimization of a main pattern and a   cut pattern

Chang Shih-Ming

10529414

SRAM cell having SiGe PMOS fin lines

Liaw Jhon Jhy

10529415

Write assist for a memory device and   methods of forming the same

Singh Sahil Preet

10529543

Etch process with rotatable shower head

Lin Yu-Chi

10529552

Method for manufacturing a semiconductor   device and a coating material

Chien Yu-Ling Chang

10529553

Treatment system and method

Kao Wan-Yi

10529572

Semiconductor device and method of   manufacture

Lian Jian-Jou

10529575

Interconnect structure having a   carbon-containing barrier layer

Lin Rueijer

10529578

Method of fabricating semiconductor   structure

Meng Chin-Han

10529593

Semiconductor package comprising molding   compound having extended portion and manufacturing method of semiconductor   package

Wang Po-Han

10529617

Metal routing with flexible space formed   using self-aligned spacer patterning

Liu Hsiang-Wei

10529629

Methods of forming metal gates

Huang Ju-Li

10529637

Integrated circuit package and method of   forming same

Yu Chen-Hua

10529650

Semiconductor package and method

Chen Wei-Yu

10529658

Method for forming a homogeneous bottom   electrode via (BEVA) top surface for memory

Chen Hsia-Wei

10529666

Semiconductor structure and manufacturing   method thereof

Yu Chen-Hua

10529671

Package structure and method for forming   the same

Lee Hsiao-Wen

10529673

Packaged semiconductor devices, methods of   packaging semiconductor devices, and PoP devices

Tsai Po-Hao

10529675

Info structure and method forming same

Wang Po-Han

10529679

3D packages and methods for forming the   same

Hou Shang-Yun

10529690

Package structures and methods of forming   the same

Shih Ying-Ching

10529697

Package structure and method of forming the   same

Cheng Hsi-Kuei

10529698

Semiconductor packages and methods of   forming same

Yu Chen-Hua

10529711

Buried channel semiconductor device and   method for manufacturing the same

Chen Chia-Chung

10529725

Flexible merge scheme for source/drain   epitaxy regions

Lee Kai-Hsuan

10529729

Non-volatile memory device having   nanocrystal floating gate and method of fabricating same

Colinge Jean-Pierre

10529761

Image sensor device and manufacturing   method for improving shutter efficiency

Tsao Tsun-Kai

10529803

Semiconductor device with epitaxial source/drain

Yu Chia-Ta

10529818

Semiconductor device with reduced flicker   noise

Cheng Hsin-Li

10529822

Gate structure having designed profile

Cheng Kai-Li

10529824

Semiconductor device and method for   fabricating the same

Chiou Yao-De

10529833

Integrated circuit with a fin and gate   structure and method making the same

Ching Kuo-Cheng

10529860

Structure and method for FinFET device with   contact over dielectric gate

Chen Fang

10529861

FinFET structures and methods of forming   the same

Lin Yu-Chang

10529862

Semiconductor device and method of forming   semiconductor fin thereof

Liang Chia-Ming

10529863

Flat STI surface for gate oxide uniformity   in Fin FET devices

Wu Cheng-Ta

10529913

Techniques for MRAM MTJ top electrode   connection

Chen Sheng-Chau

10529916

Reversed stack MTJ

Huang Wei-Hang

10530030

Semiconductor device having first and   second transmission lines with a high-K dielectric material disposed between   the first and second transmission lines

Wu Jiun Yi

10530175

Hexagonal semiconductor package structure

Huang Tzu-Sung

10530345

Flip-flop with delineated layout for   reduced footprint

Liu Chi-Lin

10532925

Heater design for MEMS chamber pressure   control

Cheng Shyh-Wei

10533252

Showerhead, semicondcutor processing   apparatus having the same and semiconductor process

Chiu Chih-Chiang

10533852

Leveling sensor, load port including the   same, and method of leveling a load port

Wang Yi-Lin

10533966

Digital time domain readout circuit for   bioFET sensor cascades

Huang Yu-Jie

10534256

Pellicle assembly and method for advanced   lithography

Chen Amo

10534267

Lithography patterning with flexible   solution adjustment

Wang Chung-Cheng

10534272

Method of fabricating reticle

Chung Hsueh-Yi

10534273

Multi-metal fill with self-aligned   patterning and dielectric with voids

Yang Tai-I

10534279

Methods and apparatus for removing   contamination from lithographic tool

Chen Zi-Wen

10534353

System and method to reduce   pre-back-grinding process defects

Lu Chen-Fa

10534386

Low-dropout voltage regulator circuit

Chang Yen-An

10534393

Two-transistor bandgap reference circuit   and FinFET device suited for same

Lin Yvonne

10534892

Layout checking system and method

Hsieh Yao-Jen

10535512

Formation method of semiconductor device   with gate spacer

Tu Guan-Yao

10535520

Fin patterning methods for increased   process margins

Tseng Chin-Yuan

10535523

Formation and in-situ etching processes for   metal layers

Lin Po-Yu

10535524

Tuning threshold voltage through meta   stable plasma treatment

Wu Shao-Jyun

10535525

Method for forming semiconductor device   structure

Lin Chun-An

10535532

Multiple patterning method using mask   portions to etch semiconductor substrate

Fan Cheng-Li

10535537

Packaged semiconductor devices and methods   of packaging semiconductor devices

Chen Hsien-Wei

10535541

Adaptive inset for wafer cassette system

Chen Chia-Yuan

10535555

Contact plugs and methods forming same

Wang Chao-Hsun

10535556

Integrated circuit with conductive line   having line-ends

Ting Chih-Yuan

10535557

Interlayer dielectric film in semiconductor   devices

Wang Tsan-Chun

10535558

Method of forming trenches

Chang Che-Cheng

10535559

Semiconductor interconnect structure having   a graphene barrier layer

Yang Shin-Yi

10535560

Interconnection structure of semiconductor   device

Chu Wei-Chen

10535566

Semiconductor device and method of   manufacture

Chen Hung-Hao

10535568

Method for manufacturing multi-voltage   devices using high-K-metal-gate (HKMG) technology

Tsao Chun-Han

10535569

Forming transistor by selectively growing   gate spacer

Lee Kai-Hsuan

10535572

Device arrangement structure assembly and   test method

Liao Chun Hao

10535573

System and method for test key   characterizing wafer processing state

Wann Clement Hsingjen

10535574

Cell-like floating-gate test structure

Lin Meng-Han

10535580

Thermal dissipation through seal rings in   3DIC structure

Lin Jing-Cheng

10535586

Robust through-silicon-via structure

Lin Yung-Chi

10535591

Semiconductor device and method of   manufacturing the same

Lin Jing-Cheng

10535593

Package structure having a plurality of   conductive balls with narrow width for ball waist

Chang Pi-Lan

10535597

Semiconductor structure and manufacturing   method thereof

Chen Shuo-Mao

10535598

Semiconductor device extension insulation

Yu Hung-Chih

10535602

Reduced area eFuse cell structure

Chang Meng-Sheng

10535603

Method of forming interconnection structure

Chang Che-Cheng

10535609

Package structure and method for forming   the same

Tsai Yi-Da

10535613

Semiconductor structure, integrated circuit   device, and method of forming semiconductor structure

Ma Shih-Hsien

10535614

Package and manufacturing method thereof

Tsai Po-Hao

10535616

Warpage control in package-on-package   structures

Chen Wei-Yu

10535627

Printing module, printing method and system   of forming a printed structure

Lin Jing-Cheng

10535629

Method of manufacturing semiconductor   structure

Kalnitsky Alexander

10535631

3D Chip-on-wager-on-substrate structure   with via last process

Yu Chen-Hua

10535632

Semiconductor package structure and method   of manufacturing the same

Jeng Shin-Puu

10535633

Chip package having die structures of   different heights and method of forming same

Wei Wen-Hsin

10535635

Second semiconductor wafer attached to a   first semiconductor wafer with a through hole connected to an inductor

Chen Chih-Lin

10535636

Integrating passive devices in package   structures

Hu Chih-Chia

10535638

Semiconductor device

Yeh Chao-Yang

10535639

Semiconductor device and manufacturing   method of the same

Lin Jing-Cheng

10535644

Manufacturing method of package on package   structure

Kuo Hsuan-Ting

10535646

Systems and methods for a sequential spacer   scheme

Chang Shih-Ming

10535653

Semiconductor structure

Chen Yi-Jen

10535654

Cut metal gate with slanted sidewalls

Tsai Ya-Yi

10535655

Integrated circuits and manufacturing   methods thereof

Keshavarzi Ali

10535656

Hybrid scheme for improved performance for   P-type and N-type FinFETs

Chiang Kuo-Cheng

10535658

Memory device with reduced-resistance   interconnect

Singh Sahil Preet

10535667

Memory array and semiconductor chip

Liaw Jhon-Jhy

10535668

Using three or more masks to define   contact-line-blocking components in FinFET SRAM fabrication

Huang Shih-Han

10535670

Non-volatile memory having an erase gate   formed between two floating gates with two word lines formed on other sides   and a method for forming the same

Liu Chien-Hsuan

10535671

Cell boundary structure for embedded memory

Liu Ming Chyi

10535675

High voltage CMOS with co-planar upper gate   surfaces for embedded non-volatile memory

Chuang Harry-Hak-Lay

10535676

Inter-digitated capacitor in split-gate   flash technology

Chen Wan-Chen

10535680

Integrated circuit structure and method   with hybrid orientation for FinFET

Shen Tzer-Min

10535686

Semiconductor device and method of forming   the same

Liang Victor Chiang

10535694

Support structure for integrated circuitry

Chien Volume

10535696

Pad structure exposed in an opening through   multiple dielectric layers in BSI image sensor chips

Lin Jeng-Shyan

10535697

Structure and method for 3D Image sensor

Kao Min-Feng

10535698

Image sensor with pad structure

Cheng Yun-Wei

10535706

Interconnect structure for stacked device   and method

Chuang Chun-Chieh

10535727

Etching process control in forming MIM   capacitor

Chen Hung-Hao

10535730

High voltage metal-oxide-semiconductor   (HVMOS) device integrated with a high voltage junction termination (HVJT)   device

Murukesan Karthick

10535732

Strained nanowire CMOS device and method of   forming

Peng Cheng-Yi

10535736

Fully strained channel

More Shahaji B.

10535737

Semiconductor device and manufacturing   method thereof

Lu Fang-Liang

10535738

Semiconductor structure and manufacturing   method of the same

Hsiao Meng-Hsuan

10535746

Metal gate structure and methods thereof

Lee Tzung-Chi

10535748

Method of forming a contact with a silicide   region

Cheng Yu-Wen

10535751

Selective silicon growth for gapfill   improvement

Yu De-Wei

10535752

Method and related apparatus for reducing   gate-induced drain leakage in semiconductor devices

Thei Kong-Beng

10535757

Structure of a fin field effect transistor   (FinFET)

Lee Wei-Yang

10535758

Gate structure of field effect transistor   with footing

Chang Che-Cheng

10535768

Semiconductor structure

Tsai Chun-Hsiung

10535775

Silicon on insulator semiconductor device   with mixed doped regions

Liu Jack

10535780

Semiconductor device including an epitaxial   layer wrapping around the nanowires

Van Dal Mark

10535814

Techniques for MRAM MTJ top electrode   connection

Chuang Harry-Hak-Lay

10535815

Method of forming a bottom electrode of a   magnetoresistive random access memory cell

Huang Wei-Chieh

10535816

Via structure, MRAM device using the via   structure and method for fabricating the MRAM device

Wu Jung-Tang

10535913

Package structure, electronic device and   method of fabricating package structure

Hsiao Min-Chien

10536146

Edge detector circuit and method

Huang Tsung-Ching (Jim)

10536799

Intelligent geo-fencing with tracked and   fenced objects

Chow Jerry

10539617

Scan architecture for interconnect testing   in 3D integrated circuits

Goel Sandeep Kumar

10539751

Optical bench on substrate

Lee Wan-Yu

10539878

Lithography patterning technique

Chang Lilin

10540462

Method and apparatus for speeding up   gate-level simulation

Yu Chih-Yuan Stephen

10540473

Stacked chip layout and method of making   the same

Hsu Ying-Yu

10540475

System for manufacturing a semiconductor   device

Chang Chi-Wen

10541007

Memory device with strap cells

Chang Jonathan Tsung-Yung

10541132

Forming semiconductor structures with   two-dimensional materials

Lin Shih-Yen

10541139

Planarization control in semiconductor   manufacturing process

Nien Po-Chin

10541154

Thermally conductive structure for heat   dissipation in semiconductor packages

Tseng Chun-Hao

10541164

3D IC bump height metrology APC

Cheng Nai-Han

10541175

Structure and formation method of   semiconductor device with fin structures

Cheng Chung-Liang

10541185

Semiconductor devices with bump allocation

Kuo Yung-Hsin

10541204

Interconnection structure and method of   forming the same

Chang Che-Cheng

10541213

Backside redistribution layer (RDL)   structure

Tsai Po-Hao

10541218

Redistribution layer structure and   fabrication method therefor

Cheng Anhao

10541226

Package structure and method of forming the   same

Yu Chen-Hua

10541227

System on integrated chips and methods of   forming same

Yeh Sung-Feng

10541228

Packages formed using RDL-last process

Chen Ming-Fa

10541245

Semiconductor device and manufacturing   method thereof

Yang ShihKuang

10541269

Magnetic random access memory and   manufacturing method thereof

Ying Ji-Feng

10541297

Semiconductor structure having integrated   inductor therein

Lee Ming-Che

10541298

Etching process control in forming MIM   capacitor

Chen Hung-Hao

10541303

Nanowire FinFET Transistor

Afzalian Aryan

10541317

Method of forming a metal gate using   monolayers

Huang Ju-Li

10541319

Fin structures having varied fin heights   for semiconductor device

Ching Kuo-Cheng

10541361

Magnetic random access memory and   manufacturing method thereof

Yu Chwen

10541365

Phase change memory and method of   fabricating same

Lin Yu Chao

10541606

Serial-parallel switch negative charge pump

Chang Yen-An

10541627

MEMS structure and method of forming same

Tsai Yi Heng

10541685

Multiplexing latch circuit and method

Hong Hyunsung

10541718

Clock and data recovery circuit

Lan Po-Hsiang

10545894

Information processor with tightly coupled   smart memory unit

Chi Shyh-An

10546528

Pixel circuit and method of adjusting   brightness of pixel circuit

Huang Tsung-Ching

10546638

Resistive random access memory device

Lee Chia-Fu

10546754

Semiconductor structure and manufacturing   method thereof

Chang Che-Cheng

10546755

Semiconductor device and a method for   fabricating the same

Lee Chen-Ming

10546757

Device and method for controlling intro-die   variation

Hung Cheng-Hsiung

10546784

Semiconductor device having merged   epitaxial features with arc-like bottom surface and method of making the same

Lee Yi-Jing

10546786

Method of fabricating a FinFET device

Yin Joanna Chaw Yane

10546830

Chip package structure

Jeng Shin-Puu

10546838

Integrated circuit package assembly

Chen Hsien-Wei

10546845

Package on package structure

Shen Dong-Han

10546850

FinFET-based ESD devices and methods for   forming the same

Lin Wun-Jie

10546864

Two-port SRAM structure

Liaw Jhon Jhy

10546889

Method of high-aspect ratio pattern   formation with submicron pixel pitch

Chiu Wei-Chao

10546890

Protection ring for image sensors

Tsai Tsung-Han

10546917

Trench capacitor layout structure and   method of forming same background

Tsai Yu-Hsiang

10546937

Structures and methods for noise isolation   in semiconductor devices

Singh Gulbagh

10546956

Fin field effect transistor (FinFET) device   and method for forming the same

Zhang Zhe-Hao

10546964

Molybdenum selenide sublayers with   controlled thickness in solar cells and methods for forming the same

Chen Shih-Wei

10546996

Magnetoresistive random access memory   (MRAM) structure and method of forming the same

Mo Chun-Chieh

10552568

Method of modifying cell and global   connection routing method

Chen Sheng-Hsiung

10553265

Memory circuit having tracking circuit   including series-connected transistors

Hsu Kuoyuan (Peter)

10553275

Device having write assist circuit   including memory-adapted transistors and method for making the same

Lin Yangsyu

10553288

Dynamic reference current sensing using   multiple reference cells

Yang Tien-Chun

10553300

Method of detecting address decoding error   and address decoder error detection system

Fujiwara Hidehiro

10553411

Ion collector for use in plasma systems

Chen Otto

10553428

Reflection mode photomask and fabrication   method therefore

Chen Chun-Lang

10553431

Cut last self-aligned litho-etch patterning

Huang Kuan-Wei

10553474

Method for forming a   semiconductor-on-insulator (SOI) substrate

Wu Cheng-Ta

10553476

Semiconductor device including polysilicon   structures having differing grain sizes and including a barrier layer   therebetween

Lee J. J.

10553479

Semiconductor device with contact pad and   fabrication method therefore

Yen Chun-Hsu

10553481

Vias for cobalt-based interconnects and   methods of fabrication thereof

Chang Yu-Jen

10553489

Partitioned wafer and semiconductor die

Huang Wei-Hsiang

10553492

Selective NFET/PFET recess of source/drain   regions

Chang Yun-Min

10553494

Breakdown resistant semiconductor apparatus   and method of making same

Wang Jhong-Sheng

10553533

Integrated fan-out package and   manufacturing method thereof

Lu Chun-Lin

10553561

Mechanisms of forming connectors for   package on package

Chen Yu-Feng

10553569

Multi-die structure and method for forming   same

Yu Chen-Hua

10553575

Semiconductor device having engineering   change order (ECO) cells and method of using

Tien Li-Chun

10553580

Method of manufacturing semiconductor   device

Chuang Harry Hak-Lay

10553583

Boundary region for high-k-metal-gate(HKMG)   integration technology

Chen Yi-Huan

10553597

Memory cell including a plurality of wells

Chen Shih-Hsien

10553628

Image sensor with a high absorption layer

Huang Chien-Chang

10553631

Color filter uniformity for image sensor   devices

Chu Yi-Hsing

10553672

Metal insulator metal capacitor

Huang Yan-Jhih

10553687

Semiconductor device having conductive   feature overlapping an edge of an active region

Chen Po-Yu

10553699

Gate structure of a semiconductor device

Zhu Ming

10553706

Method for manufacturing semiconductor fin   structure with extending gate structure

Chang Che-Cheng

10553718

Semiconductor devices with core-shell   structures

Diaz Carlos H.

10553720

Method of removing an etch mask

Chu Chun-Han

10553721

Semiconductor device and method of forming   the same

Jou Chewn-Pu

10553733

QE approach by double-side, multi   absorption structure

Huang Po-Han

10553785

Magnetoresistive random access memory   device and method of making same

Hsu Chern-Yow

10554186

Analog-to-digital converters and methods

Kinyua Martin

10554190

Transmitter circuit with power detection

Chu Hong-Lin

10554255

Communication system and method of data   communications

Kuo Feng Wei

10555424

Circuit board, semiconductor device   including the same, and manufacturing method thereof

Wu Jiun-Yi

10556790

Method for forming multi-depth MEMS package

Tai Wen-Chuan

10556792

Wafer level integrated MEMS device enabled   by silicon pillar and smart cap

Lee Yi-Chia

10558120

System and method for supplying and   dispensing bubble-free photolithography chemical solutions

Zhou Wen-Zhan

10558525

Method of correcting errors in a memory   array and a system for implementing the same

Chih Yu-Der

10559333

Memory macro and method of operating the   same

Su Chien-Kuo

10559453

Techniques for detecting micro-arcing   occurring inside a semiconductor processing chamber

Wu Feng-Kuang

10559492

Patterning methods for semiconductor   devices and structures resulting therefrom

Peng Tai-Yen

10559517

Heat transfer structures and methods for IC   packages

Hsu Ying-Chih

10559546

Package on package structure and method for   forming the same

Yu Chen-Hua

10559558

Pin modification for standard cells

Chang Fong-yuan

10559563

Method for manufacturing monolithic   three-dimensional (3D) integrated circuits

Colinge Jean-Pierre

10562763

Fence structure to prevent stiction in a   MEMS motion sensor

Tseng Lee-Chuan

10564632

Systems and methods for sensory automated   material handing

Hsu Yung-Lin

10565341

Constrained cell placement

Lin Yen-Hung

10565345

Semiconductor device having engineering   change order (ECO) cells

Tien Li-Chun

10565348

System for and method of fabricating an   integrated circuit

Lin Wei-Cheng

10566173

Nano vacuum tube

Chang Hsien-Yu

10566232

Post-etch treatment of an electrically   conductive feature

Shen Bo-Jhih

10566237

Profile of through via protrusion in 3DIC   interconnect

Wu Jiung

10566242

Minimization of plasma doping induced fin   height loss

Chan Chia-Ling

10566261

Integrated fan-out packages with embedded   heat dissipation structure

Pei Hao-Jan

10566278

Method for layout design and structure with   inter-layer vias

Chuang Yi-Lin

10566288

Structure for standard logic performance   improvement having a back-side through-substrate-via

Kao Min-Feng

10566361

Wide channel gate structure and method of   forming

Wei Chia-Yu

10566374

Via support structure under pad areas for   BSI bondability improvement

Huang Sin-Yao

10566378

Back side illuminated image sensor with   reduced sidewall-induced leakage

Tsai Shuang-Ji

10566387

Interconnect landing method for RRAM   technology

Chen Hsia-Wei

10566519

Method for forming a flat bottom electrode   via (BEVA) top surface for memory

Chen Hsia-Wei

10569520

Wafer debonding system and method

Tsao Chang-Chen

10573519

Method for performing a photolithography   process

Ko Tsung-Han

10573573

Package and package-on-package structure   having elliptical conductive columns

Chiu Sheng-Huan

10573749

Fin-type field effect transistor structure   and manufacturing method thereof

Tsai Chun Hsiung

10573751

Structure and method for providing line end   extensions for fin-type active regions

Yu Shao-Ming

10573811

Resistive random-access memory (RRAM) cell   with recessed bottom electrode sidewalls

Tseng Yuan-Tai

10574213

Clock circuit and method of operating the   same

Yang Hao-I

10576606

Platen rotation system and method

Cho Bruce

10580693

Contact conductive feature formation and   structure

Chang Ken-Yu

10586705

Fluorine doped non-volatile memory cells   and methods for forming the same

Chen Hung-Lin

10586724

Fan-out interconnect structure and methods   forming the same

Hu Yu-Hsiang

10586763

Semiconductor device and method of   manufacture

Tsou Hsien-Ju

10593775

Semiconductor device and manufacturing   method thereof

Yeo Yee-Chia

10599517

Memory device

Liu Chien-Yin

10599796

Metastable flip-flop based true random   number generator (TRNG) structure and compiler for same

Zhou Charlie

10600709

Bump-on-trace packaging structure and   method for forming the same

Chen Meng-Tse

10605855

Method, test line and system for detecting   semiconductor wafer defects

Wang Jing-Sen

10607941

Method of forming semiconductor device

Wang Jhih-Yu

10608094

Semiconductor device and method of forming   the same

Tsai Fu-Tsun

10609463

Integrated microphone device and   manufacturing method thereof

Cheng Chun-Wen

10613444

Semiconductor apparatus and method of   operating the same

Liao Chi-Hung

10614878

High speed SRAM device with cross coupled   bit line charging circuit and voltage

Yu Hua-Hsin

10614948

Method for forming inductor structure with   magnetic material

Tseng Yuan-Tai

10615028

Method for fabricating oxides/semiconductor   interfaces

Vellianitis Georgios

10615036

Charged-particle-beam patterning without   resist

Tsai Kuen-Yu

10615820

Systems and methods for digital excess loop   delay compensation in a continuous time delta sigma modulator

Lien Bei-Shing

10618085

Apparatus and methods for exhaust cleaning

Cheng Wei Chang

10618534

Monitor vehicle for a rail system and   method thereof

Chien Shih-Hung

10618801

MEMS structure with bilayer stopper and   method for forming the same

Tai Wen-Chuan

10618804

Manufacturing method of semiconductor   structure including heater

Cheng Chun-Wen

10620530

Multiple-mask multiple-exposure lithography   and masks

Yu Peter

10622035

Sense amplifier, sensing method and   non-volatile memory using the same

Yu Hung-Chang

10622039

Dual rail memory with bist circuitry,   memory macro and associated hybrid power supply method

Cheng Chiting

10622047

Free layer structure in magnetic random   access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA)   enhancing layer

Fukuzawa Hideaki

10622211

Metal-compound-removing solvent and method   in lithography

Zi An-Ren

10622222

Integrated fan-out package having   multi-band antenna and method of forming the same

Chuang Nan-Chin

10622236

Apparatus and method for handling wafer   carrier doors

Kuo Tsung-Sheng

10622240

Package on-package structure

Lin Chih-Wei

10622261

FinFET devices with unique shape and the   fabrication thereof

Lee Yi-Jing

10622278

Semiconductor structure and associated   method for manufacturing the same

Chen Chin-Liang

10622297

Semiconductor device and method

Lin Jing-Cheng

10622300

Series MIM structures

Tu Kuo-Chi

10622302

Via for semiconductor device connection and   methods of forming the same

Yu Chen-Hua

10622306

Interconnect structure in semiconductor   devices

Liaw Jhon Jhy

10622321

Semiconductor structures and methods of   forming the same

Yu Chen-Hua

10622327

Method for manufacturing semiconductor   structure

Yu Chen-Hua

10622336

Manufacturing method of semiconductor   package

Hsu Feng-Cheng

10622342

Stacked LED structure and associated   manufacturing method

Liu Ping-Yin

10622351

Semiconductor device and manufacturing   method thereof

Liang Victor Chiang

10622353

Semiconductor device

Chang Che-Cheng

10622356

Semiconductor device and method of   manufacturing the same

Chang Chia-Yuan

10622394

Image sensing device

Wu Wei-Chuang

10622401

Semiconductor structure, back-side   illuminated image sensor and method for manufacturing the same

Chen Sheng-Chau

10622453

Vertical MOS transistor

Yang Tai-I

10622464

Integrated circuit structure with substrate   isolation and un-doped channel

Ching Kuo-Cheng

10622471

Manufacturing method of semiconductor   structure

Liu Sheng-De

10622480

Forming gate stacks of FinFETs through   oxidation

Chiang Kuo-Cheng

10622551

Manufacturing techniques and devices for   magnetic tunnel junction devices

Tien Hsi-Wen

10622555

Film scheme to improve peeling in   chalcogenide based PCRAM

Trinh Hai-Dang

10622701

Antenna apparatus and method

Chih Lai Wei

10622963

On-chip diplexer

Tsai Ming-Hsien

10623928

Terminal node, method, storage medium for   video data transmission

Xu Haibo

10624196

Laser source device and extreme ultraviolet   lithography device

Tong Henry Yee-Shian

10626010

Bonding process for forming semiconductor   device structure

Chang Chih-Hang

10626499

Deposition device structure

Lo Yen-Chan

10627718

Developing method

Chen Yi-Rem

10627727

Lens control for lithography tools

Yang Yueh Lin

10627728

Method for creating vacuum in load lock   chamber

Chang Tung-Jung

10629476

Packages with through-vias having tapered   ends

Chen Hsien-Wei

10629477

Raised via for terminal connections on   different planes

Yu Chen-Hua

10629479

Structure and method for interconnection

Lu Chih Wei

10629480

Method for forming semiconductor device   structure

Chen Xi-Zong

10629481

Method for forming interconnect structure

Tien Bor-Zen

10629490

Fin-type field-effect transistor device and   method of fabricating the same

Chen Chun-Hung

10629491

Semiconductor manufacturing method

Chang Che-Cheng

10629492

Gate structure having a dielectric gate and   methods thereof

Lin Ta-Chun

10629494

Semiconductor device and method

Chan Chia-Ling

10629496

Methods for forming transistor gates with   hafnium oxide layers and lanthanum oxide layers

More Shahaji B.

10629497

FinFET device structure and method for   enlarging gap-fill window

Chung Han-Pin

10629501

Gate all-around semiconductor device   including a first nanowire structure and a second nanowire structure

Doornbos Gerben

10629508

Packaged semiconductor devices and methods   of packaging semiconductor devices

Yu Chen-Hua

10629509

Redistribution circuit structures and   methods of forming the same

Tu Shang-Yun

10629510

Package with embedded heat dissipation   features

Hung Wensen

10629527

Method of manufacturing semiconductor   device with multi wire structure

Liu Kuo-Yen

10629528

Device-manufacturing scheme for increasing   the density of metal patterns in inter-layer dielectrics

Ma Wei Yu

10629534

Interconnection structure having air gap

Lin Hsiang-Wei

10629537

Conductive vias in semiconductor packages   and methods of forming same

Hsieh Cheng-Hsien

10629539

Package structure and method of fabricating   the same

Liang Fang-Yu

10629540

Semiconductor device and method

Yu Chen-Hua

10629541

Semiconductor structure and manufacturing   method thereof

Yu Chen-Hua

10629545

Semiconductor device

Huang Kuan-Yu

10629555

Packaging devices and methods of   manufacture thereof

Chen Hsien-Wei

10629560

Semiconductor structure

Chen Jie

10629568

Stacked integrated circuits with   redistribution lines

Ho Cheng-Ying

10629579

Package-on-package with cavity in   interposer

Wu Jiun Yi

10629580

Packaging mechanisms for dies with   different sizes of connectors

Chen Chih-Hua

10629588

ESD hard backend structures in nanometer   dimension

Tseng Jen-Chou

10629592

Through silicon via design for stacking   integrated circuits

Thei Kong-Beng

10629593

Formation of semiconductor device with   resistors having different resistances

Chen Yu-Jen

10629596

Fin-type field effect transistor structure   and manufacturing method thereof

Tsai Chun Hsiung

10629603

Conductive layers with different   thicknesses

Liaw Jhon Jhy

10629605

Semiconductor device and method of   manufacturing

Lin Josh

10629672

Capacitor structure with low capacitance

Chen Tai-Yi

10629673

Method for manufacturing semiconductor and   structure thereof

Chen Yang-Che

10629679

Method of manufacturing a semiconductor   device and a semiconductor device

Yang Yu-Lin

10629684

Fin-based strap cell structure

Liaw Jhon Jhy

10629693

Semiconductor structure with barrier layer   and method for forming the same

Huang Shih-Wen

10629700

High-K metal gate process and device

Liao Chien-Shun

10629706

Fin and gate dimensions for optimizing gate   formation

Liaw Jhon Jhy

10629708

Semiconductor device structure with barrier   layer and method for forming the same

Wu Chia-Yang

10629735

Reacted conductive gate electrodes and   methods of making the same

Currie Matthew T.

10629736

Semiconductor structure and method for   semiconductor device fabrication with improved source drain epitaxy

Lee Wei-Yang

10629737

Method for fabricating FinFET including   forming an oxide layer

Wang Chih-Hao

10629749

Method of treating interfacial layer on   silicon germanium

Chang Chih-Yu

10629756

Semiconductor structure

Yen Hsiao-Tsung

10629765

Single photon avalanche diode

Wei Chia-Yu

10629811

Resistance variable memory structure and   method of forming the same

Sung Fu-Ting

10631392

EUV collector contamination prevention

Wu Ming-Fa

10634717

Testing apparatus and testing method

Chiu Tang-Jung

10634972

Configurable heating device and method of   using the same

Lee Hui-Yu

10636458

Sense amplifier layout for FinFET   technology

Chen Yen-Huei

10636511

Memory repair scheme

Shih Yi-Chun

10636560

Induction based current sensing

Roth Alan

10636651

Semiconductor device and method

Fan Sheng-Ting

10636652

Method of forming a semiconductor device   using layered etching and repairing of damaged portions

Lin Shih-Yen

10636661

Apparatus and method for wafer bonding

Lin Yeong-Jyh

10636664

Wrap-around contact plug and method   manufacturing same

Wang Sung-Li

10636667

Method for manufacturing semiconductor   devices and structures thereof

Lin Jiann-Horng

10636670

Method of planarizing semiconductor device

Tsai Yi-Jen

10636673

Method for forming semiconductor device   structure

Wei Yu-Chen

10636688

Method for alignment, process tool and   method for wafer-level alignment

Wang Ching-Hung

10636695

Negatively sloped isolation structures

Singh Gulbagh

10636697

Contact formation method and related   structure

Wang Chao-Hsun

10636701

Methods of forming semiconductor devices   using multiple planarization processes

Hsu Chun-Wei

10636702

Conductive interconnect structures in   integrated circuits

Wu Jung-Tang

10636713

Semiconductor packages and manufacturing   methods thereof

Chiang Yung-Ping

10636715

Semiconductor package and method of   fabricating the same

Lin Chun-Cheng

10636747

Semiconductor package structure

Hung Jui-Pin

10636748

Package structure

Yu Chen-Hua

10636757

Integrated circuit component package and   method of fabricating the same

Yang Ching-Jung

10636775

Package structure and manufacturing method   thereof

Chen Wei-Yu

10636782

Systems and methods for protecting a   semiconductor device

Chou Kuo-Yu

10636787

Semiconductor structure and manufacturing   method thereof

Chang Che-Cheng

10636788

Semiconductor device and manufacturing   method thereof

Cheng Tung-Wen

10636824

High dielectric constant dielectric layer   forming method, image sensor device, and manufacturing method thereof

Tsai Tsung-Han

10636870

Isolation regions for reduced junction   leakage

Singh Gulbagh

10636878

Steep sloped vertical tunnel field-effect   transistor

Ramvall Peter

10636891

Method of manufacturing a semiconductor   device and a semiconductor device

Yang Yu-Lin

10636904

Methodology and structure for field plate   design

Chou Hsueh-Liang

10636908

Method of removing an etch mask

Chu Chun-Han

10636909

Formation method of semiconductor device   with source/drain structures

More Shahaji B.

10636910

Semiconductor device structure and method   of forming the same

Ching Kuo-Cheng

10636930

SPAD image sensor and associated   fabricating method

Yamashita Yuichiro

10636961

Semiconductor structure and method of   forming the same

Chuang Harry-Hak-Lay

10636963

Magnetic tunnel junctions

Dai Pin-Ren

10636965

Resistive random access memory device

Hung Tsai-Hao

10637351

Regulated voltage systems and methods using   intrinsically varied process characteristics

Tai Chia Liang

10637463

Voltage level shifting circuits and methods

Wang Wen-Han

10638078

Counter, counting method and apparatus for   image sensing

Yeh Shang-Fu

10638543

Photonic heater

Lee Hui Yu

10638616

Circuit carrier and manifacturing method   thereof

Wu Jiun-Yi

10640366

Bypass structure

Hsieh Eason

10641819

Alignment testing for tiered semiconductor   structure

Wang Mill-Jer

10641958

Methods of forming photonic devices

Liu Tao-Cheng

10642148

High durability extreme ultraviolet   photomask

Yu Chia-Hao

10642158

Method of controlling reticle masking blade   positioning to minimize impact on critical dimension uniformity and device   for controlling reticle masking blade positioning

Cho Hung-Wen

10642165

Automated mask storage and retrieval system

Huang Chun-Jung

10642227

Digital-to-time converter, time-to-digital   converter, and converting method using the same

Lin Yu-Tso

10642255

Component control in semiconductor   performance processing with stable product offsets

Nan Ching-Hsi

10642949

Cell placement site optimization

Lin Yen-Hung

10643017

Rule checking for multiple patterning   technology

Hsu Meng-Kai

10643688

Static random access memory (SRAM) tracking   cells and methods of forming the same

Liaw Jhon Jhy

10643722

Memory device

Chih Yu-Der

10643726

Memory device with a fuse protection   circuit

Chih Yu-Der

10643836

Bonded semiconductor structures

Lin Jing-Cheng

10643853

Wafer thinning apparatus having feedback   control and method of using

Chen Yuan-Hsuan

10643861

Methods for making multi-die package with   bridge layer

Chang Wei Sen

10643864

Fan-out structure and method of fabricating   the same

Yu Chen-Hua

10643892

Metal loss prevention using implantation

Wu Li-Chieh

10643902

Semiconductor device and method for atomic   layer deposition of a dielectric over a substrate

Huang Yen-Chun

10643916

Conductive line system and process

Huang Yu Yi

10643943

Package structure, package-on-package   structure and manufacturing method thereof

Wang Chuei-Tang

10643947

Semiconductor structure and manufacturing   method thereof

Chang Che-Cheng

10643951

Mini identification mark in die-less region   of semiconductor wafer

Peng Yue-Lin

10643964

Structures for bonding a group III-V device   to a substrate by stacked conductive bumps

Chen Jhih-Bin

10643965

Structure and method of forming a joint   assembly

Chen Ying-Ju

10643986

Power gating for three dimensional   integrated circuits (3DIC)

Chao Chien-Ju

10643988

Intelligent diode structures

Chang Yi-Feng

10644000

Semiconductor device having deep wells

Lin Meng-Han

10644013

Cell boundary structure for embedded memory

Lin Meng-Han

10644060

Image sensor with high quantum efficiency   surface structure

Cheng Yun-Wei

10644116

In-situ straining epitaxial process

Chen Hsiu-Ting

10644125

Metal gates and manufacturing methods   thereof

Lu Jen-Hsiang

10644130

Metal-oxide-semiconductor field-effect   transistor with spacer over gate

Yang Chung-Yuan

10644134

Gate formation with varying work function   layers

Chen Jin-Dah

10644153

Semiconductor device and method for   fabricating the same

Wei Cheng-Chang

10644154

Semiconductor device and manufacturing   method thereof

Ching Kuo-Cheng

10644168

2-D material transistor with vertical   structure

Colinge Jean-Pierre

10644229

Magnetoresistive random access memory cell   and fabricating the same

Hsu Chern-Yow

10644231

Memory device and fabrication method   thereof

Peng Tai-Yen

10644601

Dead-time conduction loss reduction for   buck power converters

Pao Chia-Cheng

10644662

Tunable gain amplifier

Yang Shu-Chun

10644865

Read-write data translation technique of   asynchronous clock domains

Yang Shu-Chun

10644869

Automatic detection of change in PLL   locking trend

Tsai Tsung-Hsien

10648069

Monolayer-by-monolayer growth of MgO layers   using Mg sublimation and oxidation

Patel Sahil

10648927

Method and apparatus for monitoring edge   bevel removal area in semiconductor apparatus and electroplating system

Wu Chao-Tung

10649336

Method and system for fabricating   semiconductor device

Yu Jun-Yih

10649339

Resist material and method for forming   semiconductor structure using resist layer

Chang Ya-Ching

10649476

Flipped gate current reference and method   of using

Al-Shyoukh Mohammad

10649482

Bandgap reference circuit, control circuit,   and associated control method

Cheng Nai Chen

10650882

Static random access memory with a   supplementary driver circuit and method of controlling the same

Lin Chih-Yu

10651003

Ion implanting method

Tsai Ming-Ying

10651030

Cut metal gate process for reducing   transistor spacing

Wen Ming-Chang

10651041

Semiconductor structure and manufacturing   method thereof

Hsiao Ru-Shang

10651047

Double patterning method

Lee Chia-Ying

10651053

Embedded metal insulator metal structure

Liao Wen-Shiang

10651055

Post-passivation interconnect structure and   method of forming the same

Lin Hung-Jen

10651066

Metrology method in wafer transportation

Huang Powen

10651075

Wafer table with dynamic support pins

Liao Chi-Hung

10651085

Semiconductor device and method for   manufacturing the same

Chang Chia-Hao

10651091

Wrap-around contact on FinFET

Wang Sung-Li

10651111

Method of forming conductive bumps for   cooling device connection

Chou You-Hua

10651114

Apparatus and method of three dimensional   conductive lines

Lin Chih-Yu

10651131

Supporting InFO packages to reduce warpage

Chen Jie

10651137

Manufacturing method of a package structure

Yu Chen-Hua

10651142

Micro-connection structure and   manufacturing method thereof

Lu Wen-Hsiung

10651149

Packages formed using RDL—last   process

Chen Ming-Fa

10651170

Isolated wells for resistor devices

Tung Yu-Lung

10651171

Integrated circuit with a gate structure   and method making the same

Ching Kuo-Cheng

10651178

Compact electrical connection that can be   used to form an SRAM cell and method of making the same

Lin Yu-Kuan

10651217

Structure and formation method of light   sensing device

Cheng Yun-Wei

10651220

Narrow band filter with high transmission

Huang Cheng Yu

10651225

Band-pass filter for stacked sensor

Huang Cheng Yu

10651237

Resistive random access memory device

Mo Chun-Chieh

10651279

Semiconductor interconnect structure having   graphene-capped metal interconnects

Yang Shin-Yi

10651283

Metal gate structure

Lim Peng-Soon

10651287

Method for forming source/drain contacts

More Shahaji B.

10651289

Semiconductor device and a method for   fabricating the same

Chiou Yao-De

10651292

Dual metal via for contact resistance   reduction

Cheng Chung-Liang

10651296

Methods of fabricating Fin Field Effect   Transistor (FinFET) devices with uniform tension using implantations on top   and sidewall of Fin

Wu Tsung-Han

10651300

Charge storage and sensing devices and   methods

Hwu Jenn-Gwo

10651309

V-shape recess profile for embedded   source/drain epitaxy

Li Chii-Horng

10651311

Metal gate with silicon sidewall spacers

Fang Wen-Han

10651314

Nanowire stack GAA device with inner spacer   and methods for producing the same

Chen I-Sheng

10651373

Memory device and fabrication method   thereof

Peng Tai-Yen

10651675

Packaged semiconductor devices with   wireless charging means

Yu Chen-Hua

10651832

Level shifter

Chen Chien-Yuan

10652032

Device signature generation

Lu Shih-Lien Linus

10652987

Three dimensional integrated circuit   electrostatic discharge protection and prevention test interface

Wang Mill-Jer

10654707

Method of stiction prevention by patterned   anti-stiction layer

Chang Kuei-Sung

10654713

Method for manufacturing   microelectromechanical system structure having a cavity and through-holes of   different widths

Meng Chin-Han

10655019

Priming material for substrate coating

Cheng Ya-Ling

10656351

Package structure for optical fiber and   method for forming the same

Huang Sung-Hui

10656539

Radiation source for lithography process

Wu Shang-Ying

10657106

Method, computing device, and distributed   file system for placement of file blocks within a distributed file system

Xu Haibo

10658010

Apparatus for high speed ROM cells

Liaw Jhon-Jhy

10658011

Voltage generating system, voltage   generating circuit and associated method

Chang Yen-An

10658026

Word line pulse width control circuit in   static random access memory

Singh Anjana

10658179

Method and structure of middle layer   removal

Chen Nai-Chia

10658184

Pattern fidelity enhancement with   directional patterning technology

Shen Yu-Tien

10658186

Method of forming semiconductor device   using titanium-containing layer and device formed

Wu Chia-Yang

10658191

Conformal middle layer for a lithography   process

Liu Chen-Yu

10658195

Metal oxide layered structure and methods   of forming the same

Lin Jing-Cheng

10658199

Semiconductor device and method

Liao Sih-Hao

10658208

Polyimide composition for package   structure, package structure and method of fabricating the same

Liao Sih-Hao

10658215

Reticle transportation container

Lee Yu-Ching

10658221

Semiconductor wafer cleaning apparatus and   method for cleaning semiconductor wafer

Lin Wang-Hua

10658225

FinFET devices and methods of forming the   same

Lin Jih-Jse

10658234

Formation method of interconnection   structure of semiconductor device

Hung Min-Hsiu

10658237

Semiconductor devices

Su Fu-Hsiang

10658242

Structure and formation method of   semiconductor device with Fin structures

Keng Wen-Chun

10658245

Etch profile control of polysilicon   structures of semiconductor devices

Ching Kuo-Cheng

10658247

FinFET devices and methods of forming

Chiang Kuo-Cheng

10658252

Semiconductor structure and method for   forming the same

Lin Jia-Ming

10658258

Chip package and method of forming the same

Pan Kuo-Lung

10658263

Semiconductor package and manufacturing   method thereof

Yu Chi-Yang

10658270

Semiconductor structure and method making   the same

Lin Hsiang-Wei

10658287

Semiconductor device having a tapered   protruding pillar portion

Liao Sih-Hao

10658290

Plurality of different size metal layers   for a pad structure

Chen Hsien-Wei

10658292

Metal patterning for internal cell routing

Peng Shih-Wei

10658296

Dielectric film for semiconductor   fabrication

Wu Cheng-Yi

10658315

Redistribution layer metallic structure and   method

Bih Shih Wei

10658318

Film scheme for bumping

Chang Yao-Wen

10658323

Package structure with warpage-control   element

Pei Hao-Jan

10658333

Package structure and method of fabricating   the same

Chen Hsien-Wei

10658334

Method for forming a package structure   including a package layer surrounding first connectors beside an integrated   circuit die and second connectors below the integrated circuit die

Cheng Yu-Jen

10658337

Packages and packaging methods for   semiconductor devices, and packaged semiconductor devices

Yu Chen-Hua

10658339

Semiconductor device and method of   manufacture

Chen Hsien-Wei

10658347

Semiconductor packages and methods of   forming the same

Yu Chen-Hua

10658348

Semiconductor devices having a plurality of   first and second conductive strips

Tai Chih-Hsuan

10658362

Semiconductor component and fabricating   method thereof

Ching Kuo-Cheng

10658370

Semiconductor device and manufacturing   method thereof

Ohtou Tetsu

10658372

Cutting metal gates in fin field effect   transistors

Yin Li-Wei

10658373

Method for manufacturing semiconductor   device with metal gate memory device and metal gate logic device

Chuang Harry-Hak-Lay

10658410

Image sensor having improved full well   capacity and related method of formation

Cheng Yu-Hung

10658455

Metal insulator metal capacitor structure   having high capacitance

Hsu Chen-Yin

10658456

Semiconductor device having diode devices   with different barrier heights and manufacturing method thereof

Lo Wen-Shun

10658468

Epitaxial growth methods and structures   thereof

Ueno Tetsuji

10658470

Device with doped phosphorene and method   for doping phosphorene

Lin Yu-Ming

10658474

Method for forming thin   semiconductor-on-insulator (SOI) substrates

Wu Cheng-Ta

10658477

Junction gate field-effect transistor   (JFET) having source/drain and gate isolation regions

Chen Chia-Chung

10658478

Semiconductor device

Huang Chi-Feng

10658479

Flash memory cell structure with   step-shaped floating gate

Chu Yu-Hsien

10658482

Plate design to decrease noise in   semiconductor devices

Cheng Chih-Chang

10658485

Semiconductor device and manufacturing   method thereof

Lin Chih-Han

10658488

Atomic layer deposition methods and   structures thereof

Lee Hsin-Yi

10658490

Structure and formation method of isolation   feature of semiconductor device structure

Ching Kuo-Cheng

10658491

Controlling profiles of replacement gates

Lin Chih-Han

10658492

Polysilicon design for replacement gate   technology

Chuang Harry-Hak-Lay

10658508

Structure and formation method of   semiconductor device with low resistance contact

Chen Chia-Cheng

10658509

FinFET device

Lin Chia Tai

10658510

Source/drain structure

Liu Su-Hao

10658571

Semiconductor structure and method for   manufacturing the same

Hsu Chern-Yow

10658577

Maintaining coercive field after high   temperature anneal for magnetic device applications with perpendicular   magnetic anisotropy

Liu Huanlong

10658581

Semiconductor device structure with   multiple resistance variable layers

Trinh Hai-Dang

10658975

Semiconductor device and method

Cho Lan-Chou

10659057

Compensation technique for the nonlinear   behavior of digitally-controlled oscillator (DCO) gain

Li Chao Chieh

10659092

Channel loss compensation circuits

Cho Lan-Chou

10661408

Platen stopper

Han Yu-Feng

10663512

Testing of semiconductor chips with   microbumps

Wu Wei-Cheng

10663633

Aperture design and methods thereof

Hsieh Hung-Chih

10663865

Photoresist recycling apparatus

Lin Chia-Ren

10663868

Method and apparatus for dynamic   lithographic exposure

Yu Jun-Yih

10663871

Reticle stage and method for using the same

Lee Chia-Yu

10664565

Method and system of expanding set of   standard cells which comprise a library

Liu Chi-Lin

10664639

Cell layout and structure

Hsieh Tung-Heng

10664641

Integrated device and method of forming the   same

Biswas Hiranmay

10665321

Method for testing MRAM device and test   apparatus thereof

Wang Chia-Yu

10665380

Compact vertical inductors extending in   vertical planes

Yen Hsiao-Tsung

10665449

Integrate rinse module in hybrid bonding   platform

Huang Xin-Hua

10665455

Method (and related apparatus) that reduces   cycle time for forming large field integrated circuits

Lu Wen-Chen

10665456

Semiconductor structure

Chou Shih-Pei

10665457

Method of forming an integrated circuit   using a patterned mask layer

Hsieh Tzu-Yen

10665466

Method for forming semiconductor device   structure

Liao Keng-Ying

10665467

Spacer etching process for integrated   circuit design

Liu Ru-Gun

10665468

Multi-chip structure and method of forming   same

Yu Chen-Hua

10665473

Package structure and method of fabricating   the same

Lin Chia-Hsiang

10665474

3D packages and methods for forming the   same

Chiu Tzu-Wei

10665489

Integrated chip die carrier exchanger

Lee Chien-Fa

10665506

Semiconductor device with reduced via   bridging risk

Tseng Szu-Wei

10665507

Automated transfer and drying tool for   process chamber

Kuo Tsung-Sheng

10665510

Spacer structure and manufacturing method   thereof

Kalnitsky Alexander

10665513

Fin field-effect transistor device and   method

Chang Ming-Ching

10665520

Integrated circuit package and method

Chen Chien-Hsun

10665521

Planar passivation layers

Wang Po-Shu

10665536

3D IC Decoupling capacitor structure and   method for manufacturing the same

Liao Wen-Shiang

10665537

Package structure and manufacturing method   thereof

Hwang Chien-Ling

10665539

Semiconductor device with patterned ground   shielding

Yen Hsiao-Tsung

10665545

Semiconductor devices, semiconductor   packages and methods of forming the same

Liao Sih-Hao

10665550

Electromagnetic shielding   metal-insulator-metal capacitor structure

Lee Hui Yu

10665554

Magnetic structure for transmission lines   in a package system

Liao Wen-Shiang

10665556

Semiconductor structure having a composite   barrier layer

Wu Chun-Yu

10665559

Device, semiconductor package and method of   manufacturing semiconductor package

Hsu Chia-Kuei

10665560

Optical semiconductor package and method   for manufacturing the same

Wang Chuei-Tang

10665565

Package assembly

Lin Hung-Jen

10665569

Vertical transistor device and method for   fabricating the same

Yun Wei-Sheng

10665572

Semiconductor package and manufacturing   method thereof

Chen Jie

10665582

Method of manufacturing semiconductor   package structure

Chen Yi-Hsiu

10665585

Structure and method for alignment marks

Wen Ming-Chang

10665595

Metal isolation testing in the context of   memory cells

Chiu Te-Hsin

10665600

Memory devices and method of fabricating   same

Wu Chang-Ming

10665602

Method of manufacturing a semiconductor   device and a semiconductor device

Wu Yun-Chi

10665627

Image sensor device and method for forming   the image sensor device having a first lens and a second lens over the first   lens

Hsu Shih-Hsun

10665673

Integrated circuit structure with non-gated   well tap cell

Lin Jiefeng

10665674

FinFET semiconductor device with germanium   diffusion over silicon fins

Lee Yi-Jing

10665685

Semiconductor device and fabrication method   thereof

Lin Cheng-Ming

10665686

Gate feature in finFET device

Shen Guan-Jie

10665691

Semiconductor structure

Ching Kuo-Cheng

10665693

Semiconductor structure and manufacturing   method thereof

Tsai Chun-Hsiung

10665696

Method for non-resist nanolithography

Chen Miin-Jang

10665697

Semiconductor device and method

Chan Chia-Ling

10665700

Semiconductor device and method

Young Bo-Feng

10665717

Semiconductor device and FinFET device

Tsai Chun Hsiung

10665718

Wrap Around Silicide for FinFETs

Chiang Kuo-Cheng

10665719

FinFET device with asymmetrical   drain/source feature

Lo Wei-Yang

10665726

Memory device and operation method thereof

Yang Tsung-Yu

10665727

Semiconductor structure and manufacturing   method of the same

Lo Wen-Shun

10665773

Nitride capping layer for spin torque   transfer (STT)-magnetoresistive random access memory (MRAM)

Iwata Jodi Mari

10666267

Segmentation superposition technique for   binary error compensation

Li Chao Chieh

10666438

Balanced coupling structure for physically   unclonable function (PUF) application

Tsai Jui-Che

10666578

Network-on-chip system and a method of   generating the same

Venugopalan Ravi

10668511

Method of cleaning process chamber

Lee Tsung-Lin

10668592

Method of planarizing a wafer

Lee Bo-I

10669625

Pumping liner for chemical vapor deposition

Liu Cheng-Hsiung

10670540

Photolithography method and   photolithography system

Liao Chi-Hung

10670641

Semiconductor test device and manufacturing   method thereof

Peng Cheng-Yi

10670654

Probe card and wafer testing system and   wafer testing method

Wu Yuan-Chun

10670956

Photomask having a plurality of shielding   layers

Tu Chih-Chiang

10670959

Pellicle and method of using the same

Yoo Chue San

10670970

Lithography system and method thereof

Cheng Wei-Shin

10671052

Synchronized parallel tile computation for   large area lithography simulation

Beylkin Daniel

10671786

Method of modeling a mask by taking into   account of mask pattern edge interaction

Lai Chien-Jen

10671788

Method, system, and storage medium of   resource planning for designing semiconductor device

Lin Yen-Hung

10671789

Integrated circuit and layout method

Liu Jack

10672460

Dual port SRAM cell with dummy transistors

Liaw Jhon Jhy

10672494

Systems and methods to test a memory device

Lu Shih-Lien Linus

10672610

Grafting design for pattern post-treatment   in semiconductor manufacturing

Wang Siao-Shan

10672613

Method of forming semiconductor structure   and semiconductor device

Jang Shu-Uei

10672614

Etching and structures formed thereby

Huang Kuan-Wei

10672619

Material composition and methods thereof

Wang Siao-Shan

10672631

Method and system for substrate thinning

Mao Yi-Chao

10672639

Method for automatic sending cassette pod

Kuo Tsung-Sheng

10672647

Wafer level chip scale packaging   intermediate structure apparatus and method

Yu Chen-Hua

10672651

Method for forming structure of dual   damascene structures having via hole and trench

Peng Tai-Yen

10672652

Gradient atomic layer deposition

Kuo Chia-Pang

10672656

Method of semiconductor integrated circuit   fabrication

Shieh Ming-Feng

10672665

Fin field effect transistor device   structure and method for forming the same

Chang Shang-Wen

10672667

Semiconductor device and method

Cheng Chao-Ching

10672674

Method of forming semiconductor device   package having testing pads on a topmost die

Yu Chen-Hua

10672681

Semiconductor packages

Lin Chien-Chang

10672704

Semiconductor device with polygonal   inductive device

Chen Wen-Sheng

10672708

Standard-cell layout structure with horn   power and smart metal cut

Fan Ni-Wan

10672709

Power grid, IC and method for placing power   grid

Biswas Hiranmay

10672723

Semiconductor package

Lin Jing-Cheng

10672728

Integrated fan-out package

Wang Chuei-Tang

10672729

Package structure and method of forming   package structure

Tai Chih-Hsuan

10672734

Package structures and methods of forming   the same

Huang Li-Hsien

10672737

Three-dimensional integrated circuit   structure and method of manufacturing the same

Chen Yi-Hsiu

10672738

Package structures and methods of forming

Yu Chen-Hua

10672741

Semiconductor packages with   thermal-electrical-mechanical chips and methods of forming the same

Yu Chen-Hua

10672742

Semiconductor device and manufacturing   method thereof

Wu Zhi-Qiang

10672751

Contoured package-on-package joint

Wu Jiun Yi

10672752

Semiconductor package and manufacturing   method thereof

Cheng Li-Hui

10672754

Semiconductor component, package structure   and manufacturing method thereof

Chen Ming-Fa

10672760

Semiconductor die

Chuang Harry-Hak-Lay

10672769

Method of fabricating a transistor having a   drain pad with capping and silicide layers

Chang Chia-Hao

10672770

Semiconductor structure

Liaw Jhon-Jhy

10672775

Semiconductor device having strap cell

Lo Kuo-Hung

10672776

Memory circuit having resistive device   coupled with supply voltage line

Chen Yen-Huei

10672777

Method of manufacturing semiconductor   device having multi-height structure

Su Kuan-Wei

10672783

Integrated circuit and method for   manufacturing the same

Wu Yun-Chi

10672795

Bulk semiconductor substrate configured to   exhibit semiconductor-on-insulator behavior

Singh Gulbagh

10672796

Mechanisms for forming FINFET device

Chang Che-Cheng

10672810

CMOS image sensor with shallow trench edge   doping

Lee Yueh-Chuan

10672812

Image sensor

Chiang Wei-Chieh

10672819

Mechanisms for forming image-sensor device   with deep-trench isolation structure

Lin Jeng-Shyan

10672820

Hybrid bonded structure

Tsai Bo-Tsung

10672824

Image sensor

Tsai Bo-Tsung

10672832

Magnetic detection circuit, MRAM and   operation method thereof

Ying Ji-Feng

10672860

Multi-terminal inductor for integrated   circuit

Hsu Ching-Chung

10672866

Seamless gap fill

Huang Yen-Chun

10672867

Semiconductor structure and manufacturing   method thereof

Wang Tai-Yuan

10672870

Semiconductor device and manufacturing   method thereof

Chen Lung

10672871

High surface dopant concentration formation   processes and structures formed thereby

Chen Chia-Cheng

10672873

Semiconductor device and method of   fabricating the same

Chen Chia-Chung

10672879

Method for forming FinFET and   gate-all-around FET with selective high-K oxide deposition

Tsai Tsung-Han

10672886

Structure and method for high-k metal gate

More Shahaji B.

10672889

Semiconductor device and manufacturing   method thereof

Vellianitis Georgios

10672892

Self-aligned epitaxy layer

Ching Kuo-Cheng

10672893

Method of making semiconductor device   comprising flash memory and resulting device

Lin Chien-Hung

10672899

Tunnel field-effect transistor with reduced   trap-assisted tunneling leakage

Vasen Timothy

10672904

Power MOSFETs and methods for manufacturing   the same

Yadav Yogendra

10672908

Fin field effect transistor

Chang Che-Cheng

10672909

Strained gate semiconductor device having   an interlayer dielectric doped with oxygen and a large species material

Wu Cheng-Ta

10672925

Thin film solar cell and method of forming   same

Chiang Chi-Yu

10672934

SPAD image sensor and associated   fabricating method

Wang Tzu-Jui

10672969

Thermocouple device

Tsai Ming-Hsien

10672975

Magnetic tunnel junction with reduced   damage

Diaz Carlos H.

10673394

Power amplifier

Jin Jun-De

10673437

Level shifting circuit and method

Chern Chan-Hong

10673603

Integrated circuit with radio frequency   interconnect

Chen Huan-Neng

10675732

Apparatus and method for CMP pad   conditioning

Chen ChunHung

10676343

Multi-layer sealing film for high seal   yield

Yang Chih-Chien

10676351

Nano-electromechanical system (NEMS) device   structure and method for forming the same

Chen Hsin-Ping

10676668

Wet etch chemistry for selective silicon   etch

Yang Neng-Jye

10678126

Semiconductor mask blanks with a compatible   stop layer

Tu Chih-Chiang

10678133

Method for forming photoresist layer

Liao Chi-Hung

10678138

Extreme ultraviolet (EUV) radiation source   and a method for generating extreme ultraviolet radiation

Yen Wei-Chun

10678142

Optical proximity correction and photomasks

Jheng Dong-Yo

10678146

Particle removal from wafer table and   photomask

Wu Min-Cheng

10678148

Lithography system and lithography method

Chang Kai-Chieh

10678973

Machine-learning design enablement platform

Chuang Yi-Lin

10678977

Semiconductor device having engineering   change order (ECO) cells

Chiu Mao-Wei

10678982

System, method and associated computer   readable medium for designing integrated circuit with pre-layout RC   information

Chen Chin-Sheng

10678987

Cell layout method and system for creating   stacked 3D integrated circuit having two tiers

Chen Sheng-Hsiung

10678989

Method and system for sigma-based timing   optimization

Chen Yen-Pin

10678990

Techniques based on electromigration   characteristics of cell interconnect

Yang Kuo-Nan

10679693

SRAM array

Liaw Jhon-Jhy

10679820

Inspection method for wafer or DUT

Niu Bao-Hua

10679846

System and method of forming a porous low-K   structure

Lin Bo-Jiun

10679856

Fin field effect transistor (FinFET) device   structure with insulating structure over fin isolation structure and method   for forming the same

Yu Jia-Ni

10679859

Atomic layer deposition based process for   contact barrier layer

Cheng Chung-Liang

10679863

Method for forming semiconductor device   structure with fine line pitch and fine end-to-end space

Chen Hung-Hao

10679866

Interconnect structure for semiconductor   package and method of fabricating the interconnect structure

Hwang Chien-Ling

10679877

Carrier tape system and methods of using   carrier tape system

Liao Tsung-Jen

10679889

Method for manufacturing semiconductor   structure

Tsai Yu-Hsiang

10679891

Methods of forming interconnect structures   using a vacuum environment

Tsai Chia-Ching

10679895

Interconnect structure and method of   forming the same

Chen Jeng-Shiou

10679896

Contact structure for semiconductor device

Hsieh Yun-Yu

10679900

Fin spacer protected source and drain   regions in FinFETs

Chiang Kuo-Cheng

10679915

Package structure and manufacturing method   thereof

Hsieh Ping-Yin

10679936