第三方供应商发展到具备了半导体结构的专业知识，并且作为技术改进的及关键部分生产设备的供应商出现。

 在半导体工业发展的第一个十年，行业推行了5种基本结构的晶体管：点接触式晶体管、生长结式晶体管、合金结式晶体管、表面势垒式晶体管和扩散底层式晶体管。 制造商架构起他们自己的生产设施设备投入到每一代产品的制造中。杰克·基尔比（1958年里程碑式人物）注意到说：“可能我们用到的设备的最贵的那一部分要花费至少1万美金。由于产品通过平面法（1959年的里程碑）向大型化发展，因此出现了产业的和独立的设备制造商，从而将工艺技术也标准化了。制造商专门研究了前端（晶圆加工）和后端（封装、组配和测试）（1961年的里程碑）的生产运行。 前端的生产设备，随着晶圆尺寸从1958年的0.5英寸增大到今天的12英寸（300mm），其价格也呈数量级增长。早期的前端的生产设备配套供应商包括赛默公司（扩散熔炉）和它旗下的日本电子有限公司、DW工业（沉积系统），以及GCA Mann和铂金埃尔默公司（光刻设备）（1955年的里程碑）。伊智公司，1961年费雅嘉分拆出的一个子公司，生产建造了用于晶圆测试的探测设备。 瓦里安公司建造了蒸发器、真空泵和离子注入系统。成立于1967年，为制造外延薄膜（1960年的里程碑）提供化学气相沉积系统的应用材料公司，通过鼓励半导体供应商将其对制造工艺开发发展工作转交给他们的设备供应商，从而给行业动向带来了改变。 技术工艺的第三方资源，使半导体公司得以关注产品的体系结构及应用，而不再关注于生产和制造工艺的专业知识。这就造成了晶圆代工工厂的兴起，在19世纪80年代，这些工厂支持了作为新类型的无晶半导体公司的发展。

译者：哈尔滨工业大学（威海）电子封装 090840214葛峰
校对：哈尔滨工业大学（威海）电子封装 090840215申聪敏

原文：http://www.computerhistory.org/semiconductor/timeline/1967-Equipment.html

版权 copyright by www.computerhistory.org

1967 - Turnkey Equipment Suppliers Change Industry Dynamics

Third-party vendors develop specialized knowledge of semiconductor fabrication and emerge as vendors of process technology and turnkey manufacturing facilities.

During its first decade the semiconductor industry went through five basic transistor structures: point contact, grown junction,         alloyed junction, surface barrier, and diffused-base. Manufacturers built their own equipment to support each generation. Jack Kilby (1958 Milestone) noted that "probably the most expensive piece of equipment that we used cost less than $10,000." As production moved to high volumes with the planar process (1959 Milestone), techniques were standardized across the industry and independent equipment producers emerged. Vendors specialized in "Front End" (wafer processing) or “Back End” (package, assembly, and test) (1961 Milestone) operations. Front-end equipment prices increased by orders of magnitude as wafer diameters grew from 0.5 inches in 1958 to today’s 12 inches (300mm). Early front-end tool suppliers include Thermco (diffusion furnaces) and its Japanese licensee Tokyo Electron Ltd, DW Industries (deposition systems), and GCA/Mann and Perkin Elmer (photolithography) (1955 Milestone).Electroglas, a 1961 Fairchild spinout, built probe equipment for wafer testing. In 1965 Kulicke & Soffa introduced commercial contact aligners. Varian Associates built evaporators, vacuum pumps, and ion-implantation systems. Founded in 1967 to supply chemical vapor deposition systems for epitaxial films (1960 Milestone), Applied Materials initiated a change in industry dynamics by encouraging semiconductor vendors to shift responsibility for development of manufacturing technology to their equipment suppliers.Third-party sources of technology allowed the semiconductor companies to focus on product architecture and applications rather than process and manufacturing expertise. This led to the rise of "wafer-foundry" vendors who supported a new breed of "fabless" semiconductor companies in the 1980.

Michael McNeilly & Walter Benzing pioneered epitaxial deposition equipment at Applied Materials, Inc.（应用材料公司倡导外延沉积设备的先驱——迈克尔·麦克尼尔，沃尔特·本辛）

Credit: Semiconductor Equipment and Materials International (SEMI)

Applied Materials Model AMV 800 chemical vapor deposition epitaxial reactor (1969)（应用材料公司化学气相沉积外延反应设备AMV 800模型）

Credit: Applied Materials Technology, Inc

Electroglas Model 131B Motorized/Manual Prober allowed testing of die on the wafer before packaging（伊智公司的用于测试封装前晶圆上芯片的自动/手动探测器131B模型）

Credit: Electroglas, Inc

Perkin Elmer Micralign projection mask aligner team 1973（1973年铂金埃尔默公司的Micralign投射掩膜对准器团队）

Credit: Semiconductor Equipment and Materials International (SEMI)